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1. 发明授权

US06477047B1 Temperature sensor mounting for accurate measurement and durability 有权
标题翻译：温度传感器安装，可精确测量和耐用
公开(公告)号：US06477047B1
公开(公告)日：2002-11-05
申请号：US09734442
申请日：2000-12-11
申请人： Doug Markwardt , Thomas P. Dolbear , Lewis M. Eyman
发明人： Doug Markwardt , Thomas P. Dolbear , Lewis M. Eyman
IPC分类号： H05K720
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A temperature sensor for an integrated circuit is attached to a heat sink using a compliant member such as a spring. The spring attaches to the heat sink and extends across a slot in the thermal contact surface of the heat sink so that the temperature sensor coupled to the spring is centered nominally over an integrated circuit die when the heat sink is abutted against the integrated circuit.
摘要翻译：用于集成电路的温度传感器使用诸如弹簧的兼容部件附接到散热器。弹簧连接到散热器并且延伸穿过散热器的热接触表面中的狭槽，使得当散热器抵靠集成电路时，耦合到弹簧的温度传感器标称地集中在集成电路管芯上。

2. 发明授权

US06462956B1 Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module 有权
标题翻译：用于减少用于可移除模块的印刷线路板连接器内的各种电源引脚的电流不均匀性的布置
公开(公告)号：US06462956B1
公开(公告)日：2002-10-08
申请号：US09635333
申请日：2000-08-09
申请人： Dennis J. Herrell , Thomas P. Dolbear
发明人： Dennis J. Herrell , Thomas P. Dolbear
IPC分类号： H05K710
CPC分类号： H05K1/0265 , H01R12/523 , H05K7/1431 , H05K2201/044 , H05K2201/09309 , H05K2201/0979 , H05K2201/10189
摘要： An arrangement for a motherboard having a connector for a removable module is disclosed which increases the aggregate current carrying capacity of the connector by reducing the difference in current flow between power pins of the connector having the highest current flow and power pins of the connector having the lowest current flow. The current flow through all the power pins may then be operated nearer to the design maximum of the particular connector used. Thicker power planes within the motherboard (as well as within the module) reduce the effective resistance per square of the power plane, and help distribute the current more uniformly to a greater number of power pins of the connector. The use of multiple power planes in parallel also achieves a lower effective resistance. Multiple power terminals connecting the source of regulated power supply voltage (or reference voltage, such as ground) to the power plane may be used instead of just one power terminal. Moreover, placing a pair of power terminals symmetrically about a line perpendicular to the connector which bisects the power pins of the connector helps distribute the current flow through the power plane to the power pins. By placing the power terminal (or terminals) at least a certain distance from the connector (e.g., at least 15 mm), a more uniform current flow through the connector is achieved.
摘要翻译：公开了一种具有用于可拆卸模块的连接器的主板的布置，其通过减小具有最高电流的连接器的电源引脚与具有该连接器的连接器的电源引脚之间的电流差异，从而增加了连接器的聚集载流量最低电流。然后，可以使所有电源引脚的电流流动更接近所使用的特定连接器的设计最大值。主板（以及模块内部）的较大功率平面降低了功率平面每平方的有效电阻，并有助于将电流均匀分布到连接器的更大数量的电源引脚。并联使用多个电源平面也能实现较低的有效电阻。可以使用将稳压电源电压（或参考电压，例如接地）连接到电源平面的多个电源端子而不是仅一个电源端子。此外，将一对电源端子对称地围绕垂直于连接器的直线对称，该直线将连接器的电源引脚平分，有助于将电流流经电源平面分配给电源引脚。通过将电源端子（或端子）放置在与连接器至少一定距离（例如至少15mm）的位置上，实现了通过连接器的更均匀的电流。

3. 发明授权

US5309321A Thermally conductive screen mesh for encapsulated integrated circuit packages 失效
标题翻译：用于封装集成电路封装的导热筛网
公开(公告)号：US5309321A
公开(公告)日：1994-05-03
申请号：US949300
申请日：1992-09-22
申请人： Michael A. Olla , Thomas P. Dolbear , Seyed H. Hashemi
发明人： Michael A. Olla , Thomas P. Dolbear , Seyed H. Hashemi
IPC分类号： H01L23/29 , H01L23/373 , H01L23/433 , H01L23/552 , H05K7/20
CPC分类号： H01L23/293 , H01L23/3733 , H01L23/4334 , H01L23/552 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025
摘要： An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.
摘要翻译：一种封装的集成电路封装，其具有集成电路芯片，其中连接有多个电引线和至少一个邻近芯片定位的导热屏蔽网。非导电的热固性或热塑性材料形成包围芯片并结合到筛网的壳体。优选地，一个层暴露于壳体的外部，并且筛网被固定到支撑芯片的基板上。

