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1. 发明申请

US20080020535A1 SILICIDE CAP STRUCTURE AND PROCESS FOR REDUCED STRESS AND IMPROVED GATE SHEET RESISTANCE 审中-公开
标题翻译：减少应力和改进的栅格电阻的硅胶结构和工艺
公开(公告)号：US20080020535A1
公开(公告)日：2008-01-24
申请号：US11866751
申请日：2007-10-03
申请人： Levent Gulari , Kevin Mello , Robert Purtell , Yun-Yu Wang , Keith Wong
发明人： Levent Gulari , Kevin Mello , Robert Purtell , Yun-Yu Wang , Keith Wong
IPC分类号： H01L21/336 , H01L21/44
CPC分类号： H01L21/28052 , H01L21/28114 , H01L21/28518 , H01L29/665
摘要： A silicide cap structure and method of fabricating a silicide cap having a low sheet resistance. The method provides a semiconductor substrate and a MOSFET structure comprising a gate insulator on the substrate, an Si-containing gate electrode on the gate insulator layer, and source/drain diffusions. Atop the gate electrode and source/drain diffusions is formed a layer of metal used in forming a silicide region atop the transistor gate electrode and diffusions; an intermediate metal barrier layer formed atop the silicide forming metal layer; and, an oxygen barrier layer formed atop the intermediate metal barrier layer. As a result of annealing the MOSFET structure, resulting formed silicide regions exhibit a lower sheet resistance. As the intermediate metal barrier layer comprises a material exhibiting tensile stress, the oxygen barrier layer may comprise a compressive material for minimizing a total mechanical stress of the cap structure and underlying layers during the applied anneal.
摘要翻译：一种硅化物盖结构和制造具有低薄层电阻的硅化物盖的方法。该方法提供半导体衬底和MOSFET结构，其包括在衬底上的栅极绝缘体，栅极绝缘体层上的含Si栅极电极和源极/漏极扩散。在栅电极和源极/漏极扩散之上形成用于在晶体管栅极顶部形成硅化物区域和扩散的金属层; 形成在所述硅化物形成金属层顶上的中间金属阻挡层; 以及形成在中间金属阻挡层顶上的氧阻隔层。作为对MOSFET结构进行退火的结果，所形成的形成的硅化物区域具有较低的薄层电阻。当中间金属阻挡层包括显示拉伸应力的材料时，氧阻挡层可以包括用于在施加的退火期间最小化盖结构和下层的总机械应力的压缩材料。

2. 发明申请

US20070020929A1 METHOD FOR REDUCING DENDRITE FORMATION IN NICKEL SILICON SALICIDE PROCESSES 失效
标题翻译：在镍硅酸盐工艺中减少形成碳酸盐的方法
公开(公告)号：US20070020929A1
公开(公告)日：2007-01-25
申请号：US11460671
申请日：2006-07-28
申请人： Robert Purtell , Yun-Yu Wang , Keith Wong
发明人： Robert Purtell , Yun-Yu Wang , Keith Wong
IPC分类号： H01L21/44
CPC分类号： H01L21/28518 , H01L29/665 , H01L29/6659 , H01L29/7833
摘要： A method for reducing dendrite formation in a self-aligned, silicide process for a semiconductor device includes forming a silicide metal layer over a semiconductor substrate, the semiconductor device having one or more diffusion regions, one or more isolation areas and one or more gate structures formed thereon. The concentration of metal rich portions of the metal layer is reduced through the introduction of silicon thereto, and the semiconductor device is annealed.
摘要翻译：用于减少半导体器件的自对准硅化物工艺中的枝晶形成的方法包括在半导体衬底上形成硅化物金属层，所述半导体器件具有一个或多个扩散区域，一个或多个隔离区域和一个或多个栅极结构形成在其上。金属层的富金属部分的浓度通过向其中引入硅而降低，半导体器件退火。

