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1. 发明授权

US07029365B2 Pad assembly for electrochemical mechanical processing 失效
公开(公告)号：US07029365B2
公开(公告)日：2006-04-18
申请号：US10744904
申请日：2003-12-23
申请人： Shou-Sung Chang , Stan D Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

2. 发明授权

US07137868B2 Pad assembly for electrochemical mechanical processing 有权
公开(公告)号：US07137868B2
公开(公告)日：2006-11-21
申请号：US11369065
申请日：2006-03-06
申请人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

3. 发明授权

US07678245B2 Method and apparatus for electrochemical mechanical processing 失效
标题翻译：电化学机械加工的方法和装置
公开(公告)号：US07678245B2
公开(公告)日：2010-03-16
申请号：US10880752
申请日：2004-06-30
申请人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
发明人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
IPC分类号： C25B9/00
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/16 , B24B49/16 , B24B53/017 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。残余处理单元包括偏置的导电平面化表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

4. 发明授权

US07285036B2 Pad assembly for electrochemical mechanical polishing 有权
标题翻译：焊接组件用于电化学机械抛光
公开(公告)号：US07285036B2
公开(公告)日：2007-10-23
申请号：US11562320
申请日：2006-11-21
申请人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下方的电极，以及具有设置在处理层的工作表面下方和下方的上表面的电极。电极的上表面通过多个孔至少部分地暴露于工作表面，以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。

5. 发明授权

US07290976B2 Semiconductor substrate processing apparatus with a passive substrate gripper 失效
标题翻译：具有被动衬底夹持器的半导体衬底处理设备
公开(公告)号：US07290976B2
公开(公告)日：2007-11-06
申请号：US11168225
申请日：2005-06-28
申请人： Ralph M. Wadensweiler , Rick R. Endo , Alexander S. Ko
发明人： Ralph M. Wadensweiler , Rick R. Endo , Alexander S. Ko
IPC分类号： B25J15/00
CPC分类号： H01L21/68707 , H01L21/67057 , H01L21/67173 , H01L21/67178
摘要： According to one aspect of the present invention, a passive substrate gripper, including first and second segments, is provided. The second segment may be connected to the first segment, and the first and second segments may jointly form a substrate support. The substrate support may be shaped to support a substrate in first position within the substrate support when the substrate support is in a first angular orientation. The substrate may be removable from substrate support in a first direction when in the first position. The substrate may move into a second position when the substrate support is moved into a second angular orientation. The substrate may not be removable in the first direction when in the second position within the substrate support. The passive substrate gripper may also include a support ledge extending from opposing inner surfaces of the first and second segments, on which the substrate is supported.
摘要翻译：根据本发明的一个方面，提供了包括第一和第二段的无源基板夹持器。第二段可以连接到第一段，并且第一和第二段可以共同形成衬底支撑。衬底支撑件可以被成形为当衬底支撑件处于第一角度定向时将衬底支撑在衬底支撑件内的第一位置。当处于第一位置时，衬底可以沿着第一方向从衬底支撑件移除。当衬底支撑件移动到第二角度取向时，衬底可以移动到第二位置。当衬底支撑件内的第二位置时，衬底可能不能沿第一方向移动。无源基板夹持器还可以包括从第一和第二段的相对内表面延伸的支撑凸缘，其上支撑基板。

6. 发明授权

US06459382B1 Over clamp sensor 失效
标题翻译：过夹式传感器
公开(公告)号：US06459382B1
公开(公告)日：2002-10-01
申请号：US09843505
申请日：2001-04-26
申请人： Ralph M. Wadensweiler
发明人： Ralph M. Wadensweiler
IPC分类号： G08B2100
CPC分类号： H01L21/67259
摘要： A substrate support is provided that comprises a sensing system configured to detect when a moveable end effector is in an over clamp position. The sensing system may comprise various sensors such as an inductive sensor, a light emitter and a detector, and a pressure sensor, etc. Use of such an over clamp sensor may prevent substrate damage that results from improper substrate gripping.
摘要翻译：提供了一种基板支撑件，其包括被配置为检测何时可移动的末端执行器处于过夹紧位置的感测系统。感测系统可以包括诸如感应传感器，发光器和检测器以及压力传感器等的各种传感器。这种过夹紧传感器的使用可以防止由于不适当的衬底夹持而导致的衬底损坏。

