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1. 发明授权

US5455459A Reconstructable interconnect structure for electronic circuits 失效
标题翻译：电子电路的可重构互连结构
公开(公告)号：US5455459A
公开(公告)日：1995-10-03
申请号：US250329
申请日：1994-06-09
申请人： Raymond A. Fillion , Herbert S. Cole, Jr.
发明人： Raymond A. Fillion , Herbert S. Cole, Jr.
IPC分类号： H01L23/538 , H01L25/065 , H01L23/02
CPC分类号： H01L24/24 , H01L23/5389 , H01L24/82 , H01L25/0655 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19042 , H01L2924/19043
摘要： A reconstructible electrical circuit module includes a substrate, at least one electrical circuit component and an electrical interconnection structure. The electrical interconnection structure includes at least one multiple ply sequence stacked over the component and substrate in which the portion of the module underlying a ply in the electrical interconnection structure is substantially unimpairable by a process for removing that ply.
摘要翻译：可重构的电路模块包括衬底，至少一个电路部件和电互连结构。电互连结构包括堆叠在部件和基板上的至少一个多层序列，其中在电互连结构中的层下方的模块部分通过用于去除该层的工艺基本上不可修复。

2. 发明授权

US5315486A Hermetically packaged HDI electronic system 失效
标题翻译：密封HDI电子系统
公开(公告)号：US5315486A
公开(公告)日：1994-05-24
申请号：US73250
申请日：1993-06-07
申请人： Raymond A. Fillion , William P. Kornrumpf , Edward S. Bernard
发明人： Raymond A. Fillion , William P. Kornrumpf , Edward S. Bernard
IPC分类号： H01L23/02 , H01L23/057 , H01L23/10 , H01L23/12 , H01L23/13 , H01L23/50 , H01L23/538 , H01L25/04 , H01L25/18 , H01L23/053 , H01L23/055 , H05K1/16
CPC分类号： H01L23/538 , H01L23/057 , H01L23/10 , H01L23/13 , H01L23/5384 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011
摘要： A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.
摘要翻译：特别适用于高密度互连（HDI）电子系统的气密封装采用陶瓷衬底，其用作气密封装的底座。衬底包括共烧体，其包括掩埋导体，其提供一组内部接触点之间的电连续性，以及桥接密封环的一组外部接触点，该密封环包括密封封装盖的焊接密封件或可焊接密封件。外部接触点可以直接连接到引线框架。引线框引线在断开之后可以直接连接到印刷电路板。

3. 发明授权

US5324987A Electronic apparatus with improved thermal expansion match 失效
标题翻译：具有改善的热膨胀匹配的电子设备
公开(公告)号：US5324987A
公开(公告)日：1994-06-28
申请号：US45753
申请日：1993-04-14
申请人： Charles D. Iacovangelo , Raymond A. Fillion , James F. Burgess
发明人： Charles D. Iacovangelo , Raymond A. Fillion , James F. Burgess
IPC分类号： H01L23/373 , H01L23/02 , H01L39/02
CPC分类号： H01L23/3732 , H01L2924/0002
摘要： Differences in thermal expansion properties between integrated circuit chips, especially of gallium arsenide, and the dielectric substrates (especially diamond and aluminum nitride) on which said chips are mounted are accommodated by interposing between the substrate and the chip a base having diamond pedestals in combination with a material of higher coefficient of thermal expansion than the substrate, typically a metal such as copper or tungsten. The base may be integral with a diamond substrate or may be a shim interposed between the substrate and the chip.
摘要翻译：集成电路芯片（特别是砷化镓）和安装有所述芯片的电介质基板（特别是金刚石和氮化铝）之间的热膨胀特性的差异通过将衬底和芯片之间插入具有金刚石基座的基座来结合比基板高的热膨胀系数的材料，通常是诸如铜或钨的金属。基底可以与金刚石基底成一体，或者可以是衬底和芯片之间的垫片。

