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    • 9. 发明申请
    • Electropolishing pad
    • 电抛光垫
    • US20050087450A1
    • 2005-04-28
    • US10693142
    • 2003-10-24
    • Steven RederMichael Berman
    • Steven RederMichael Berman
    • B23H3/00B23H5/08C25F3/02
    • C25F3/02B23H5/08
    • An electropolishing pad adapted for thinning a layer on a substrate, without damaging a delicate underlying layer in the substrate. The electropolishing pad includes a pad formed of an electrically conductive material, for applying a desired voltage potential through the electropolishing pad to electrolytically erode the layer on the substrate. An operating surface on the pad physically erodes the layer on the substrate. The operating surface has a roughness that is not so great as to create friction sufficient to induce a shearing force that damages the delicate underlying layer in the substrate, but great enough so as to physically erode the layer on the substrate.
    • 一种电抛光垫,其适于使基底上的层变薄,而不会损坏基底中的精细的下层。 电抛光垫包括由导电材料形成的焊盘,用于通过电抛光垫施加期望的电压电位以电解侵蚀基板上的层。 垫上的操作表面物理地侵蚀基底上的层。 操作表面的粗糙度不大,以致于产生足以引起剪切力的摩擦力,该剪切力破坏了衬底中精细的下层,但足够大,以便物理地侵蚀衬底上的层。