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1. 发明授权

US4722060A Integrated-circuit leadframe adapted for a simultaneous bonding operation 失效
标题翻译：集成电路引线框架，适用于同时连接操作
公开(公告)号：US4722060A
公开(公告)日：1988-01-26
申请号：US592144
申请日：1984-03-22
申请人： Daniel J. Quinn , Robert H. Bond , Wayne A. Mulholland , Steven Swendrowski , Michael A. Olla , Jerry S. Cupples , Barbara R. Mozdzen , Linda S. Wilson , Linn Garrison
发明人： Daniel J. Quinn , Robert H. Bond , Wayne A. Mulholland , Steven Swendrowski , Michael A. Olla , Jerry S. Cupples , Barbara R. Mozdzen , Linda S. Wilson , Linn Garrison
IPC分类号： H01L23/48 , H01L23/495 , H01L23/50 , H01R9/09 , H01L23/00
CPC分类号： H01L23/49568 , H01L23/49541 , H01L24/01 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/3011 , Y10T29/49121
摘要： A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
摘要翻译：集成电路的引线框架包括暂时连接在阵列中的一组单独引线; 每个引线具有成形为标准形式的外部部分和形成为形成标准接触阵列的内部部分，并且具有与垂直于引线框架的平面的偏转相同的弹簧常数。

2. 外观设计

USD288922S Zero power random access memory package 失效
公开(公告)号：USD288922S
公开(公告)日：1987-03-24
申请号：US601906
申请日：1984-04-19
申请人： Michael A. Olla
设计人： Michael A. Olla

3. 发明授权

US5503948A Thin cell electrochemical battery system; and method of interconnecting multiple thin cells 失效
标题翻译：薄电池电化学电池系统; 以及互连多个细胞的方法
公开(公告)号：US5503948A
公开(公告)日：1996-04-02
申请号：US285055
申请日：1994-08-02
申请人： Colin A. MacKay , Michael A. Olla
发明人： Colin A. MacKay , Michael A. Olla
IPC分类号： H01M2/22 , H01M6/18 , H01M6/40 , H01M6/42 , H01M10/04
CPC分类号： H01M10/0436 , H01M2/22 , H01M6/181 , H01M6/40 , H01M6/42 , Y10T29/49108
摘要： Multicell system and method for making a multicell system. Systems include relatively thin (less than about 50 mil) electrochemical cells layered upon one another to minimize volume and weight. Cells systems are formed with cells that are layered such that first charge sides of each cell are coupled to first charge sides of other cells, and such that second charge sides of each cell are coupled to second charge sides of other cells. Cells and/or cell systems is connected to other cells and/or cell systems to form battery systems by layering cells such that a first charge side of a cell are coupled to second charge side of another cell. In this manner the number of electrically insulating separators is reduced, thereby also reducing weight and volume of resulting systems.
摘要翻译：用于制造多单元系统的多芯片系统和方法。系统包括彼此分层的较薄（小于约50密耳）的电化学电池，以使体积和重量最小化。单元系统由分层的单元形成，使得每个单元的第一电荷侧耦合到其它单元的第一电荷侧，并且使得每个单元的第二电荷侧耦合到其它单元的第二电荷侧。细胞和/或细胞系统连接到其它细胞和/或细胞系统以通过分层细胞形成电池系统，使得细胞的第一电荷侧耦合到另一细胞的第二电荷侧。以这种方式，电绝缘隔板的数量减少，从而也减少了所得系统的重量和体积。

4. 发明授权

US5182851A Method for holding a strip of conductive lead frames 失效
标题翻译：用于保持导电引线框的条带的方法
公开(公告)号：US5182851A
公开(公告)日：1993-02-02
申请号：US796419
申请日：1991-11-22
申请人： Robert H. Bond , Michael A. Olla , Barry Morrison , Linn C. Garrison
发明人： Robert H. Bond , Michael A. Olla , Barry Morrison , Linn C. Garrison
IPC分类号： H01L21/60 , H01L21/68 , H01L23/495
CPC分类号： H01L21/6835 , H01L23/49537 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , Y10T29/49121 , Y10T29/53178
摘要： A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
摘要翻译：一种引线框载体和插入件，其与可与可选择的多个半导体芯片结合的温度可变，可扩展和可收缩的引线框条兼容，所述载体在制造期间相对于所述插入件自动可分离和移除，尽管可能的粘附可能由所述载体插入物的膨胀和收缩。