4. 发明授权

US5265321A Integrated circuit structure with heat exchanger elements secured thereto and method of making 失效
标题翻译：具有固定有热交换器元件的集成电路结构及其制造方法
公开(公告)号：US5265321A
公开(公告)日：1993-11-30
申请号：US949182
申请日：1992-09-22
申请人： Richard D. Nelson , Michael A. Olla , Seyed H. Hashemi , Thomas P. Dolbear
发明人： Richard D. Nelson , Michael A. Olla , Seyed H. Hashemi , Thomas P. Dolbear
IPC分类号： H01L23/367 , H01L23/433 , H05K7/20
CPC分类号： H01L23/4334 , H01L23/3677 , H01L23/4338 , H01L2924/0002 , Y10T29/49146 , Y10T29/4981
摘要： An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.
摘要翻译：一种集成电路结构和制造方法，其中电路具有彼此间隔开的多个金属热交换器元件，其第一端固定到结构。第一端可以粘合地固定到集成电路芯片或下面的基板，并且热交换器可以气密地附接。该方法使用柔性可移除的支撑块，用于将多个单独的热交换器元件连接到具有其高度变化的集成电路结构。

5. 发明授权

US06828666B1 Low inductance power distribution system for an integrated circuit chip 失效
标题翻译：用于集成电路芯片的低电感配电系统
公开(公告)号：US06828666B1
公开(公告)日：2004-12-07
申请号：US09099758
申请日：1998-06-18
申请人： Dennis J. Herrell , Thomas P. Dolbear
发明人： Dennis J. Herrell , Thomas P. Dolbear
IPC分类号： H01L2352
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L2224/16225 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/19106 , H01L2924/3011 , H05K1/112 , H05K2201/10545 , H05K2201/10734 , H01L2224/0401
摘要： A low impedance electrical pathway from decoupling capacitance located on a circuit board to an integrated circuit chip. The integrated circuit includes multiple power and ground C4 bumps and is positioned on a first side of an integrated circuit carrier which is positioned on a first side of a circuit board. The integrated circuit carrier includes lateral conductors such as voltage and ground power planes. Power and ground carrier vias extend from the voltage and ground power planes, respectively, to the first side of the carrier, and power and ground subgroups of carrier vias extend from the voltage and ground power planes, respectively, to power and ground solder balls on a second side of the carrier. The circuit board includes power and ground plated through holes extending from contact pads on the first side of the circuit board to contact pads on a second side of the circuit board. Decoupling capacitors are positioned on the second side of the circuit board. The decoupling capacitors have positive and negative electrodes are electrically coupled to the power and ground plated through holes respectively. The C4 power and ground bumps, the power and ground carrier vias, the power and ground carrier via subgroups, the power and ground solder balls, the contact pads, the power and ground plated through holes, and the positive and negative electrodes are arranged in anti-parallel tessellations to reduce the inductance of a loop circuit from the decoupling capacitors to the integrated chip circuit.
摘要翻译：位于电路板上的去耦电容到集成电路芯片的低阻抗电路。集成电路包括多个电源和接地C4凸起，并且位于集成电路载体的位于电路板的第一侧上的第一侧上。集成电路载体包括诸如电压和接地电源平面的横向导体。电源和地面载体通孔分别从电压和接地电源平面延伸到载体的第一侧，载流子通孔的电源和接地子组分别从电压和接地电源平面延伸到电源和接地焊球上承运人的第二面。电路板包括从电路板的第一侧的接触焊盘延伸到电路板第二面上的接触焊盘的电源和接地电镀通孔。去耦电容器位于电路板的第二侧。去耦电容器具有正极和负极分别电耦合到电源和接地电镀通孔。 C4电源和接地突起，电源和接地载体通孔，电源和接地载体通过子组，电源和接地焊球，接触焊盘，电源和接地电镀通孔以及正极和负极布置在反平行镶嵌，以减少环路电路从去耦电容到集成芯片电路的电感。