3. 发明申请

US20050255699A1 METHOD FOR CONTROLLING VOIDING AND BRIDGING IN SILICIDE FORMATION 有权
标题翻译：用于控制硅化物形成中的阻塞和桥接的方法
公开(公告)号：US20050255699A1
公开(公告)日：2005-11-17
申请号：US10709534
申请日：2004-05-12
申请人： Bradley Jones , Christian Lavoie , Robert Purtell , Yun-Yu Wang , Keith Wong
发明人： Bradley Jones , Christian Lavoie , Robert Purtell , Yun-Yu Wang , Keith Wong
IPC分类号： H01L21/20 , H01L21/285 , H01L21/336 , H01L21/44 , H01L21/4763 , H01L29/78
CPC分类号： H01L29/665 , H01L21/28518 , H01L29/7833
摘要： A method for forming a metal suicide contact for a semiconductor device includes forming a refractory metal layer over a substrate, including active and non-active area of said substrate, and forming a cap layer over the refractory metal layer. A counter tensile layer is formed over the cap layer, wherein the counter tensile layer is selected from a material such that an opposing directional stress is created between the counter tensile layer and the cap layer, with respect to a directional stress created between the refractory metal layer and the cap layer.
摘要翻译：用于形成用于半导体器件的金属硅化物接触的方法包括在包括所述衬底的有源和非有源区域的衬底上形成难熔金属层，并在难熔金属层上形成覆盖层。反面拉伸层形成在覆盖层上方，其中相对抗拉层选自材料，使得在相对拉伸层和盖层之间产生相对的方向应力，相对于难熔金属之间产生的方向应力层和盖层。

4. 发明申请

US20060163671A1 SILICIDE CAP STRUCTURE AND PROCESS FOR REDUCED STRESS AND IMPROVED GATE SHEET RESISTANCE 审中-公开
标题翻译：减少应力和改进的栅格电阻的硅胶结构和工艺
公开(公告)号：US20060163671A1
公开(公告)日：2006-07-27
申请号：US10905949
申请日：2005-01-27
申请人： Levent Gulari , Kevin Mello , Robert Purtell , Yun-Yu Wang , Keith Wong
发明人： Levent Gulari , Kevin Mello , Robert Purtell , Yun-Yu Wang , Keith Wong
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L21/28052 , H01L21/28114 , H01L21/28518 , H01L29/665
摘要： A suicide cap structure and method of fabricating a suicide cap having a low sheet resistance. The method provides a semiconductor substrate and a MOSFET structure comprising a gate insulator on the substrate, an Si-containing gate electrode on the gate insulator layer, and source/drain diffusions. Atop the gate electrode and source/drain diffusions is formed a layer of metal used in forming a silicide region atop the transistor gate electrode and diffusions; an intermediate metal barrier layer formed atop the silicide forming metal layer; and, an oxygen barrier layer formed atop the intermediate metal barrier layer. As a result of annealing the MOSFET structure, resulting formed silicide regions exhibit a lower sheet resistance. As the intermediate metal barrier layer comprises a material exhibiting tensile stress, the oxygen barrier layer may comprise a compressive material for minimizing a total mechanical stress of the cap structure and underlying layers during the applied anneal.
摘要翻译：一种自杀帽结构和制造具有低薄层阻力的自杀帽的方法。该方法提供半导体衬底和MOSFET结构，其包括在衬底上的栅极绝缘体，栅极绝缘体层上的含Si栅极电极和源极/漏极扩散。在栅电极和源极/漏极扩散之上形成用于在晶体管栅极顶部形成硅化物区域和扩散的金属层; 形成在所述硅化物形成金属层顶上的中间金属阻挡层; 以及形成在中间金属阻挡层顶上的氧阻隔层。作为对MOSFET结构进行退火的结果，所形成的形成的硅化物区域具有较低的薄层电阻。当中间金属阻挡层包括显示拉伸应力的材料时，氧阻挡层可以包括用于在施加的退火期间最小化盖结构和下层的总机械应力的压缩材料。

