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1. 发明申请

US20090078292A1 SINGLE WAFER METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR SUBSTRATES USING AN INERT GAS AIR-KNIFE 审中-公开
标题翻译：使用惰性气体空气干燥半导体基板的单波长方法和装置
公开(公告)号：US20090078292A1
公开(公告)日：2009-03-26
申请号：US12249960
申请日：2008-10-12
申请人： Nathan D. Stein , Younes Achkire , Timothy J. Franklin , Julia Svirchevski , Dan A. Marohl
发明人： Nathan D. Stein , Younes Achkire , Timothy J. Franklin , Julia Svirchevski , Dan A. Marohl
IPC分类号： B08B13/00
CPC分类号： H01L21/67034
摘要： In one aspect, an apparatus is provided. The apparatus comprises a chamber; a plurality of rollers adapted to support a wafer in a vertical orientation within a chamber; a pair of brushes adapted to scrub a first and a second side of the wafer respectively; a first spray bar adapted to spray a liquid on the wafer to form a meniscus on the wafer as the wafer is lifted out of the chamber; and a second spray bar adapted to direct a vapor to the meniscus, the vapor being adapted to lower a surface tension of the liquid at the meniscus to perform Marangoni drying of the wafer as the wafer is lifted out of the chamber. Numerous other aspects are provided.
摘要翻译：一方面，提供了一种装置。该装置包括一个室; 适于在腔室内以垂直取向支撑晶片的多个辊; 一对刷子，分别用于擦拭所述晶片的第一和第二侧; 第一喷杆，当晶片被提升出室时，适于在晶片上喷射液体以在晶片上形成弯月面; 以及适于将蒸汽引导到弯液面的第二喷杆，所述蒸汽适于降低所述弯液面处的液体的表面张力，以在所述晶片被提升到所述腔室之后执行所述晶片的马兰戈尼干燥。提供了许多其他方面。

2. 发明授权

US07114693B1 Stable cell platform 失效
标题翻译：稳定的细胞平台
公开(公告)号：US07114693B1
公开(公告)日：2006-10-03
申请号：US09676362
申请日：2000-09-29
申请人： Donald J. K. Olgado , Timothy J. Franklin , Avi Tepman
发明人： Donald J. K. Olgado , Timothy J. Franklin , Avi Tepman
IPC分类号： F16M13/00
CPC分类号： H01L21/67126 , C25D7/12 , G05B2219/40351 , G05B2219/41457 , H01L21/2885 , H01L21/67051 , H01L21/67742 , H01L21/68707 , H05K3/241
摘要： A stable platform supports a cell, the stable platform comprises a lower mainframe, an upper mainframe, and a dampener system. The upper mainframe includes a plurality of recesses. Each recess is configured to receive a cell. The dampener system connects the lower mainframe to the upper mainframe. In one embodiment, the dampener system comprises a dampener element, such as sand, to dampen vibrations between the lower mainframe and the lower mainframe.
摘要翻译：稳定的平台支持电池，稳定的平台包括下主机，上主机和减振器系统。上主机包括多个凹槽。每个凹槽被配置成接收单元。阻尼器系统将下主机连接到上主机。在一个实施例中，阻尼器系统包括阻尼器元件，例如沙子，以阻尼下主机和下主机之间的振动。

3. 发明申请

US20100081289A1 METHOD OF DEPOSITING MATERIALS ON A NON-PLANAR SURFACE 失效
标题翻译：在非平面表面沉积材料的方法
公开(公告)号：US20100081289A1
公开(公告)日：2010-04-01
申请号：US12633589
申请日：2009-12-08
申请人： Dan Marohl , Timothy J. Franklin , Ratson Morad
发明人： Dan Marohl , Timothy J. Franklin , Ratson Morad
IPC分类号： H01L21/302
CPC分类号： H01L21/67706 , C23C14/505 , H01L21/6776
摘要： A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
摘要翻译：公开了一种用于在非平面基板上实现半导体处理的载体。载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底，并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。随着非平面基板同时旋转并且向下平移处理室，旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺，从而允许根据需要均匀沉积。或者，任何预定图案能够暴露在非平面基板的表面上。这种载体实现非平面半导体器件的制造，包括但不限于非平面发光二极管，非平面光伏电池等。

