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    • 1. 发明授权
    • Protect diodes for hybrid-orientation substrate structures
    • 用于混合取向衬底结构的保护二极管
    • US07687340B2
    • 2010-03-30
    • US11849489
    • 2007-09-04
    • James William AdkissonJeffrey Peter GambinoAlain LoiseauKirk David Peterson
    • James William AdkissonJeffrey Peter GambinoAlain LoiseauKirk David Peterson
    • H01L21/8234
    • H01L27/1203H01L21/823807H01L21/823878H01L21/84H01L27/0255H01L27/0922H01L27/1207H01L29/045
    • A semiconductor structure fabrication method. First, a semiconductor structure is provided including (a) a semiconductor block having a first semiconductor material doped with a first doping polarity and having a first lattice orientation, and (b) a semiconductor region on the semiconductor block, wherein the semiconductor region is physically isolated from the semiconductor block by a dielectric region, and wherein the semiconductor region includes a second semiconductor material (i) doped with a second doping polarity opposite to the first doping polarity and (ii) having a second lattice orientation different from the first lattice orientation. Next, first and second gate stacks are formed on the semiconductor block and the semiconductor region, respectively. Then, (i) first and second S/D regions are simultaneously formed in the semiconductor block on opposing sides of the first gate stack and (ii) first and second discharge prevention semiconductor regions in the semiconductor block.
    • 半导体结构制造方法。 首先,提供半导体结构,其包括:(a)具有掺杂有第一掺杂极性且具有第一晶格取向的第一半导体材料的半导体块,以及(b)半导体块上的半导体区域,其中半导体区域是物理上的 并且其中所述半导体区域包括掺杂有与所述第一掺杂极性相反的第二掺杂极性的第二半导体材料(i)和(ii)具有不同于所述第一晶格取向的第二晶格取向 。 接下来,分别在半导体块和半导体区域上形成第一和第二栅极叠层。 然后,(i)第一和第二S / D区域同时形成在半导体块中的第一栅极堆叠的相对侧上,以及(ii)半导体块中的第一和第二放电预防半导体区域。
    • 6. 发明授权
    • Implementing enhanced SRAM read performance sort ring oscillator (PSRO)
    • 实现增强型SRAM读取性能排序环形振荡器(PSRO)
    • US07609542B2
    • 2009-10-27
    • US11873534
    • 2007-10-17
    • Chad Allen AdamsTodd Alan ChristensenTravis Reynold HebigKirk David Peterson
    • Chad Allen AdamsTodd Alan ChristensenTravis Reynold HebigKirk David Peterson
    • G11C11/40
    • G11C11/413
    • A method and apparatus including a static random access memory (SRAM) cell implement an enhanced SRAM read performance sort ring oscillator (PSRO), and a design structure on which the subject circuit resides is provided. A pair of parallel reverse polarity connected inverters defines a static latch or cross-coupled memory cell. The SRAM cell includes independent left and right wordlines providing a respective gate input to a pair of access transistors used to access to the memory cell. The SRAM cell includes a voltage supply connection to one side of the static latch. For example, a complement side of the static latch is connected to the voltage supply. A plurality of the SRAM cells is assembled together to form a SRAM base block. A plurality of the SRAM base blocks is connected together to form the SRAM read PSRO.
    • 一种包括静态随机存取存储器(SRAM)单元的方法和装置实现增强的SRAM读取性能排序环形振荡器(PSRO),以及设置有被摄体电路所在的设计结构。 一对并联反极性连接的反相器定义了静态锁存器或交叉耦合存储器单元。 SRAM单元包括独立的左和右字线,为用于访问存储单元的一对存取晶体管提供相应的栅极输入。 SRAM单元包括到静态锁存器的一侧的电压供应连接。 例如,静态锁存器的补码侧连接到电源。 多个SRAM单元组装在一起以形成SRAM基块。 多个SRAM基块被连接在一起以形成SRAM读取PSRO。
    • 9. 发明申请
    • PHOTOLITHOGRAPHY MASK WITH PROTECTIVE SILICIDE CAPPING LAYER
    • 具有保护性硅胶覆盖层的光刻胶面板
    • US20080261121A1
    • 2008-10-23
    • US11738004
    • 2007-04-20
    • Jeffrey Peter GambinoRobert Kenneth LeidyKirk David PetersonJed Hickory RankinEdmund Juris Sprogis
    • Jeffrey Peter GambinoRobert Kenneth LeidyKirk David PetersonJed Hickory RankinEdmund Juris Sprogis
    • G03C5/00G03F1/00
    • G03F1/30G03F1/48G03F1/54
    • A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and opposite top and bottom surfaces, the first opaque regions including a metal; the non-printable region including metal second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and opposite top and bottom surface, the second opaque regions including the metal; and a conformal protective metal oxide capping layer on top surfaces and sidewalls of the first and second opaque regions. The conformal layer is formed by oxidation.
    • 光掩模和制造光掩模的方法。 所述光掩模包括:对所选择的波长或辐射波长透明的衬底,所述衬底具有顶表面和相对的底表面,所述衬底具有可打印区域和不可打印区域; 所述可印刷区域具有在所述基板的与所述透明区域相邻的顶表面上方的第一不透明区域,所述第一不透明区域的每个不透明区域具有侧壁和相对的顶表面和底表面,所述第一不透明区域包括金属; 所述不可打印区域包括在所述基板的顶表面上方升高的金属第二不透明区域,所述第二不透明区域具有侧壁和相对的顶部和底部表面,所述第二不透明区域包括所述金属; 以及在第一和第二不透明区域的顶表面和侧壁上的共形保护性金属氧化物覆盖层。 保形层通过氧化形成。
    • 10. 发明申请
    • PHOTOLITHOGRAPHY MASK WITH INTEGRALLY FORMED PROTECTIVE CAPPING LAYER
    • 具有整体形成的保护层的光刻胶面板
    • US20080261120A1
    • 2008-10-23
    • US11737956
    • 2007-04-20
    • Jeffrey Peter GambinoRobert Kenneth LeidyKirk David PetersonJed Hickory RankinEdmund Juris Sprogis
    • Jeffrey Peter GambinoRobert Kenneth LeidyKirk David PetersonJed Hickory RankinEdmund Juris Sprogis
    • G03C5/00G03F1/00
    • G03F1/30G03F1/48G03F1/54
    • A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and opposite top and bottom surfaces, the first opaque regions including a metal; the non-printable region including metal second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and opposite top and bottom surface, the second opaque regions including the metal; and a conformal protective metal oxide capping layer on top surfaces and sidewalls of the first and second opaque regions. The conformal layer is formed by oxidation.
    • 光掩模和制造光掩模的方法。 所述光掩模包括:对所选择的波长或辐射波长透明的衬底,所述衬底具有顶表面和相对的底表面,所述衬底具有可打印区域和不可打印区域; 所述可印刷区域具有在所述基板的与所述透明区域相邻的顶表面上方的第一不透明区域,所述第一不透明区域的每个不透明区域具有侧壁和相对的顶表面和底表面,所述第一不透明区域包括金属; 所述不可打印区域包括在所述基板的顶表面上方升高的金属第二不透明区域,所述第二不透明区域具有侧壁和相对的顶部和底部表面,所述第二不透明区域包括所述金属; 以及在第一和第二不透明区域的顶表面和侧壁上的共形保护性金属氧化物覆盖层。 保形层通过氧化形成。