6. 发明授权

US5344795A Method for encapsulating an integrated circuit using a removable heatsink support block 失效
标题翻译：使用可拆卸散热器支撑块封装集成电路的方法
公开(公告)号：US5344795A
公开(公告)日：1994-09-06
申请号：US949189
申请日：1992-09-22
申请人： Seyed H. Hashemi , Michael A. Olla , Thomas P. Dolbear , Richard D. Nelson
发明人： Seyed H. Hashemi , Michael A. Olla , Thomas P. Dolbear , Richard D. Nelson
IPC分类号： H01L21/56 , H01L23/433 , H01L21/58 , H01L21/60
CPC分类号： H01L21/565 , H01L23/4334 , H01L2224/48227 , H01L25/0655 , Y10T29/49121
摘要： A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.
摘要翻译：一种用于制造具有热交换器的热固性或热塑性封装集成电路的方法，其中热交换器的一端封装在与集成电路相邻的壳体中，另一端暴露于外壳外部的环境中。制造方法包括使用具有可溶性或可去除材料的预成型热交换器将热交换器成型为热固性或热塑性包装，其在成型操作期间用作密封块。提供多个导热热交换器元件以提供期望的热性能，同时减少包装中的热应力。

7. 发明授权

US5926371A Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device 失效
标题翻译：传热装置，其适应横过表面安装半导体器件的上表面的高差
公开(公告)号：US5926371A
公开(公告)日：1999-07-20
申请号：US846001
申请日：1997-04-25
申请人： Thomas P. Dolbear
发明人： Thomas P. Dolbear
IPC分类号： H01L23/40 , H01L23/433 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0204 , H01L23/4006 , H01L23/433 , H01L2023/4043 , H01L2023/4062 , H01L2023/4068 , H01L2023/4087 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01012 , H01L2924/0102 , H01L2924/01046 , H01L2924/01055 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H05K1/0271 , H05K2201/10409 , H05K2201/10734 , H05K2201/2009 , H05K2203/1572
摘要： A heat transfer apparatus is presented accommodating elevational disparity of an upper surface of a semiconductor device with respect to the component side of a PCB without adversely affecting system reliability. The heat transfer apparatus includes a thermally conductive cap structure positioned between the semiconductor device and an ambient and thermally coupled to the semiconductor device. One embodiment includes one or more spacers which maintain a space between the cap structure and the semiconductor device. A chip mounted to the substrate of a ceramic BGA package is mechanically isolated from the cap structure by the spacers, preventing chip damage due to shock and vibration. A backing plate on a side of the PCB opposite the semiconductor device provides PCB structural support and additional heat transfer. Several fasteners attach the backing plate to the cap structure. A portion of the fasteners exert a force which urges the cap structure toward the semiconductor device, while the remainder of the fasteners fix the relative positions of the backing plate and the cap structure. Fixing the relative positions of the backing plate and the cap structure reduces creep problems and promotes stress relief in viscoplastic elements. A first thermal interface layer between the cap structure and the semiconductor device achieves an acceptably low thermal resistance value under a relatively small amount of pressure. The spacers are omitted in an alternate embodiment wherein the first thermal interface layer has a uniform thickness and a consistency which permits the thickness to be maintained during installation.
摘要翻译：本发明提供一种传热装置，其相对于PCB的组件侧适应半导体器件的上表面的高度差异，而不会不利地影响系统的可靠性。传热装置包括位于半导体器件和环境之间并热耦合到半导体器件的导热帽结构。一个实施例包括保持盖结构和半导体器件之间的空间的一个或多个间隔件。安装到陶瓷BGA封装的基板的芯片通过间隔物与盖结构机械隔离，防止由于冲击和振动引起的芯片损坏。在PCB的与半导体器件相对的一侧上的背板提供PCB结构支撑和额外的热传递。几个紧固件将背板连接到盖结构。紧固件的一部分施加一个推动帽结构朝向半导体器件的力，而其余的紧固件固定了背板和盖结构的相对位置。固定背板和盖结构的相对位置减少了蠕变问题，并促进了粘塑性元件的应力消除。帽结构和半导体器件之间的第一热界面层在相对较小的压力下实现可接受的低热阻值。在替代实施例中省略了间隔物，其中第一热界面层具有均匀的厚度和允许在安装期间保持厚度的稠度。

8. 发明授权

US5328087A Thermally and electrically conductive adhesive material and method of bonding with same 失效
标题翻译：导电粘合材料及其粘接方法
公开(公告)号：US5328087A
公开(公告)日：1994-07-12
申请号：US38420
申请日：1993-03-29
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , H01L21/58
CPC分类号： H01L24/29 , C09J9/02 , H01B1/22 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/29499 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425 , Y10T29/49126
摘要： The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.
摘要翻译：本发明公开了一种导热粘合剂材料，其包括硬化粘合剂，以及含有液体金属的非固化填料，其分散在粘合剂的分开间隔的区域中。硬化的粘合剂提供机械结合，而填料提供连续的热和电金属桥，每个桥延伸通过粘合剂并接触粘结表面。该方法包括（a）将含有液态金属的填料分散在未硬化的粘合剂中，（b）将未硬化的粘合剂和非固化状态的填料接触到表面，从而形成与两个表面接触的非固化填料的分开的间隔区域，和（c）硬化粘合剂。