5. 发明申请

US20050067745A1 Method and apparatus for deposition & formation of metal silicides 审中-公开
标题翻译：用于沉积和形成金属硅化物的方法和装置
公开(公告)号：US20050067745A1
公开(公告)日：2005-03-31
申请号：US10674302
申请日：2003-09-30
申请人： Kenneth Giewont , Bradley Jones , Christian Lavoie , Robert Purtell , Yun-Yu Wang , Kwong Wong
发明人： Kenneth Giewont , Bradley Jones , Christian Lavoie , Robert Purtell , Yun-Yu Wang , Kwong Wong
IPC分类号： C22F1/00 , C23C14/16 , C23C14/58
CPC分类号： C23C14/5806 , C23C14/16
摘要： Disclosed is a method and structure for forming a silicide on a silicon material. The invention places the silicon material in a vacuum environment, forms metal on the silicon material, and then heats the silicon surface and the metal without breaking the vacuum environment. The processes of forming the metal and heating the silicon can be performed simultaneously without breaking the vacuum environment to form the silicide as the metal is being deposited. After the foregoing processing, the invention can remove the silicon surface from the vacuum environment and perform additional heating of the silicon surface. The first heating process forms a monosilicide and the additional heating forms a disilicide.
摘要翻译：公开了一种在硅材料上形成硅化物的方法和结构。本发明将硅材料置于真空环境中，在硅材料上形成金属，然后在不破坏真空环境的情况下加热硅表面和金属。当金属沉积时，形成金属和加热硅的工艺可以同时进行而不破坏真空环境以形成硅化物。在上述处理之后，本发明可以从真空环境中去除硅表面，并对硅表面进行附加加热。第一加热工艺形成一硅化物，另外的加热形成二硅化物。

6. 发明申请

US20070087541A1 METHOD AND APPARATUS FOR DEPOSITION & FORMATION OF METAL SILICIDES 审中-公开
标题翻译：用于沉积和形成金属硅的方法和装置
公开(公告)号：US20070087541A1
公开(公告)日：2007-04-19
申请号：US11557259
申请日：2006-11-07
申请人： Kenneth Giewont , Bradley Jones , Christian Lavoie , Robert Purtell , Yun-Yu Wang , Kwong Wong
发明人： Kenneth Giewont , Bradley Jones , Christian Lavoie , Robert Purtell , Yun-Yu Wang , Kwong Wong
IPC分类号： H01L21/4763 , H01L21/3205
CPC分类号： C23C14/5806 , C23C14/16
摘要： Disclosed is a method and structure for forming a silicide on a silicon material. The invention places the silicon material in a vacuum environment, forms metal on the silicon material, and then heats the silicon surface and the metal without breaking the vacuum environment. The processes of forming the metal and heating the silicon can be performed simultaneously without breaking the vacuum environment to form the silicide as the metal is being deposited. After the foregoing processing, the invention can remove the silicon surface from the vacuum environment and perform additional heating of the silicon surface. The first heating process forms a monosilicide and the additional heating forms a disilicide.
摘要翻译：公开了一种在硅材料上形成硅化物的方法和结构。本发明将硅材料置于真空环境中，在硅材料上形成金属，然后在不破坏真空环境的情况下加热硅表面和金属。当金属沉积时，形成金属和加热硅的工艺可以同时进行而不破坏真空环境以形成硅化物。在上述处理之后，本发明可以从真空环境中去除硅表面，并对硅表面进行附加加热。第一加热工艺形成一硅化物，另外的加热形成二硅化物。

