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1. 发明申请

US20110318997A1 APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD 审中-公开
标题翻译：用于调节抛光垫的装置和方法
公开(公告)号：US20110318997A1
公开(公告)日：2011-12-29
申请号：US13164733
申请日：2011-06-20
申请人： Roy C. Nangoy , Shou-Sung Chang , Donald J. K. Olgado , Hung Chih Chen , Gerald John Alonzo
发明人： Roy C. Nangoy , Shou-Sung Chang , Donald J. K. Olgado , Hung Chih Chen , Gerald John Alonzo
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B24B53/005 , B24B53/12
摘要： Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed.
摘要翻译：用于调理抛光垫的装置和方法包括适于支撑调节盘的臂; 联接到所述臂的驱动机构; 以及驱动机构和调节盘之间的柔性联接件，其适于允许调节盘在将驱动机构的旋转运动传递到调节盘的同时倾斜。公开了许多其他方面。

2. 发明申请

US20100093263A1 APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD 有权
标题翻译：用于调节抛光垫的装置和方法
公开(公告)号：US20100093263A1
公开(公告)日：2010-04-15
申请号：US12636326
申请日：2009-12-11
申请人： Roy C. Nangoy , Shou-Sung Chang , Donald J. K. Olgado , Hung Chih Chen , Gerald John Alonzo
发明人： Roy C. Nangoy , Shou-Sung Chang , Donald J. K. Olgado , Hung Chih Chen , Gerald John Alonzo
IPC分类号： B24B53/02
CPC分类号： B24B53/017 , B24B53/005 , B24B53/12
摘要： Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed.
摘要翻译：用于调理抛光垫的装置和方法包括适于支撑调节盘的臂; 联接到所述臂的驱动机构; 以及驱动机构和调节盘之间的柔性联接件，其适于允许调节盘在将驱动机构的旋转运动传递到调节盘的同时倾斜。公开了许多其他方面。

3. 发明授权

US07963826B2 Apparatus and methods for conditioning a polishing pad 有权
标题翻译：用于调理抛光垫的装置和方法
公开(公告)号：US07963826B2
公开(公告)日：2011-06-21
申请号：US12636326
申请日：2009-12-11
申请人： Roy C. Nangoy , Shou-Sung Chang , Donald J. K. Olgado , Hung Chih Chen , Gerald John Alonzo
发明人： Roy C. Nangoy , Shou-Sung Chang , Donald J. K. Olgado , Hung Chih Chen , Gerald John Alonzo
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B24B53/005 , B24B53/12
摘要： Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed.
摘要翻译：用于调理抛光垫的装置和方法包括适于支撑调节盘的臂; 联接到所述臂的驱动机构; 以及驱动机构和调节盘之间的柔性联接件，其适于允许调节盘在将驱动机构的旋转运动传递到调节盘的同时倾斜。公开了许多其他方面。

4. 发明授权

US07137868B2 Pad assembly for electrochemical mechanical processing 有权
公开(公告)号：US07137868B2
公开(公告)日：2006-11-21
申请号：US11369065
申请日：2006-03-06
申请人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

5. 发明授权

US07029365B2 Pad assembly for electrochemical mechanical processing 失效
公开(公告)号：US07029365B2
公开(公告)日：2006-04-18
申请号：US10744904
申请日：2003-12-23
申请人： Shou-Sung Chang , Stan D Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

6. 发明授权

US07678245B2 Method and apparatus for electrochemical mechanical processing 失效
标题翻译：电化学机械加工的方法和装置
公开(公告)号：US07678245B2
公开(公告)日：2010-03-16
申请号：US10880752
申请日：2004-06-30
申请人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
发明人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
IPC分类号： C25B9/00
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/16 , B24B49/16 , B24B53/017 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。残余处理单元包括偏置的导电平面化表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

7. 发明授权

US07285036B2 Pad assembly for electrochemical mechanical polishing 有权
标题翻译：焊接组件用于电化学机械抛光
公开(公告)号：US07285036B2
公开(公告)日：2007-10-23
申请号：US11562320
申请日：2006-11-21
申请人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下方的电极，以及具有设置在处理层的工作表面下方和下方的上表面的电极。电极的上表面通过多个孔至少部分地暴露于工作表面，以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。

