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2. 发明授权

US06504243B1 Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods 有权
标题翻译：针对栅格阵列（PGA）装置的可移动传热装置，以及相关的安装和拆卸方法
公开(公告)号：US06504243B1
公开(公告)日：2003-01-07
申请号：US09544749
申请日：2000-04-07
申请人： Anthony Andric , Lewis M. Eyman
发明人： Anthony Andric , Lewis M. Eyman
IPC分类号： H01L2334
CPC分类号： H01L23/4093 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15174 , H01L2924/15312 , H01L2224/05599
摘要： A heat transfer apparatus is described for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket (e.g., a zero insertion force or ZIF socket). The socket is mounted upon a surface of a printed circuit board (PCB) and includes two latching projections extending from opposite side surfaces. The heat transfer apparatus includes a thermally conductive heat sink and a spring clip for holding the heat sink in position relative to the PGA device. The heat sink may be made from a metal (e.g., aluminum), and may have multiple structures (e.g., fins or pins) extending from an upper surface. The heat sink has an opening in an underside surface for housing the PGA device and the socket. The heat sink also has a lip surrounding the opening for thermally coupling to the PCB about the socket. The heat sink also has a pair of holes extending through the heat sink from the upper surface of the heat sink into the opening. The spring clip has two side members each adapted for attaching to a different one of the two latching projections of the socket. Each of the pair of holes in the heat sink is positioned to receive a different one of the side members of the spring clip. Methods for coupling a heat sink to the PGA device using the spring clip and removing the installed spring clip are also described.
摘要翻译：描述了一种传热装置，用于耦合到包括集成电路并安装在插座（例如，零插入力或ZIF插座）内的引脚格栅阵列（PGA）装置。插座安装在印刷电路板（PCB）的表面上，并且包括从相对侧表面延伸的两个闩锁突起。传热装置包括导热散热器和用于将散热器相对于PGA装置保持就位的弹簧夹。散热器可以由金属（例如铝）制成，并且可以具有从上表面延伸的多个结构（例如，翅片或销）。散热器在下表面具有用于容纳PGA装置和插座的开口。散热器还具有围绕开口的唇缘，用于与插座周围的PCB热耦合。散热器还具有从散热器的上表面延伸穿过散热器进入开口的一对孔。弹簧夹具有两个侧部构件，每个侧部构件适于附接到插座的两个闩锁突起中的不同的一个。散热器中的一对孔中的每一个被定位成接收弹簧夹的不同的一个侧部构件。还描述了使用弹簧夹将散热器连接到PGA装置并移除安装的弹簧夹的方法。

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