7. 发明申请

US20070210448A1 ELECTROLESS COBALT-CONTAINING LINER FOR MIDDLE-OF-THE-LINE (MOL) APPLICATIONS 审中-公开
标题翻译：用于中间线（MOL）应用的电镀含钴包装线
公开(公告)号：US20070210448A1
公开(公告)日：2007-09-13
申请号：US11308186
申请日：2006-03-10
申请人： Keith Wong , Yun-Yu Wang , Horatio Wildman , Christopher Parks , Chih-Chao Yang
发明人： Keith Wong , Yun-Yu Wang , Horatio Wildman , Christopher Parks , Chih-Chao Yang
IPC分类号： H01L23/48
CPC分类号： H01L23/485 , H01L21/288 , H01L21/76843 , H01L21/76846 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure that includes a Co-containing liner disposed between an oxygen-getter layer and a metal-containing conductive material is provided. The Co-containing liner, the oxygen-getter layer and the metal-containing conductive material form MOL metallurgy where the Co-containing liner replaces a traditional TiN liner. By “Co-containing” is meant that the liner includes elemental Co alone or elemental Co and at least one of P or B. In order to provide better step coverage of the inventive Co-containing liner within a high aspect ratio contact opening, the Co-containing liner is formed via an electroless deposition process.
摘要翻译：提供了包括设置在吸氧剂层和含金属的导电材料之间的含Co衬里的半导体结构。含Co的内衬，吸氧剂层和含金属的导电材料形成MOL冶金，其中含Co衬垫代替了传统的TiN衬里。 “含Co”是指衬垫包括元素Co单体或元素Co以及P或B中的至少一种。为了在高纵横比接触开口内提供本发明的含Co衬垫的更好的台阶覆盖，通过无电镀沉积工艺形成含钴内衬。

8. 发明申请

US20060270245A1 BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METALLIZATION AND METHOD OF MAKING SAME 失效
标题翻译：包括用于导电金属化的HDP / bHDP膜的双层盖结构及其制造方法
公开(公告)号：US20060270245A1
公开(公告)日：2006-11-30
申请号：US10908833
申请日：2005-05-27
申请人： Richard Conti , Thomas Houghton , Michael Lofaro , Jeffery Maxson , Ann McDonald , Yun-Yu Wang , Keith Wong , Daewon Yang
发明人： Richard Conti , Thomas Houghton , Michael Lofaro , Jeffery Maxson , Ann McDonald , Yun-Yu Wang , Keith Wong , Daewon Yang
IPC分类号： H01L21/31
CPC分类号： H01L23/53238 , H01L21/28556 , H01L21/76849 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a bilayer cap structure for interconnect structures that comprise copper metallization or other conductive metallization. Such bilayer cap structure includes a first cap layer formed by an unbiased high density plasma (HDP) chemical vapor deposition process, and a second cap layer over the first cap layer, where the second cap layer is formed by a biased high density plasma (bHDP) chemical vapor deposition process. During the bHDP chemical vapor deposition process, a low AC bias power is applied to the substrate to increase the ion bombardment on the substrate surface and to induce resputtering of the capping material, thereby forming a seamless second cap layer with excellent reactive ion etching (RIE) selectivity.
摘要翻译：本发明涉及一种用于互连结构的双层盖结构，其包括铜金属化或其它导电金属化。这种双层盖结构包括通过无偏高密度等离子体（HDP）化学气相沉积工艺形成的第一盖层和在第一盖层上的第二盖层，其中第二盖层由偏置的高密度等离子体（bHDP ）化学气相沉积工艺。在bHDP化学气相沉积工艺期间，将低AC偏置功率施加到衬底上以增加衬底表面上的离子轰击并引起封盖材料的再溅射，从而形成具有优异的反应离子蚀刻（RIE）的无缝第二帽层）选择性。

