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1. 发明授权

US5328087A Thermally and electrically conductive adhesive material and method of bonding with same 失效
标题翻译：导电粘合材料及其粘接方法
公开(公告)号：US5328087A
公开(公告)日：1994-07-12
申请号：US38420
申请日：1993-03-29
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , H01L21/58
CPC分类号： H01L24/29 , C09J9/02 , H01B1/22 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/29499 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425 , Y10T29/49126
摘要： The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.
摘要翻译：本发明公开了一种导热粘合剂材料，其包括硬化粘合剂，以及含有液体金属的非固化填料，其分散在粘合剂的分开间隔的区域中。硬化的粘合剂提供机械结合，而填料提供连续的热和电金属桥，每个桥延伸通过粘合剂并接触粘结表面。该方法包括（a）将含有液态金属的填料分散在未硬化的粘合剂中，（b）将未硬化的粘合剂和非固化状态的填料接触到表面，从而形成与两个表面接触的非固化填料的分开的间隔区域，和（c）硬化粘合剂。

2. 发明授权

US5445308A Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal 失效
标题翻译：与基质材料和含有液态金属的随机分散填料的导热连接
公开(公告)号：US5445308A
公开(公告)日：1995-08-29
申请号：US263623
申请日：1994-06-22
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , B23K35/26
CPC分类号： C09J9/02 , H01B1/22 , H01L24/29 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/83101 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425
摘要： A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.
摘要翻译：在间隔表面之间提供导热连接的方法包括（a）将含有液态金属的导热填料混合到未硬化的基体材料中，和（b）使未硬化的基体材料和随机分散的分开的非固化区域未固化的基体材料中的填料到表面。可以通过硬化基质材料或通过在表面之间提供单独的粘合剂来提供固体机械结合。优选地，填料区域在表面之间形成分开的连续的热和导电路径。

3. 发明授权

US5265321A Integrated circuit structure with heat exchanger elements secured thereto and method of making 失效
标题翻译：具有固定有热交换器元件的集成电路结构及其制造方法
公开(公告)号：US5265321A
公开(公告)日：1993-11-30
申请号：US949182
申请日：1992-09-22
申请人： Richard D. Nelson , Michael A. Olla , Seyed H. Hashemi , Thomas P. Dolbear
发明人： Richard D. Nelson , Michael A. Olla , Seyed H. Hashemi , Thomas P. Dolbear
IPC分类号： H01L23/367 , H01L23/433 , H05K7/20
CPC分类号： H01L23/4334 , H01L23/3677 , H01L23/4338 , H01L2924/0002 , Y10T29/49146 , Y10T29/4981
摘要： An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.
摘要翻译：一种集成电路结构和制造方法，其中电路具有彼此间隔开的多个金属热交换器元件，其第一端固定到结构。第一端可以粘合地固定到集成电路芯片或下面的基板，并且热交换器可以气密地附接。该方法使用柔性可移除的支撑块，用于将多个单独的热交换器元件连接到具有其高度变化的集成电路结构。

4. 发明授权

US5344795A Method for encapsulating an integrated circuit using a removable heatsink support block 失效
标题翻译：使用可拆卸散热器支撑块封装集成电路的方法
公开(公告)号：US5344795A
公开(公告)日：1994-09-06
申请号：US949189
申请日：1992-09-22
申请人： Seyed H. Hashemi , Michael A. Olla , Thomas P. Dolbear , Richard D. Nelson
发明人： Seyed H. Hashemi , Michael A. Olla , Thomas P. Dolbear , Richard D. Nelson
IPC分类号： H01L21/56 , H01L23/433 , H01L21/58 , H01L21/60
CPC分类号： H01L21/565 , H01L23/4334 , H01L2224/48227 , H01L25/0655 , Y10T29/49121
摘要： A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.
摘要翻译：一种用于制造具有热交换器的热固性或热塑性封装集成电路的方法，其中热交换器的一端封装在与集成电路相邻的壳体中，另一端暴露于外壳外部的环境中。制造方法包括使用具有可溶性或可去除材料的预成型热交换器将热交换器成型为热固性或热塑性包装，其在成型操作期间用作密封块。提供多个导热热交换器元件以提供期望的热性能，同时减少包装中的热应力。

