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1. 发明授权

US5288842A Morphological composite materials formed from different precursors 失效
标题翻译：形态复合材料由不同的前体形成
公开(公告)号：US5288842A
公开(公告)日：1994-02-22
申请号：US647957
申请日：1991-01-30
申请人： Claudius Feger , Rodney T. Hodgson , David A. Lewis , Ravi Saraf
发明人： Claudius Feger , Rodney T. Hodgson , David A. Lewis , Ravi Saraf
IPC分类号： C08G59/18 , B01D71/64 , B32B27/00 , C08G8/00 , C08G8/06 , C08G18/70 , C08G18/80 , C08G85/00 , C08J5/00 , C08J5/18 , C08L75/00 , C08L75/04 , C08L79/08 , C08L101/00 , D01F6/94 , C08G69/26
CPC分类号： C08G18/701 , C08G18/8074 , C08J5/00 , C08L101/00 , C08L79/08 , C08G2250/00 , Y10T428/31511 , Y10T428/31551 , Y10T428/31612 , Y10T428/31721 , Y10T428/31855
摘要： A method of producing a multiphase polymer is disclosed whereby the phases have the same chemical structure but have different morphological states and thus different properties. This is achieved by forming a mixture of precursors of the polymer, at least one of the precursors having a reaction rate higher than the other precursor or precursors in the mixture. The precursor having the highest reaction rate is then converted to obtain a composite of a polymer and the precursors that are not polymerized. This mixture might also be formed by mixing a soluble polymer with its precursor. The polymer/precursor composite is processed to obtain the structure having different morphological states by either choosing the reaction conditions to convert the unconverted different morphological states by either choosing the reaction conditions to convert the unconverted precursors such that the obtained polymer differs in it morphology/ properties from the first obtained polymer or by applying stress to the composite and then converting the still unreacted precursor or precursors in the composite such that different morphological states are obtained.
摘要翻译：公开了制备多相聚合物的方法，其中相具有相同的化学结构，但具有不同的形态和因此具有不同的性质。这通过形成聚合物的前体的混合物来实现，至少一种前体的反应速率高于混合物中的其它前体或前体。然后将具有最高反应速率的前体转化成聚合物和未聚合的前体的复合物。该混合物也可以通过将可溶性聚合物与其前体混合而形成。通过选择反应条件以转化未转化的前体使得所得聚合物的形态/性质不同，通过选择反应条件以转化未转化的不同形态状态，处理聚合物/前体复合物以获得具有不同形态的结构从第一获得的聚合物或通过对复合材料施加应力，然后转化复合材料中的未反应的前体或前体，使得获得不同的形态。

2. 发明授权

US08938627B2 Multilayer securing structure and method thereof for the protection of cryptographic keys and code 有权
标题翻译：多层安全结构及其方法，用于保护加密密钥和密码
公开(公告)号：US08938627B2
公开(公告)日：2015-01-20
申请号：US13382814
申请日：2010-04-13
申请人： Stefano S. Oggioni , Vincenzo Condorelli , Claudius Feger
发明人： Stefano S. Oggioni , Vincenzo Condorelli , Claudius Feger
IPC分类号： G06F21/00 , G06F21/87
CPC分类号： G06F21/87 , G06F2221/2107 , G06F2221/2131 , H01L23/576 , H01L2224/16225 , Y10S257/922
摘要： An arrangement for the protection of cryptographic keys and codes from being compromised by external tampering, wherein the arrangement is utilized within a multilayered securing structure. More particularly, there is provided a multilayered securing structure for the protection of cryptographic keys and codes, which may be subject to potential tampering when employed in computers and/or telecommunication systems. A method is provided for producing such multilayered securing structures within a modular substrate with the intent to protect cryptographic keys and codes which are employed in computers and/or telecommunication systems from the dangers of potential tampering or unauthorized access.
摘要翻译：用于保护加密密钥和代码免受外部篡改损害的布置，其中该布置在多层固定结构内使用。更具体地，提供了一种用于保护加密密钥和代码的多层固定结构，当在计算机和/或电信系统中使用密钥和密码时，可能会受到潜在的篡改。提供了一种用于在模块化基板内制造这种多层固定结构的方法，其目的是保护在计算机和/或电信系统中使用的加密密钥和代码免受潜在篡改或未授权访问的危险。