4. 发明申请

US20090044839A1 SINGLE WAFER METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR SUBSTRATES USING AN INERT GAS AIR-KNIFE 有权
标题翻译：使用惰性气体空气干燥半导体基板的单波长方法和装置
公开(公告)号：US20090044839A1
公开(公告)日：2009-02-19
申请号：US12249956
申请日：2008-10-12
申请人： Nathan D. Stein , Younes Achkire , Timothy J. Franklin , Julia Svirchevski , Dan A. Marohl
发明人： Nathan D. Stein , Younes Achkire , Timothy J. Franklin , Julia Svirchevski , Dan A. Marohl
IPC分类号： B08B13/00
CPC分类号： H01L21/67034
摘要： In one aspect, a substrate processing apparatus is provided. The apparatus comprises a mechanism for forming a meniscus on a surface of a substrate by moving the substrate through a fluid; an air knife apparatus positioned to apply an air knife to shorten the meniscus formed on the surface of the substrate; and a drying vapor nozzle positioned to direct a drying vapor to the meniscus shortened by the air knife. Numerous other aspects are provided.
摘要翻译：一方面，提供了一种基板处理装置。该装置包括用于通过移动衬底通过流体在衬底的表面上形成弯液面的机构; 定位成施加气刀以缩短形成在基板表面上的弯液面的气刀装置; 以及干燥蒸汽喷嘴，定位成将干燥蒸汽引导到由气刀缩短的弯液面。提供了许多其他方面。

5. 发明申请

US20090032068A1 SINGLE WAFER METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR SUBSTRATES USING AN INERT GAS AIR-KNIFE 审中-公开
标题翻译：使用惰性气体空气干燥半导体基板的单波长方法和装置
公开(公告)号：US20090032068A1
公开(公告)日：2009-02-05
申请号：US12249961
申请日：2008-10-12
申请人： Nathan D. Stein , Younes Achkire , Timothy J. Franklin , Julia Svirchevski , Dan A. Marohl
发明人： Nathan D. Stein , Younes Achkire , Timothy J. Franklin , Julia Svirchevski , Dan A. Marohl
IPC分类号： B08B5/00 , B08B3/04
CPC分类号： H01L21/67034
摘要： In one aspect, a method is provided. The method comprises forming a meniscus at an interface between a substrate and a fluid surface by moving the substrate through the fluid; shortening the meniscus by applying an air knife to the meniscus at the interface between the substrate and the fluid surface; and Marangoni drying the substrate by applying a drying vapor to the shortened meniscus. Numerous other aspects are provided.
摘要翻译：一方面，提供了一种方法。该方法包括通过移动衬底通过流体在衬底和流体表面之间的界面处形成弯液面; 通过在基板和流体表面之间的界面处向弯液面施加气刀来缩短弯月面; 并且Marangoni通过对缩短的弯液面施加干燥蒸气来干燥基底。提供了许多其他方面。

6. 发明授权

US06571657B1 Multiple blade robot adjustment apparatus and associated method 失效
标题翻译：多刀片机器人调节装置及相关方法
公开(公告)号：US06571657B1
公开(公告)日：2003-06-03
申请号：US09664607
申请日：2000-09-18
申请人： Donald J. Olgado , Avi Tepman , Timothy J. Franklin
发明人： Donald J. Olgado , Avi Tepman , Timothy J. Franklin
IPC分类号： B25J1700
CPC分类号： H01L21/67126 , B25J9/1638 , C25D7/12 , G05B2219/40351 , G05B2219/41457 , H01L21/2885 , H01L21/67051 , H01L21/67742 , H01L21/68707 , H05K3/241 , Y10T74/20311
摘要： The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.
摘要翻译：本发明提供了一种装置和相关联的方法，其中该装置包括多叶片机器人和补偿装置。多刀片机器人包括至少一组机器人刀片。补偿装置调节机器人刀片组之间的间距和两个或更多个单元之间的间隔的差异。在不同的实施例中，补偿装置可以耦合到一个或多个处理单元，一个或多个基板保持器系统或一个或多个机器人叶片。

7. 发明申请

US20180138061A1 SELECTIVE ETCH RATE MONITOR 有权
公开(公告)号：US20180138061A1
公开(公告)日：2018-05-17
申请号：US15351437
申请日：2016-11-14
申请人： Philip Allan Kraus , Timothy J. Franklin
发明人： Philip Allan Kraus , Timothy J. Franklin
IPC分类号： H01L21/67 , H01L21/66 , G01H13/00
CPC分类号： H01L21/67253 , G01H13/00 , H01J37/00 , H01L21/67069 , H01L21/67155 , H01L22/14 , H01L22/26
摘要： Embodiments include a real time etch rate sensor and methods of for using a real time etch rate sensor. In an embodiment, the real time etch rate sensor includes a resonant system and a conductive housing. The resonant system may include a resonating body, a first electrode formed over a first surface of the resonating body, a second electrode formed over a second surface of the resonating body, and a sacrificial layer formed over the first electrode. In an embodiment, at least a portion of the first electrode is not covered by the sacrificial layer. In an embodiment, the conductive housing may secure the resonant system. Additionally, the conductive housing contacts the first electrode, and at least a portion of an interior edge of the conductive housing may be spaced away from the sacrificial layer.