5. 发明授权

US4915565A Manipulation and handling of integrated circuit dice 失效
标题翻译：集成电路骰子的操作和处理
公开(公告)号：US4915565A
公开(公告)日：1990-04-10
申请号：US325014
申请日：1989-03-16
申请人： Robert H. Bond , Steven Swendrowski , Michael A. Olla , Barry L. Morrison
发明人： Robert H. Bond , Steven Swendrowski , Michael A. Olla , Barry L. Morrison
IPC分类号： H01L21/00 , H01L21/683
CPC分类号： H01L21/67144 , H01L21/6838 , Y10S156/942 , Y10T156/1771 , Y10T29/53178 , Y10T29/53261 , Y10T74/18296
摘要： An apparatus for inverting and handling integrated circuit dice employs rotating apparatus for rotating a chip carrier by 180 degrees to invert and transfer dice from one set of receptacles to another; together with an apparatus for precisely aligning dice resting at random positions within a set of oversized receptacles.
摘要翻译：用于反转和处理集成电路骰子的装置采用旋转装置，用于将芯片载体旋转180度，以将骰子从一组插座转移到另一组; 以及用于精确对准在一组超大容器内的随机位置休息的骰子的装置。

6. 发明授权

US5065504A Method of forming flexible metal leads on integrated circuits 失效
标题翻译：在集成电路上形成柔性金属引线的方法
公开(公告)号：US5065504A
公开(公告)日：1991-11-19
申请号：US608769
申请日：1990-11-05
申请人： Michael A. Olla
发明人： Michael A. Olla
IPC分类号： H01L21/00 , H01L21/60 , H01L23/498
CPC分类号： H01L24/86 , H01L21/67144 , H01L23/4985 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , Y10T29/49121 , Y10T29/49213 , Y10T29/5193
摘要： Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.
摘要翻译：滑动成型带 - 自动粘合引线，从具有支撑环的集成电路芯片延伸到芯片外周和引线外引线之间。在引线形成之后，支撑环保持附接到与芯片相对的引线的垂直部分。本发明非常适合于在相对长的TAB引线上进行最小化和占用，该TAB引线扇出并需要支撑环来保持适当的引线间距。

7. 发明授权

US4685998A Process of forming integrated circuits with contact pads in a standard array 失效
标题翻译：在标准阵列中形成具有接触焊盘的集成电路的过程
公开(公告)号：US4685998A
公开(公告)日：1987-08-11
申请号：US917040
申请日：1986-10-09
申请人： Quinn, Daniel J. , Wayne A. Mulholland , Robert H. Bond , Michael A. Olla , Jerry S. Cupples , Ilya L. Tsitovsky , Barbara R. Mozdzen , Charles F. Held , Linda S. Wilson , Yen T. Nguyen
发明人： Quinn, Daniel J. , Wayne A. Mulholland , Robert H. Bond , Michael A. Olla , Jerry S. Cupples , Ilya L. Tsitovsky , Barbara R. Mozdzen , Charles F. Held , Linda S. Wilson , Yen T. Nguyen
IPC分类号： H01L21/60 , H01L23/485 , H01L25/16 , B44C1/22 , B29C37/00 , H01L23/48 , H01L29/44
CPC分类号： H01L25/16 , H01L24/05 , H01L2224/0401 , H01L2224/16 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L24/45 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , Y10T29/49121
摘要： An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.
摘要翻译：集成电路芯片包括由导电通孔渗透的电介质顶层，该导电通孔连接到设置在电介质层顶部上的电引线网络内的集成电路内的电触点; 引线网络又连接到适于同时焊接到引线框架的接触焊盘阵列。