3. 发明授权

US08496159B2 Injection molded solder process for forming solder bumps on substrates 失效
标题翻译：用于在基板上形成焊料凸块的注塑焊接工艺
公开(公告)号：US08496159B2
公开(公告)日：2013-07-30
申请号：US13154412
申请日：2011-06-06
申请人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
发明人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
IPC分类号： B23K3/00 , B23K3/06
CPC分类号： B23K1/0016 , B23K1/20 , B23K3/0623 , B23K2101/42 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68372 , H01L2224/03464 , H01L2224/0401 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11002 , H01L2224/11312 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11902 , H01L2224/13023 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14505 , H01L2224/16237 , H01L2224/94 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.
摘要翻译：通过使用注射成型的焊料在基板上设置均匀高度的焊料凸块。在图案化的光致抗蚀剂层的通道内的I / O焊盘上形成铜柱或极限极限冶金。焊料注入柱子或BLM，填充通道。允许不含焊剂的焊料固化。它形成相同高度的多个焊料结构（凸块）。焊接注入和固化优选在氮气环境或形成气体环境中进行。可以使用容纳这种晶片和填充头的载体组件将熔融焊料注入到以圆形晶片形成的通道中而不会溢出。

4. 发明授权

US08408448B1 Forming constant diameter spherical metal balls 失效
标题翻译：形成恒定直径球形金属球
公开(公告)号：US08408448B1
公开(公告)日：2013-04-02
申请号：US13371431
申请日：2012-02-11
申请人： Claudius Feger , Peter Alfred Gruber , Mark Harrison McLeod , Jae-Woong Nah
发明人： Claudius Feger , Peter Alfred Gruber , Mark Harrison McLeod , Jae-Woong Nah
IPC分类号： B23K31/02
CPC分类号： B23K3/0623 , B23K3/08 , B23K35/0244
摘要： A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.
摘要翻译：描述了用于形成球形金属球的工艺和工具，其包括模具，注射成型焊料，液体或气体环境以减少或去除金属氧化物和金属在加热的液体或气体中的无约束回流以及熔融金属在较冷液体中的固化或气体。

5. 发明申请

US20120305631A1 INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES 有权
标题翻译：注射成型焊接工艺，用于在基材上形成焊膏
公开(公告)号：US20120305631A1
公开(公告)日：2012-12-06
申请号：US13525855
申请日：2012-06-18
申请人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
发明人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
IPC分类号： B23K31/02 , B23K1/20
CPC分类号： B23K1/0016 , B23K1/20 , B23K3/0623 , B23K2101/42 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68372 , H01L2224/03464 , H01L2224/0401 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11002 , H01L2224/11312 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11902 , H01L2224/13023 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14505 , H01L2224/16237 , H01L2224/94 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.
摘要翻译：通过使用注射成型的焊料在基板上设置均匀高度的焊料凸块。在图案化的光致抗蚀剂层的通道内的I / O焊盘上形成铜柱或极限极限冶金。焊料注入柱子或BLM，填充通道。允许不含焊剂的焊料固化。它形成相同高度的多个焊料结构（凸块）。焊接注入和固化优选在氮气环境或形成气体环境中进行。可以使用容纳这种晶片和填充头的载体组件将熔融焊料注入到以圆形晶片形成的通道中而不会溢出。

6. 发明授权

US07776993B2 Underfilling with acid-cleavable acetal and ketal epoxy oligomers 有权
标题翻译：用酸可分解的缩醛和缩酮环氧低聚物填充
公开(公告)号：US07776993B2
公开(公告)日：2010-08-17
申请号：US11154794
申请日：2005-06-15
申请人： Stephen Leslie Buchwalter , Claudius Feger , Gareth Hougham , Nancy LaBianca , Hosadurga Shobha
发明人： Stephen Leslie Buchwalter , Claudius Feger , Gareth Hougham , Nancy LaBianca , Hosadurga Shobha
IPC分类号： C07D303/32 , C08G2/30 , C08K3/36 , C08L59/00 , C08L61/02 , C08L63/00 , H01L21/56
CPC分类号： C08G65/2654 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/94 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , Y10T428/12528 , Y10T428/31511 , H01L2924/00 , H01L2224/27 , H01L2224/11 , H01L2224/0401
摘要： A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.
摘要翻译：可重复使用的热固性环氧树脂材料，其允许可重复组装，例如可再加工的晶片级底部填充的微电子封装。使用该材料在形成微电子封装中使用可再加工热固性材料的方法。