9. 发明申请

US20060001162A1 Nitride and polysilicon interface with titanium layer 审中-公开
标题翻译：氮化物和多晶硅界面与钛层
公开(公告)号：US20060001162A1
公开(公告)日：2006-01-05
申请号：US11084724
申请日：2005-03-18
申请人： Ronald Schutz , Werner Robl , Rajeev Malik , Lawrence Clevenger , Oleg Gluschenkov , Cyril Cabral , Roy Iggulden , Yun-Yu Wang , Keith Wong , Irene McStay
发明人： Ronald Schutz , Werner Robl , Rajeev Malik , Lawrence Clevenger , Oleg Gluschenkov , Cyril Cabral , Roy Iggulden , Yun-Yu Wang , Keith Wong , Irene McStay
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L21/7685 , H01L21/28052 , H01L21/28061 , H01L21/76838 , H01L21/76855 , H01L21/823828 , H01L21/823842 , H01L29/4941 , H01L29/51 , H01L29/517 , H01L29/518 , H01L29/78 , H01L2221/1078
摘要： A conductive structure in an integrated circuit (12), and a method of forming the structure, is provided that includes a polysilicon layer (30), a thin layer containing titanium over the polysilicon, a tungsten nitride layer (34) over the titanium-containing layer and a tungsten layer over the tungsten nitride layer. The structure also includes a silicon nitride interfacial region (38) between the polysilicon layer and the titanium-containing layer. The structure withstands high-temperature processing without substantial formation of metal silicides in the polysilicon layer (30) and the tungsten layer (32), and provides low interface resistance between the tungsten layer and the polysilicon layer.
摘要翻译：提供集成电路（12）中的导电结构和形成该结构的方法，其包括多晶硅层（30），在多晶硅上含有钛的薄层，在钛 - 钛层上的氮化钨层（34）并且在氮化钨层上形成钨层。该结构还包括在多晶硅层和含钛层之间的氮化硅界面区域（38）。该结构经受高温处理，而在多晶硅层（30）和钨层（32）中基本不形成金属硅化物，并且在钨层和多晶硅层之间提供低的界面电阻。

10. 发明授权

US06436823B1 Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed 有权
标题翻译：在半导体结构中的金属硅化物层的顶部上形成TiN层的方法和形成的结构
公开(公告)号：US06436823B1
公开(公告)日：2002-08-20
申请号：US09679738
申请日：2000-10-05
申请人： Cyril Cabral, Jr. , Chung-Ping Eng , Lynne Marie Gignac , Christian Lavoie , Patricia O'Neil , Kirk David Peterson , Tina Wagner , Yun-Yu Wang , Keith Wong
发明人： Cyril Cabral, Jr. , Chung-Ping Eng , Lynne Marie Gignac , Christian Lavoie , Patricia O'Neil , Kirk David Peterson , Tina Wagner , Yun-Yu Wang , Keith Wong
IPC分类号： H01L2144
CPC分类号： H01L21/76856 , H01L21/28518 , H01L2221/1078
摘要： A method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure without the formation of a thick amorphous layer containing Ti, Co and Si and the structure formed are provided. In the method, after a Ti layer is deposited on top of a metal silidide layer, a dual-step annealing process is conducted in which a low temperature annealing in a forming gas (or ammonia) at a temperature not higher than 500° C. is first conducted for less than 2 hours followed by a high temperature annealing in a nitrogen-containing gas (or ammonia) at a second temperature not lower than 500° for less than 2 hours to form the TiN layer. The present invention method prevents the problem usually caused by a thick amorphous material layer of Ti—Si—Co which produces weakly bonded Ti which reacts with fluorine atoms from WF6 during a subsequent CVD W deposition process and causes liner failure due to a volume expansion of the amorphous material. The maximum thickness of the amorphous material layer formed by the present invention method is less than 5 nm which minimizes the line failure problem.
摘要翻译：提供了一种在半导体结构中的金属硅化物层的顶部上形成TiN层的方法，而不形成含有Ti，Co和Si的厚非晶层以及形成的结构。在该方法中，在金属硅化物层的顶部沉积Ti层之后，进行双相退火工艺，其中在不高于500℃的温度下在成形气体（或氨）中进行低温退火。首先进行少于2小时，然后在不低于500℃的第二温度下在含氮气体（或氨）中进行低温退火2小时以形成TiN层。本发明的方法防止了在随后的CVD W沉积过程中由Ti-Si-Co的厚的无定形材料层产生的弱结合的Ti与来自WF6的氟原子反应而产生的弱结合的问题，并导致由于体积膨胀引起的衬管故障无定形材料。通过本发明方法形成的非晶材料层的最大厚度小于5nm，这使线路故障问题最小化。

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