9. 发明授权

US5170930A Liquid metal paste for thermal and electrical connections 失效
标题翻译：用于热和电连接的液态金属膏
公开(公告)号：US5170930A
公开(公告)日：1992-12-15
申请号：US791706
申请日：1991-11-14
申请人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
发明人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
IPC分类号： H01B1/02 , H01B1/16 , H01L23/48 , H01L23/482 , H01R4/58 , H01R13/03 , H05K3/34
CPC分类号： H05K3/3463 , H01B1/02 , H01B1/16 , H01L23/48 , H01L23/4828 , H01L24/29 , H01R13/03 , H01R4/58 , H01L2224/16 , H01L2224/16225 , H01L2224/29339 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83805 , H01L2224/8592 , H01L2924/01012 , H01L2924/01014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , H05K3/3484
摘要： A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.
摘要翻译：一种用于在两个表面之间进行可拆卸和顺应连接的导热和导电的膏体。糊状物包括导电液体金属和颗粒状固体成分的平衡混合物，其中在连接期间浆料的温度下，液态金属和颗粒状固体成分的比例保留在最终液相线和最终液相线的最终固相线之间混合物，糊状物不固化。在低温和低温环境中，糊状物与与接触表面匹配的TCE形成硬化粘结。

10. 发明授权

US08198723B1 Low inductance power distribution system for an integrated circuit chip 有权
标题翻译：用于集成电路芯片的低电感配电系统
公开(公告)号：US08198723B1
公开(公告)日：2012-06-12
申请号：US11003566
申请日：2004-12-03
申请人： Dennis J. Herrell , Thomas P. Dolbear
发明人： Dennis J. Herrell , Thomas P. Dolbear
IPC分类号： H01L23/52
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L2224/16225 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/19106 , H01L2924/3011 , H05K1/112 , H05K2201/10545 , H05K2201/10734 , H01L2224/0401
摘要： A low impedance electrical pathway from decoupling capacitance located on a circuit board to an integrated circuit chip. The integrated circuit includes multiple power and ground C4 bumps and is positioned on a first side of an integrated circuit carrier which is positioned on a first side of a circuit board. The integrated circuit carrier includes lateral conductors such as voltage and ground power planes. Power and ground carrier vias extend from the voltage and ground power planes, respectively, to the first side of the carrier, and power and ground subgroups of carrier vias extend from the voltage and ground power planes, respectively, to power and ground solder balls on a second side of the carrier. The circuit board includes power and ground plated through holes extending from contact pads on the first side of the circuit board to contact pads on a second side of the circuit board. Decoupling capacitors are positioned on the second side of the circuit board. The decoupling capacitors have positive and negative electrodes are electrically coupled to the power and ground plated through holes respectively. The C4 power and ground bumps, the power and ground carrier vias, the power and ground carrier via subgroups, the power and ground solder balls, the contact pads, the power and ground plated through holes, and the positive and negative electrodes are arranged in anti-parallel tessellations to reduce the inductance of a loop circuit from the decoupling capacitors to the integrated chip circuit.
摘要翻译：位于电路板上的去耦电容到集成电路芯片的低阻抗电路。集成电路包括多个电源和接地C4凸起，并且位于集成电路载体的位于电路板的第一侧上的第一侧上。集成电路载体包括诸如电压和接地电源平面的横向导体。电源和地面载体通孔分别从电压和接地电源平面延伸到载体的第一侧，载流子通孔的电源和接地子组分别从电压和接地电源平面延伸到电源和接地焊球上承运人的第二面。电路板包括从电路板的第一侧的接触焊盘延伸到电路板第二面上的接触焊盘的电源和接地电镀通孔。去耦电容器位于电路板的第二侧。去耦电容器具有正极和负极分别电耦合到电源和接地电镀通孔。 C4电源和接地突起，电源和接地载体通孔，电源和接地载体通过子组，电源和接地焊球，接触焊盘，电源和接地电镀通孔以及正极和负极布置在反平行镶嵌，以减少环路电路从去耦电容到集成芯片电路的电感。

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