5. 发明授权

US5170930A Liquid metal paste for thermal and electrical connections 失效
标题翻译：用于热和电连接的液态金属膏
公开(公告)号：US5170930A
公开(公告)日：1992-12-15
申请号：US791706
申请日：1991-11-14
申请人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
发明人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
IPC分类号： H01B1/02 , H01B1/16 , H01L23/48 , H01L23/482 , H01R4/58 , H01R13/03 , H05K3/34
CPC分类号： H05K3/3463 , H01B1/02 , H01B1/16 , H01L23/48 , H01L23/4828 , H01L24/29 , H01R13/03 , H01R4/58 , H01L2224/16 , H01L2224/16225 , H01L2224/29339 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83805 , H01L2224/8592 , H01L2924/01012 , H01L2924/01014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , H05K3/3484
摘要： A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.
摘要翻译：一种用于在两个表面之间进行可拆卸和顺应连接的导热和导电的膏体。糊状物包括导电液体金属和颗粒状固体成分的平衡混合物，其中在连接期间浆料的温度下，液态金属和颗粒状固体成分的比例保留在最终液相线和最终液相线的最终固相线之间混合物，糊状物不固化。在低温和低温环境中，糊状物与与接触表面匹配的TCE形成硬化粘结。

6. 发明授权

US5056706A Liquid metal paste for thermal and electrical connections 失效
标题翻译：用于热和电连接的液态金属膏
公开(公告)号：US5056706A
公开(公告)日：1991-10-15
申请号：US438563
申请日：1989-11-20
申请人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
发明人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
IPC分类号： B23K31/02 , B23K35/26 , H05K3/34
CPC分类号： B23K35/26 , B23K31/02 , H05K3/3463 , H05K3/3484
摘要： A thermally and electrically conductive paste and its method of use for making a detachable and compliant thermal conductive connection between two surfaces or making an electrical connection between first and second electrical components. The paste is comprised of a liquid metal and particulate solid constituents which is non-solidifying, conformable, compliant, is removable, provides containment to impulsive loading, and is simple to apply.
摘要翻译：一种导热和导电的糊剂及其用于在两个表面之间制造可拆卸和柔性导热连接或在第一和第二电气部件之间形成电连接的方法。该糊状物由液体金属和非固化，顺应性，顺应性，可移除的颗粒状固体组分组成，提供了脉冲加载的容纳物，并且易于使用。

7. 发明授权

US4993482A Coiled spring heat transfer element 失效
标题翻译：螺旋弹簧传热元件
公开(公告)号：US4993482A
公开(公告)日：1991-02-19
申请号：US462688
申请日：1990-01-09
申请人： Thomas P. Dolbear , Richard D. Nelson , David A. Gibson , Omkarnath R. Gupta
发明人： Thomas P. Dolbear , Richard D. Nelson , David A. Gibson , Omkarnath R. Gupta
IPC分类号： F28F1/12 , F28F13/00 , H01L23/367
CPC分类号： F28F1/122 , F28F13/00 , H01L23/3677 , H01L2224/16225
摘要： A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.
摘要翻译：布置在其侧面上的导热螺旋弹簧在热源和散热器之间提供顺从的，高导电的低力热路径。每个弹簧触点通过弹簧中的每个线圈提供两个平行的热传导路径。弹簧可以倾斜以允许与表面滑动接触。在一个实施例中，平行布置的多个铜弹簧可以在电子部件和靠近的散热器之间提供热路径。弹簧可以在接触点处永久地附接到至少一个表面。

8. 发明授权

US06477047B1 Temperature sensor mounting for accurate measurement and durability 有权
标题翻译：温度传感器安装，可精确测量和耐用
公开(公告)号：US06477047B1
公开(公告)日：2002-11-05
申请号：US09734442
申请日：2000-12-11
申请人： Doug Markwardt , Thomas P. Dolbear , Lewis M. Eyman
发明人： Doug Markwardt , Thomas P. Dolbear , Lewis M. Eyman
IPC分类号： H05K720
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A temperature sensor for an integrated circuit is attached to a heat sink using a compliant member such as a spring. The spring attaches to the heat sink and extends across a slot in the thermal contact surface of the heat sink so that the temperature sensor coupled to the spring is centered nominally over an integrated circuit die when the heat sink is abutted against the integrated circuit.
摘要翻译：用于集成电路的温度传感器使用诸如弹簧的兼容部件附接到散热器。弹簧连接到散热器并且延伸穿过散热器的热接触表面中的狭槽，使得当散热器抵靠集成电路时，耦合到弹簧的温度传感器标称地集中在集成电路管芯上。