8. 发明授权

US07988535B2 Platen exhaust for chemical mechanical polishing system 有权
标题翻译：压板排气用于化学机械抛光系统
公开(公告)号：US07988535B2
公开(公告)日：2011-08-02
申请号：US12105924
申请日：2008-04-18
申请人： Hung Chih Chen , Allen L. D'Ambra , Donald J. K. Olgado
发明人： Hung Chih Chen , Allen L. D'Ambra , Donald J. K. Olgado
IPC分类号： B24B7/22 , B24B55/12
CPC分类号： B24B37/04 , B08B15/04 , B24B55/12
摘要： The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.
摘要翻译：本发明一般涉及基片转印系统。特别地，本发明涉及有效地除去在抛光过程中产生的化学烟雾，蒸气和其它副产物的装置和方法。本发明的一个实施例提供了一种用于抛光衬底的装置，包括具有抛光表面的压板，所述抛光表面被配置为通过在相对于衬底移动的同时使衬底接触而抛光衬底;抛光头，其构造成支撑衬底并将衬底定位为在抛光期间与抛光表面接触，配置成在研磨表面上分配抛光溶液的溶液喷嘴以及被配置为去除在抛光期间产生的烟雾，蒸气和其它副产物的排气组件。

9. 发明授权

US08449950B2 In-situ deposition of battery active lithium materials by plasma spraying 有权
标题翻译：通过等离子喷涂原位沉积电池活性锂材料
公开(公告)号：US08449950B2
公开(公告)日：2013-05-28
申请号：US12862244
申请日：2010-08-24
申请人： Quanyuan Shang , Lu Yang , Karl M. Brown , Donald J. K. Olgado , Victor Pebenito , Hooman Bolandi , Tetsuya Ishikawa , Robert Z. Bachrach , Liang-Yuh Chen
发明人： Quanyuan Shang , Lu Yang , Karl M. Brown , Donald J. K. Olgado , Victor Pebenito , Hooman Bolandi , Tetsuya Ishikawa , Robert Z. Bachrach , Liang-Yuh Chen
IPC分类号： C23C4/06 , C23C4/08 , B05D3/00 , B05D3/14 , H05H1/24
CPC分类号： H01M4/0419 , H01M4/1391
摘要： A method and apparatus for forming an electrochemical layer of a thin film battery is provided. A precursor mixture comprising precursor particles dispersed in a carrying medium is activated in an activation chamber by application of an electric field to ionize at least a portion of the precursor mixture. The activated precursor mixture is then mixed with a combustible gas mixture to add thermal energy to the precursor particles, converting them to nanocrystals, which deposit on a substrate. A second precursor may be blended with the nanocrystals as they deposit on the surface to enhance adhesion and conductivity.
摘要翻译：提供一种用于形成薄膜电池的电化学层的方法和装置。包含分散在携带介质中的前体颗粒的前体混合物通过施加电场在活化室中活化，以电离至少一部分前体混合物。然后将活化的前体混合物与可燃气体混合物混合，以向前体颗粒添加热能，将其转化成沉积在基材上的纳米晶体。当第二前体沉积在表面上以增强粘附性和导电性时，可与纳米晶体共混。

10. 发明授权

US07114693B1 Stable cell platform 失效
标题翻译：稳定的细胞平台
公开(公告)号：US07114693B1
公开(公告)日：2006-10-03
申请号：US09676362
申请日：2000-09-29
申请人： Donald J. K. Olgado , Timothy J. Franklin , Avi Tepman
发明人： Donald J. K. Olgado , Timothy J. Franklin , Avi Tepman
IPC分类号： F16M13/00
CPC分类号： H01L21/67126 , C25D7/12 , G05B2219/40351 , G05B2219/41457 , H01L21/2885 , H01L21/67051 , H01L21/67742 , H01L21/68707 , H05K3/241
摘要： A stable platform supports a cell, the stable platform comprises a lower mainframe, an upper mainframe, and a dampener system. The upper mainframe includes a plurality of recesses. Each recess is configured to receive a cell. The dampener system connects the lower mainframe to the upper mainframe. In one embodiment, the dampener system comprises a dampener element, such as sand, to dampen vibrations between the lower mainframe and the lower mainframe.
摘要翻译：稳定的平台支持电池，稳定的平台包括下主机，上主机和减振器系统。上主机包括多个凹槽。每个凹槽被配置成接收单元。阻尼器系统将下主机连接到上主机。在一个实施例中，阻尼器系统包括阻尼器元件，例如沙子，以阻尼下主机和下主机之间的振动。

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