7. 发明申请

US20090181476A1 Assembly Method For Reworkable Chip Stacking With Conductive Film 审中-公开
标题翻译：带导电膜的可重复芯片堆叠的装配方法
公开(公告)号：US20090181476A1
公开(公告)日：2009-07-16
申请号：US11972129
申请日：2008-01-10
申请人： Stephen L. Buchwalter , Bing Dang , Claudius Feger , Peter A. Gruber , John Knickerbocker
发明人： Stephen L. Buchwalter , Bing Dang , Claudius Feger , Peter A. Gruber , John Knickerbocker
IPC分类号： H01L21/02
CPC分类号： H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06596 , H01L2924/0002 , H01L2924/00
摘要： A method of stacking a chip, including an integrated circuit, onto a substrate including applying an anisotropic conductive film (ACF) or a solder-filled conductive film onto a surface thereof, the surface being configured to electrically couple to the film, placing the chip onto the film, the chip being configured to electrically couple to the film, compressively pressurizing the chip, the film and the surface such that the chip is electrically coupled to the surface via the film,, testing the chip to determine whether the chip is operating normally, reworking the placement of the chip onto the film and repeating the compressive pressurization if the chip is determined to not be operating normally, repeating the testing to determine whether the chip is operating normally, and once the chip is determined to be operating normally, bonding the chip, the film and the surface.
摘要翻译：一种将包括集成电路的芯片堆叠在基板上的方法，包括将各向异性导电膜（ACF）或焊料填充导电膜施加到其表面上，该表面被配置为电耦合到膜，将芯片芯片被配置为电耦合到膜，对芯片，膜和表面进行压缩加压，使得芯片经由膜电耦合到表面，测试芯片以确定芯片是否正在操作通常，如果芯片被确定为不正常工作，重复测试以确定芯片是否正常工作，并且一旦芯片确定正常工作，则将芯片放置在膜上并重复压缩加压，粘合芯片，薄膜和表面。

8. 发明申请

US20090032962A1 CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WITH POWDERED MATERIALS FOR CIRCUIT FORMATION 有权
标题翻译：用于电路形成的粉末状材料填充高倍率微孔玻璃的离心方法
公开(公告)号：US20090032962A1
公开(公告)日：2009-02-05
申请号：US12247894
申请日：2008-10-08
申请人： Gareth Hougham , Leena P. Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
发明人： Gareth Hougham , Leena P. Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
IPC分类号： H01L23/52 , H01L21/44 , B04B11/00
CPC分类号： H05K3/4053 , B05D1/002 , H01L21/486 , H01L21/76898 , H05K2201/09509 , H05K2203/1554
摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
摘要翻译：本公开一般涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，糊料，材料悬浮液，用作导电，结构支撑或电子部件的保护构件。

9. 发明申请

US20070025669A1 Apparatus and methods for remakeable connections to optical waveguides 失效
标题翻译：用于与光波导重新连接的装置和方法
公开(公告)号：US20070025669A1
公开(公告)日：2007-02-01
申请号：US11540268
申请日：2006-09-30
申请人： Claudius Feger , Philip Hobbs , Maurice McGlashan-Powell
发明人： Claudius Feger , Philip Hobbs , Maurice McGlashan-Powell
IPC分类号： G02B6/44 , G02B6/34
CPC分类号： G02B6/2821 , G02B6/02 , G02B6/02033 , G02B6/03622 , G02B6/283 , G02B6/29316 , G02B6/421 , G02B6/4249
摘要： A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要翻译：描述了具有由包含内软层和外硬层的覆层围绕的芯的单模光波导。外层在其内表面具有光栅结构，其空间频率与导向模式相同。内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，使得通常不会导致光的外耦合。通过将两个这样的波导以一定角度交叉并将它们压在一起而形成连接。这导致两个波导的变形，使得光栅与芯接近。光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。

10. 发明授权

US07116865B2 Apparatus and methods for remakeable connections to optical waveguides 失效
标题翻译：用于与光波导重新连接的装置和方法
公开(公告)号：US07116865B2
公开(公告)日：2006-10-03
申请号：US10315766
申请日：2002-12-10
申请人： Claudius Feger , Philip O. D. Hobbs , Maurice McGlashan-Powell
发明人： Claudius Feger , Philip O. D. Hobbs , Maurice McGlashan-Powell
IPC分类号： G02B6/16
CPC分类号： G02B6/2821 , G02B6/02 , G02B6/02033 , G02B6/03622 , G02B6/283 , G02B6/29316 , G02B6/421 , G02B6/4249
摘要： A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要翻译：描述了具有由包含内软层和外硬层的覆层围绕的芯的单模光波导。外层在其内表面具有光栅结构，其空间频率与导向模式相同。内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，使得通常不会导致光的外耦合。通过将两个这样的波导以一定角度交叉并将它们压在一起而形成连接。这导致两个波导的变形，使得光栅与芯接近。光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。

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