9. 发明授权

US06462956B1 Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module 有权
标题翻译：用于减少用于可移除模块的印刷线路板连接器内的各种电源引脚的电流不均匀性的布置
公开(公告)号：US06462956B1
公开(公告)日：2002-10-08
申请号：US09635333
申请日：2000-08-09
申请人： Dennis J. Herrell , Thomas P. Dolbear
发明人： Dennis J. Herrell , Thomas P. Dolbear
IPC分类号： H05K710
CPC分类号： H05K1/0265 , H01R12/523 , H05K7/1431 , H05K2201/044 , H05K2201/09309 , H05K2201/0979 , H05K2201/10189
摘要： An arrangement for a motherboard having a connector for a removable module is disclosed which increases the aggregate current carrying capacity of the connector by reducing the difference in current flow between power pins of the connector having the highest current flow and power pins of the connector having the lowest current flow. The current flow through all the power pins may then be operated nearer to the design maximum of the particular connector used. Thicker power planes within the motherboard (as well as within the module) reduce the effective resistance per square of the power plane, and help distribute the current more uniformly to a greater number of power pins of the connector. The use of multiple power planes in parallel also achieves a lower effective resistance. Multiple power terminals connecting the source of regulated power supply voltage (or reference voltage, such as ground) to the power plane may be used instead of just one power terminal. Moreover, placing a pair of power terminals symmetrically about a line perpendicular to the connector which bisects the power pins of the connector helps distribute the current flow through the power plane to the power pins. By placing the power terminal (or terminals) at least a certain distance from the connector (e.g., at least 15 mm), a more uniform current flow through the connector is achieved.
摘要翻译：公开了一种具有用于可拆卸模块的连接器的主板的布置，其通过减小具有最高电流的连接器的电源引脚与具有该连接器的连接器的电源引脚之间的电流差异，从而增加了连接器的聚集载流量最低电流。然后，可以使所有电源引脚的电流流动更接近所使用的特定连接器的设计最大值。主板（以及模块内部）的较大功率平面降低了功率平面每平方的有效电阻，并有助于将电流均匀分布到连接器的更大数量的电源引脚。并联使用多个电源平面也能实现较低的有效电阻。可以使用将稳压电源电压（或参考电压，例如接地）连接到电源平面的多个电源端子而不是仅一个电源端子。此外，将一对电源端子对称地围绕垂直于连接器的直线对称，该直线将连接器的电源引脚平分，有助于将电流流经电源平面分配给电源引脚。通过将电源端子（或端子）放置在与连接器至少一定距离（例如至少15mm）的位置上，实现了通过连接器的更均匀的电流。

10. 发明授权

US5309321A Thermally conductive screen mesh for encapsulated integrated circuit packages 失效
标题翻译：用于封装集成电路封装的导热筛网
公开(公告)号：US5309321A
公开(公告)日：1994-05-03
申请号：US949300
申请日：1992-09-22
申请人： Michael A. Olla , Thomas P. Dolbear , Seyed H. Hashemi
发明人： Michael A. Olla , Thomas P. Dolbear , Seyed H. Hashemi
IPC分类号： H01L23/29 , H01L23/373 , H01L23/433 , H01L23/552 , H05K7/20
CPC分类号： H01L23/293 , H01L23/3733 , H01L23/4334 , H01L23/552 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025
摘要： An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.
摘要翻译：一种封装的集成电路封装，其具有集成电路芯片，其中连接有多个电引线和至少一个邻近芯片定位的导热屏蔽网。非导电的热固性或热塑性材料形成包围芯片并结合到筛网的壳体。优选地，一个层暴露于壳体的外部，并且筛网被固定到支撑芯片的基板上。

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