4. 发明授权

US5291066A Moisture-proof electrical circuit high density interconnect module and method for making same 失效
标题翻译：防潮电路高密度互连模块及其制造方法
公开(公告)号：US5291066A
公开(公告)日：1994-03-01
申请号：US791690
申请日：1991-11-14
申请人： Constantine A. Neugebauer , Herbert S. Cole , Eugene L. Bartels , Raymond A. Fillion
发明人： Constantine A. Neugebauer , Herbert S. Cole , Eugene L. Bartels , Raymond A. Fillion
IPC分类号： H01L23/00 , H01L23/10 , H01L23/538 , H01L23/02
CPC分类号： H01L23/564 , H01L23/10 , H01L23/538 , H01L23/5383 , H01L23/5384 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041
摘要： A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the module substrate, and each sequence includes a dielectric film and a plurality of lands comprised of metal that extends into the vias of the sequence to provide electrical interconnections. The module includes at least one moisture barrier film to prevent penetration of moisture through the module to the circuit component(s).
摘要翻译：一种防潮集成电路模块包括至少一个集成电路部件，该集成电路部件是通过在其中连续施加多个通孔的衬底施加到衬底上而制造的高密度互连（HDI）结构。序列覆盖在组件和模块衬底上，并且每个序列包括介电膜和由金属组成的多个焊盘，其延伸到序列的通孔中以提供电互连。模块包括至少一个防潮膜，以防止湿气穿过模块穿过电路部件。

5. 发明授权

US5691598A Fluorescent lamp with thermal heat shield between lamp tube and ballast circuitry 失效
标题翻译：荧光灯与灯管和镇流器电路之间的热隔离屏蔽
公开(公告)号：US5691598A
公开(公告)日：1997-11-25
申请号：US569019
申请日：1995-12-07
申请人： Kelvin B. Belle , Leon F. Chamberlain , Raymond A. Fillion , Jozsef Fulop , David J. Kachmarik , Donald W. Kuk , Robert S. McFeely , Ferenc Papp , Istvan Wursching
发明人： Kelvin B. Belle , Leon F. Chamberlain , Raymond A. Fillion , Jozsef Fulop , David J. Kachmarik , Donald W. Kuk , Robert S. McFeely , Ferenc Papp , Istvan Wursching
IPC分类号： H01J61/04 , H01J61/32 , H01J61/56 , H01J1/62 , H01J1/02 , H01J7/24 , H01J63/04
CPC分类号： H01J61/56 , H01J61/045 , H01J61/327
摘要： A fluorescent lamp includes a lamp tube having first and second ends and containing fill materials for causing light generation when provided with electrical power. The lamp further includes first and second power-transferring means at the first and second ends of the lamp tube, respectively, for providing the fill materials in the lamp tube with electrical power. Also included is a thermal heat shield separating the first power-transferring means from ballast circuitry which supplies power to the first power-transferring means and which has a lifetime that becomes substantially less as its operating temperature increases. The thermal heat shield is constructed so that it reflects back to the first power-transferring means and any adjacent portion of the lamp tube sufficient radiant energy to reduce the operating temperature of the ballast circuitry by more than about one degree Celsius compared with the absence of the heat shield.
摘要翻译：荧光灯包括具有第一端和第二端的灯管，并且当设置有电力时包含用于使光产生的填充材料。该灯还包括分别在灯管的第一和第二端处的第一和第二电力传递装置，用于在灯管中提供具有电功率的填充材料。还包括将第一功率传输装置与将功率供应到第一功率传输装置的镇流器电路分离的热隔离屏蔽层，其寿命随其工作温度的升高而变得明显较小。热隔离罩被构造成使得其反射回第一电力传递装置和灯管的任何相邻部分的足够的辐射能量，以将镇流器电路的操作温度降低超过约1摄氏度，而不存在隔热罩。

6. 发明授权

US5637922A Wireless radio frequency power semiconductor devices using high density interconnect 失效
标题翻译：无线射频功率半导体器件采用高密度互连
公开(公告)号：US5637922A
公开(公告)日：1997-06-10
申请号：US192533
申请日：1994-02-07
申请人： Raymond A. Fillion , Otward M. Mueller , James F. Burgess
发明人： Raymond A. Fillion , Otward M. Mueller , James F. Burgess
IPC分类号： H01L23/482 , H01L23/498 , H01L23/66 , H01L23/34 , H01L23/053
CPC分类号： H01L24/41 , H01L23/4824 , H01L23/49844 , H01L23/4985 , H01L23/49861 , H01L23/66 , H01L24/24 , H01L24/25 , H01L24/40 , H01L24/82 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/32225 , H01L2224/40225 , H01L2224/73267 , H01L2224/83801 , H01L24/83 , H01L25/072 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107
摘要： A power device component package includes a substrate supporting a drain lead, a source lead, and a gate lead. Each of the leads comprises an electrically conductive material having a thickness sufficient to form a high current contact. A power device component with component pads has an electrically conductive backside supported by and electrically coupled to the drain lead. A dielectric layer overlies at least portions of the component, the source lead, and the gate lead and has a plurality of vias therein aligned with predetermined ones of the component pads and predetermined portions of the source and gate leads. A pattern of electrical conductors extends through selected ones of the vias, with a first portion of the pattern coupling selected ones of the component pads to the source lead and a second portion of the pattern coupling at least one other of the component pads to the gate lead.
摘要翻译：功率器件部件封装包括支撑漏极引线，源极引线和栅极引线的衬底。每个引线包括具有足以形成高电流接触的厚度的导电材料。具有部件焊盘的功率器件部件具有由引线支撑并电耦合到漏极引线的导电背面。电介质层至少覆盖部件，源极引线和栅极引线的一部分，并且具有与预定的元件焊盘和源极和栅极引线的预定部分对准的多个通孔。电导体的图形延伸穿过选定的通孔，图案的第一部分将选定的部件焊盘中的一个连接到源极引线，并且将该至少一个其它部件焊盘的第二部分耦合到栅极铅。