8. 发明授权

US4627151A Automatic assembly of integrated circuits 失效
标题翻译：集成电路自动组装
公开(公告)号：US4627151A
公开(公告)日：1986-12-09
申请号：US592185
申请日：1984-03-22
申请人： Wayne A. Mulholland , Daniel J. Quinn , Robert H. Bond , Michael A. Olla
发明人： Wayne A. Mulholland , Daniel J. Quinn , Robert H. Bond , Michael A. Olla
IPC分类号： H01L21/50 , H01L21/00 , H01L21/60 , H05K13/04 , H01L21/28
CPC分类号： H01L21/67144 , H01L21/67126 , H05K13/0478 , H01L2224/16225 , H01L2924/13091 , Y10T29/49128
摘要： A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
摘要翻译：用于集成电路的组装和封装的系统采用具有标准阵列中的接触焊盘的电路管芯; 具有构造成具有相同弹簧常数的引线的引线框架; 在计算机控制下从晶片阵列中去除所选择的骰子的方法; 以及将所有导线同时结合到模具的方法。

9. 发明授权

US5574814A Parallel optical transceiver link 失效
标题翻译：并行光收发器链路
公开(公告)号：US5574814A
公开(公告)日：1996-11-12
申请号：US381168
申请日：1995-01-31
申请人： Kenneth C. Noddings , Robert C. Gardner , Thomas J. Hirsch , Charles L. Spooner , Michael A. Olla , Jason J. Yu
发明人： Kenneth C. Noddings , Robert C. Gardner , Thomas J. Hirsch , Charles L. Spooner , Michael A. Olla , Jason J. Yu
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4231 , G02B6/4249
摘要： An assembly of an optical interconnect module adaptable for mating with an optical connector having at least one optical fiber and an alignment pin. A method of assembly includes the steps of (1) mounting an optical device onto a connector body, wherein the connector body is a portion of the optical interconnect module, and wherein the optical device is operable for transmitting or receiving optical signals to/from the optical fiber, (2) inputting a relative position between the alignment pin and an end of the optical fiber, (3) and forming a slot in the connector body by using the measured relative position between the alignment pin and the end of the optical fiber, wherein a relative position between the slot and the optical transceiver mirrors the relative position between the alignment pin and the end of the optical fiber so that the optical device and the end of the optical fiber are substantially aligned to permit transmission of the optical signals when the optical connector and the optical interconnect module are mated, wherein the slot is adaptable for receiving the alignment pin.
摘要翻译：光学互连模块的组件，其适于与具有至少一个光纤和对准销的光学连接器配合。一种组装方法包括以下步骤：（1）将光学装置安装到连接器主体上，其中连接器主体是光互连模块的一部分，并且其中光学装置可操作用于向/从光纤，（2）在对准销和光纤端部之间输入相对位置，（3）并且通过使用测量的对准销与光纤端部之间的相对位置在连接器主体中形成槽，其中所述槽和所述光收发器之间的相对位置反映所述对准引脚和所述光纤端部之间的相对位置，使得所述光学器件和所述光纤的端部基本上对准以允许所述光信号的传输，光学连接器和光学互连模块配合，其中槽适于接收对准销。

10. 发明授权

US5309321A Thermally conductive screen mesh for encapsulated integrated circuit packages 失效
标题翻译：用于封装集成电路封装的导热筛网
公开(公告)号：US5309321A
公开(公告)日：1994-05-03
申请号：US949300
申请日：1992-09-22
申请人： Michael A. Olla , Thomas P. Dolbear , Seyed H. Hashemi
发明人： Michael A. Olla , Thomas P. Dolbear , Seyed H. Hashemi
IPC分类号： H01L23/29 , H01L23/373 , H01L23/433 , H01L23/552 , H05K7/20
CPC分类号： H01L23/293 , H01L23/3733 , H01L23/4334 , H01L23/552 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025
摘要： An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.
摘要翻译：一种封装的集成电路封装，其具有集成电路芯片，其中连接有多个电引线和至少一个邻近芯片定位的导热屏蔽网。非导电的热固性或热塑性材料形成包围芯片并结合到筛网的壳体。优选地，一个层暴露于壳体的外部，并且筛网被固定到支撑芯片的基板上。

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