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    • 2. 发明授权
    • Active pixel image cell with embedded memory and pixel level signal
processing capability
    • 有源像素图像单元具有嵌入式存储器和像素级信号处理能力
    • US5962844A
    • 1999-10-05
    • US923370
    • 1997-09-03
    • Richard Billings MerrillAlbert BergemontMin-hwa Chi
    • Richard Billings MerrillAlbert BergemontMin-hwa Chi
    • H01L27/146H04N5/3745H04N5/378H01L27/148H04N5/335
    • H04N3/155H01L27/14609
    • An active pixel image cell which includes a photosensor and an embedded memory element and may be used to produce signals corresponding to the photosensor outputs for successive frames. The structure of the active pixel cell includes an analog, non-volatile, or dynamic memory element and the control elements needed to store the output of the photosensor generated during a previous frame. The pixel elements then generate a signal representing the current frame output of the photosensor. The current frame output and previous frame output are then provided as output signals for the pixel and may be subjected to off-pixel processing as desired. For example, the two values may be subtracted from one another by an off-pixel difference amplifier to form a signal representing the difference between the image on the photodiode sensor of the pixel between successive frames. The difference signal may then be used for purposes of video compression, motion detection, or image stabilization.
    • 一种有源像素图像单元,其包括光电传感器和嵌入式存储元件,并且可用于产生对应于用于连续帧的光电传感器输出的信号。 有源像素单元的结构包括模拟,非易失性或动态存储器元件以及存储在先前帧期间产生的光电传感器的输出所需的控制元件。 然后,像素元件产生表示光电传感器的当前帧输出的信号。 然后将当前帧输出和先前帧输出提供为像素的输出信号,并且可以根据需要进行离像像素处理。 例如,两个值可以由离像素差分放大器彼此减去以形成表示连续帧之间的像素的光电二极管传感器上的图像之间的差的信号。 然后差分信号可以用于视频压缩,运动检测或图像稳定的目的。
    • 4. 发明授权
    • Single poly EPROM cell having smaller size and improved data retention compatible with advanced CMOS process
    • 单个聚EPROM单元具有较小的尺寸和改进的数据保留,与先进的CMOS工艺兼容
    • US06509606B1
    • 2003-01-21
    • US09053199
    • 1998-04-01
    • Richard B. MerrillAlbert BergemontMin-hwa Chi
    • Richard B. MerrillAlbert BergemontMin-hwa Chi
    • H01L29788
    • H01L29/7883G11C2216/10H01L27/115
    • Leakage of a single-poly EPROM cell is prevented by eliminating field oxide isolating the source, channel, and drain from the control gate n-well, and by replacing field oxide surrounding the cell with a heavily doped surface isolation region. The EPROM cell also utilizes a floating gate having an open-rectangular floating gate portion over the control gate region, and a narrow floating gate portion over the channel and intervening silicon substrate. The surface area of the open-rectangular floating gate portion ensures a high coupling ratio with the control gate region. The small width of the narrow floating gate portion prevents formation of a sizeable leakage path between the n-well and the source, channel, and drain. To conserve surface area, the EPROM cell also eliminates the p+ contact region and the PLDD region in the control gate well of the conventional EPROM design. This is permitted because the VTp implant step is masked, permitting the control gate region to operate in accumulation mode during application of 5V programming voltages.
    • 通过消除从控制栅极n阱分离源极,沟道和漏极的场氧化物,并且通过用重掺杂的表面隔离区域代替围绕电池的场氧化物来防止单聚EPROM单元的泄漏。 EPROM单元还利用在控制栅极区域上具有开放矩形浮动栅极部分的浮动栅极,以及在沟道上方的窄浮动栅极部分和中间的硅衬底。 开放式矩形浮动栅极部分的表面积确保与控制栅极区域的高耦合率。 窄浮动栅极部分的小宽度防止在n阱和源极,沟道和漏极之间形成相当大的泄漏路径。 为了节省表面积,EPROM单元还消除了常规EPROM设计中控制栅极中的p +接触区域和PLDD区域。 这是允许的,因为VTp注入步骤被屏蔽,允许控制栅极区域在施加5V编程电压期间以累积模式工作。
    • 6. 发明授权
    • Method of fabricating a high density EEPROM cell
    • 制造高密度EEPROM单元的方法
    • US5856222A
    • 1999-01-05
    • US851252
    • 1997-05-05
    • Albert BergemontMin-hwa Chi
    • Albert BergemontMin-hwa Chi
    • H01L21/8247
    • H01L27/11521H01L27/11524
    • A method of fabricating an EEPROM cell structure in a semiconductor substrate includes forming a layer of silicon oxide having a first thickness on the silicon substrate. N-type dopant is then introduced into the semiconductor substrate to define a buried region beneath the silicon oxide layer. Next, a tunnel window opening is formed in the silicon oxide layer to expose a surface area of the buried region. A layer of tunnel oxide is then grown in the tunnel window opening on the exposed surface of the buried region, such that the tunnel oxide has a thickness that is less than the thickness of the silicon oxide. A first layer of polysilicon is then formed on the structure resulting from the foregoing steps, followed by an overlaying layer of oxide.backslash.nitride.backslash.oxide (ONO) and an overlying layer of second polysilicon. The poly-2, ONO.backslash.poly-1 sandwich is then anisotropically etched to form first and second stacks which provide the floating gate/control gate electrodes for the EEPROM cell access transistor and the EEPROM cell storage cell structure, respectively.
    • 在半导体衬底中制造EEPROM单元结构的方法包括在硅衬底上形成具有第一厚度的氧化硅层。 然后将N型掺杂剂引入半导体衬底中以限定氧化硅层下面的掩埋区域。 接下来,在氧化硅层中形成隧道窗口以露出掩埋区域的表面区域。 然后在掩埋区域的暴露表面上的隧道窗口中生长隧道氧化物层,使得隧道氧化物的厚度小于氧化硅的厚度。 然后在由上述步骤产生的结构上形成第一层多晶硅,随后是氧化物+ 544氮化物+ 544氧化物(ONO)的覆盖层和第二多晶硅的上覆层。 然后各向异性地蚀刻poly-2,ONO + 544 poly-1夹层以形成分别为EEPROM单元存取晶体管和EEPROM单元存储单元结构提供浮置栅极/控制栅电极的第一和第二堆叠。