7. 发明授权

US5532512A Direct stacked and flip chip power semiconductor device structures 失效
标题翻译：直接堆叠和倒装芯片功率半导体器件结构
公开(公告)号：US5532512A
公开(公告)日：1996-07-02
申请号：US316996
申请日：1994-10-03
申请人： Raymond A. Fillion , Eric J. Wildi , Charles S. Korman , Sayed-Amr El-Hamamsy , Steven M. Gasworth , Michael W. DeVre , James F. Burgess
发明人： Raymond A. Fillion , Eric J. Wildi , Charles S. Korman , Sayed-Amr El-Hamamsy , Steven M. Gasworth , Michael W. DeVre , James F. Burgess
IPC分类号： H01L25/07 , H02M7/00 , H01L23/02 , H01L23/48 , H05K7/20
CPC分类号： H01L25/074 , H01G4/306 , H01L25/071 , H02M7/003 , H01L2224/73253 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011
摘要： Power semiconductor device structures and assemblies with improved heat dissipation characteristics and low impedance interconnections include a thermally-conductive dielectric layer, such as diamondlike carbon (DLC) overlying at least portions of the active major surface of a semiconductor chip, with vias formed in the dielectric layer in alignment with contact pads on the active major surface. A patterned metallization layer is formed over the thermally-conductive dielectric layer, with portions of the metallization layer extending through the vias into electrical contact with the chip contact pads. A metal structure is electrically and thermally coupled to selected areas of the patterned metallization, such as by solder bonding or by a eutectic bonding process. In different embodiments, the metal structure may comprise a metal conductor bonded to the opposite major surface of another power semiconductor device structure, a heat-dissipating device-mounting structure, or simply a low-impedance lead.
摘要翻译：具有改善的散热特性和低阻抗互连的功率半导体器件结构和组件包括导热介电层，例如覆盖在半导体芯片的有源主表面的至少一部分上的类金刚石碳（DLC），以及在电介质中形成的通孔层与主动主表面上的接触垫对准。图案化的金属化层形成在导热电介质层之上，金属化层的部分延伸穿过通孔与芯片接触焊盘电接触。金属结构电气和热耦合到图案化金属化的选定区域，例如通过焊接或通过共晶粘合工艺。在不同的实施例中，金属结构可以包括结合到另一功率半导体器件结构的相对主表面的金属导体，散热器件安装结构或简单的低阻抗引线。

8. 发明授权

US5527741A Fabrication and structures of circuit modules with flexible interconnect layers 失效
标题翻译：具有柔性互连层的电路模块的制造和结构
公开(公告)号：US5527741A
公开(公告)日：1996-06-18
申请号：US321346
申请日：1994-10-11
申请人： Herbert S. Cole , Raymond A. Fillion , Bernard Gorowitz , Ronald F. Kolc , Robert J. Wojnarowski
发明人： Herbert S. Cole , Raymond A. Fillion , Bernard Gorowitz , Ronald F. Kolc , Robert J. Wojnarowski
IPC分类号： H01L21/60 , H01L21/48 , H01L23/538 , H05K3/32
CPC分类号： H05K3/32 , H01L21/4857 , H01L23/5383 , H01L23/5387 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/82047 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , Y10T29/4913
摘要： A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers.
摘要翻译：一种用于制造电路模块的方法包括在绝缘层的第一表面上的第一图案化金属化层上施加外部绝缘层。基极绝缘层的第二表面具有第二图案化金属化层。具有芯片焊盘的至少一个电路芯片附接到基极绝缘层的第二表面。形成各个通孔以暴露第一图案化金属化层，第二图案化金属化层和芯片焊盘的选定部分。图案化的外部金属化层被施加在外部绝缘层上以延伸通过选定的通孔以互连所选择的芯片焊盘和第一和第二金属化层的选定部分。