8. 发明授权

US08318609B2 Method of depositing materials on a non-planar surface 失效
标题翻译：在非平面表面上沉积材料的方法
公开(公告)号：US08318609B2
公开(公告)日：2012-11-27
申请号：US12633589
申请日：2009-12-08
申请人： Dan Marohl , Timothy J. Franklin , Ratson Morad
发明人： Dan Marohl , Timothy J. Franklin , Ratson Morad
IPC分类号： H01L21/31
CPC分类号： H01L21/67706 , C23C14/505 , H01L21/6776
摘要： A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
摘要翻译：公开了一种用于在非平面基板上实现半导体处理的载体。载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底，并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。随着非平面基板同时旋转并且向下平移处理室，旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺，从而允许根据需要均匀沉积。或者，任何预定图案能够暴露在非平面基板的表面上。这种载体实现非平面半导体器件的制造，包括但不限于非平面发光二极管，非平面光伏电池等。

9. 发明授权

US07845308B1 Systems incorporating microwave heaters within fluid supply lines of substrate processing chambers and methods for use of such systems 有权
标题翻译：在基板处理室的流体供应管线内并入微波加热器的系统以及使用这种系统的方法
公开(公告)号：US07845308B1
公开(公告)日：2010-12-07
申请号：US11536429
申请日：2006-09-28
申请人： Jason Corneille , Nancy E. Gilbert , Robert D. Tas , Steven Flanders , Timothy J. Franklin , Jason R. Wright , Stephen C. Jones , Joe Laia
发明人： Jason Corneille , Nancy E. Gilbert , Robert D. Tas , Steven Flanders , Timothy J. Franklin , Jason R. Wright , Stephen C. Jones , Joe Laia
IPC分类号： B05C11/00 , B05C3/00
CPC分类号： C25D17/04 , C23C18/1632 , C23C18/1676 , H05B6/802 , H05B6/806
摘要： Systems having an in-line microwave heater to heat fluids for processing a substrate are provided. An embodiment of a system includes a microelectronic processing chamber, a reservoir for storing a fluid used to process wafers within the chamber, a supply line for transporting the fluid to the chamber, and a microwave heater arranged along the supply line. The system includes processor executable program instructions for operating the microwave heater at parameters configured to heat fluid within the supply line to a temperature greater than a fluid temperature within the reservoir, such as approximately 20° C. greater than the reservoir fluid temperature. It is noted that the inclusion of an in-line microwave heater is not limited to microelectronic fabrication systems, but may be used for any system in which heated fluids are used for processing a substrate, such as but not limited to electroplating or electroless plating systems.
摘要翻译：提供具有在线微波加热器以加热用于处理衬底的流体的系统。系统的一个实施例包括微电子处理室，用于存储用于处理室内的晶片的流体的储存器，用于将流体输送到室的供应管线和沿着供给管布置的微波加热器。该系统包括处理器可执行程序指令，用于在被配置为将供应管线内的流体加热到大于储存器内的流体温度的温度（例如比储存器流体温度大约20℃）的参数下操作微波加热器。应当注意，包括在线微波加热器不限于微电子制造系统，而是可以用于其中加热流体用于处理衬底的任何系统，例如但不限于电镀或无电电镀系统。

10. 发明申请

US20090011573A1 Carrier used for deposition of materials on a non-planar surface 审中-公开
标题翻译：用于在非平面表面上沉积材料的载体
公开(公告)号：US20090011573A1
公开(公告)日：2009-01-08
申请号：US11983239
申请日：2007-11-07
申请人： Dan Marohl , Timothy J. Franklin , Ratson Morad
发明人： Dan Marohl , Timothy J. Franklin , Ratson Morad
IPC分类号： B05C13/00 , B23H7/26 , H01L21/36
CPC分类号： H01L21/67706 , C23C14/505 , H01L21/6776
摘要： A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
摘要翻译：公开了一种用于在非平面基板上实现半导体处理的载体。载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底，并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。随着非平面基板同时旋转并且向下平移处理室，旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺，从而允许根据需要均匀沉积。或者，任何预定图案能够暴露在非平面基板的表面上。这种载体实现非平面半导体器件的制造，包括但不限于非平面发光二极管，非平面光伏电池等。

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