7. 发明授权

US5978202A Electrostatic chuck having a thermal transfer regulator pad 失效
标题翻译：静电吸盘具有热转印调节垫
公开(公告)号：US5978202A
公开(公告)日：1999-11-02
申请号：US883994
申请日：1997-06-27
申请人： Ralph M. Wadensweiler , Ajay Kumar , Shashank C. Deshmukh , Weinan Jiang , Rolf A. Guenther
发明人： Ralph M. Wadensweiler , Ajay Kumar , Shashank C. Deshmukh , Weinan Jiang , Rolf A. Guenther
IPC分类号： B23Q3/15 , H01L21/683 , H02N13/00
CPC分类号： H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck 75 for holding a substrate 25 in a process chamber 20, comprises an electrostatic member 80 including an insulator having an electrode 95 therein and a receiving surface for receiving the substrate. A base 85 supports the electrostatic member, the base having a first thermal resistance R.sub.B and having a lower surface that rests on the process chamber. A thermal transfer regulator pad 100 is positioned between the receiving surface of the electrostatic member and the lower surface of the base, the thermal pad comprising a second thermal resistance R.sub.P that is sufficiently higher or lower than the thermal resistance R.sub.B of the base, to provide a predetermined temperature profile across a processing surface of the substrate during processing in the chamber.
摘要翻译：用于将基板25保持在处理室20中的静电卡盘75包括静电构件80，静电构件80包括其中具有电极95的绝缘体和用于接收基板的接收表面。基座85支撑静电部件，底座具有第一热阻RB并且具有搁置在处理室上的下表面。热传递调节器垫100定位在静电部件的接收表面和基部的下表面之间，热垫包括足够高于或低于基部的热阻RB的第二热阻RP，以提供在腔室中处理期间在衬底的处理表面上的预定温度分布。

8. 发明授权

US07134948B2 Magnetically secured retaining ring 失效
标题翻译：磁性固定保持环
公开(公告)号：US07134948B2
公开(公告)日：2006-11-14
申请号：US11316413
申请日：2005-12-21
申请人： Ming-Kuei Tseng , Ralph M. Wadensweiler
发明人： Ming-Kuei Tseng , Ralph M. Wadensweiler
IPC分类号： B24B5/00
CPC分类号： B24B37/32
摘要： A retaining ring having a bottom portion that is removable from the ring's upper portion is described. The upper and lower portions of the retaining ring include one or more magnetic bodies and/or one or more bodies formed of a material that is attracted to magnets.
摘要翻译：描述了具有可从环的上部移除的底部的保持环。保持环的上部和下部包括一个或多个磁体和/或由吸附到磁体的材料形成的一个或多个主体。

9. 发明授权

US07427340B2 Conductive pad 失效
标题翻译：导电垫
公开(公告)号：US07427340B2
公开(公告)日：2008-09-23
申请号：US11102557
申请日：2005-04-08
申请人： Rashid A. Mavliev , Ralph M. Wadensweiler
发明人： Rashid A. Mavliev , Ralph M. Wadensweiler
IPC分类号： C25B9/12
CPC分类号： B24B37/26 , B24B37/22 , C25D17/14
摘要： A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface of a substrate and define channels therebetween. The conductive processing pad may have lower features made of a conductive composite that extend into the sub-pad from the conductive carrier. The conductive processing pad is adhered to a sub-pad bound to an opposing conductive layer and the opposing conductive layer bound to a platen assembly.
摘要翻译：公开了一种用于抛光衬底的处理垫组件的方法和装置。处理垫组件具有导电处理垫，该导电处理垫具有多个凸起特征，该特征由设置在导电载体上的导电复合材料制成。升高的特征适于抛光衬底的特征表面并且在它们之间限定通道。导电处理垫可以具有由导电复合材料制成的较低特征，导电复合材料从导电载体延伸到子焊盘中。导电处理垫粘附到与相对的导电层结合的子焊盘，并且相对的导电层与压板组件结合。

10. 发明申请

US20060030156A1 Abrasive conductive polishing article for electrochemical mechanical polishing 审中-公开
标题翻译：用于电化学机械抛光的磨料导电抛光制品
公开(公告)号：US20060030156A1
公开(公告)日：2006-02-09
申请号：US11194432
申请日：2005-08-01
申请人： Paul D. Butterfield , Ralph M. Wadensweiler
发明人： Paul D. Butterfield , Ralph M. Wadensweiler
IPC分类号： H01L21/302 , B24B29/00
CPC分类号： B24B37/245 , B23H5/08 , B24B37/046 , C25F7/00
摘要： Articles of manufacture and processes for planarizing a layer on a substrate are provided. In one aspect, a process is provided for manufacturing a polishing article comprising combining a conductive material component and components of a binder material to form a composite material, at least partially curing the composite material, and introducing abrasive particles of about 0.01 inches or greater in diameter to form an abrasive-containing composite material.
摘要翻译：提供了用于平坦化衬底上的层的制造和工艺。在一个方面，提供了一种用于制造抛光制品的方法，包括将导电材料组分和粘合剂材料的组分结合以形成复合材料，至少部分固化复合材料，并将约0.01英寸或更大的磨料颗粒引入直径以形成含磨料的复合材料。

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