9. 发明授权

US5497033A Embedded substrate for integrated circuit modules 失效
标题翻译：集成电路模块用嵌入式基板
公开(公告)号：US5497033A
公开(公告)日：1996-03-05
申请号：US262181
申请日：1994-06-20
申请人： Raymond A. Fillion , Robert J. Woinarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
发明人： Raymond A. Fillion , Robert J. Woinarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
IPC分类号： H01L23/52 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/29 , H01L23/433 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H01L23/14 , H05K7/10
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L23/538 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/2402 , H01L2224/24137 , H01L2224/24195 , H01L2224/2518 , H01L2224/2919 , H01L2224/82039 , H01L2224/83192 , H01L2224/8385 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49144
摘要： Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
摘要翻译：基板材料直接模制到半导体芯片和其他用于集成电路模块制造的电气部件。具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。模具周围位于芯片周围。在模具形式中加入基材成型材料，然后将基材成型材料硬化。具有与预定接触焊盘对准的通孔并具有延伸通过通孔的电导体的通孔的电介质层位于硬化的基底成型材料和芯片的表面上。在添加基板模制材料之前，可以将热塞固定到芯片的背面。在添加基材模塑材料之前，连接器框架可以放置在粘合剂层上。在添加基底成型材料之前，可以将电介质层放置在芯片的背面上以增强可修复性。芯片和基材成型材料的一部分可以在基材模塑材料硬化之后被去除。

10. 发明授权

US5703440A Compact fluorescent lamp and ballast arrangement with inductor directly between lamp ends 失效
标题翻译：紧凑型荧光灯和镇流器配置，电感直接在灯头之间
公开(公告)号：US5703440A
公开(公告)日：1997-12-30
申请号：US647605
申请日：1996-05-13
申请人： David J. Kachmarik , Thomas F. Soules , Raymond A. Fillion , Erwin G. Steinbrenner , Donald W. Kuk
发明人： David J. Kachmarik , Thomas F. Soules , Raymond A. Fillion , Erwin G. Steinbrenner , Donald W. Kuk
IPC分类号： H01J61/32 , H01J61/56 , H05B41/02 , H05B41/282 , H05B37/02
CPC分类号： H05B41/02 , H01J61/327 , H01J61/56 , H05B41/282 , Y02B20/183 , Y02B20/185 , Y02B20/19
摘要： Disclosed is a fluorescent lamp and ballast arrangement of the type having a lamp base for connection to a fixture that also accommodates a lamp base of an incandescent lamp. A ballast circuit contains a first conversion circuit which converts a.c. voltage to d.c. voltage and which has an electrolytic capacitor for smoothing the d.c. voltage. The ballast circuit further includes a second conversion circuit which converts the d.c. voltage into a.c. current and which includes a resonant inductor and resonant capacitor. A ballast housing has first and second ends spaced along a longitudinal axis of the housing and encloses parts of the ballast circuit. Only two lamp tube portions of the lamp terminate in the first end of the ballast housing, with the resonant inductor being positioned between the two lamp tube portions. Preferably, a pair of printed-circuit boards are positioned within the ballast housing, between the electrolytic capacitor and the resonant inductor, and are dimensioned to convectively shield the capacitor from the inductor and the lamp tube portions. Substantially all ballast components in addition to the resonant inductor and the electrolytic capacitor are preferably sandwiched between the pair of printed-circuit boards. Additionally, the electrolytic capacitor is preferably positioned at least partially within the lamp base. Employing all the foregoing features together has resulted in ballast component temperatures that are equal to, or lower, than ballast component temperatures on comparable high wattage (i.e., greater than about 20 watts) but much larger ballasts that are integral (as here) to the lamp.
摘要翻译：公开了一种荧光灯和镇流器布置，其具有用于连接到还容纳白炽灯的灯座的灯具的灯座的类型。镇流器电路包含转换交流电的第一转换电路。电压到直流电压，并具有用于平滑直流的电解电容器。电压。镇流器电路还包括第二转换电路，其转换直流电压进入。电流，包括谐振电感和谐振电容。镇流器壳体具有沿着壳体的纵向轴线间隔开的第一和第二端，并且包围镇流器电路的部分。灯的两个灯管部分终止于镇流器壳体的第一端，谐振电感器位于两个灯管部分之间。优选地，一对印刷电路板位于镇流器壳体内，位于电解电容器和谐振电感器之间，并且尺寸设计成对电屏蔽电感器和灯管部分。除了谐振电感器和电解电容器之外，基本上所有的镇流器部件优选地夹在该对印刷电路板之间。此外，电解电容器优选地至少部分地位于灯座内。将所有上述特征结合在一起已经导致了压载组件的温度等于或低于镇流器部件温度，在相当高的功率（即，大于约20瓦），但是更大的镇流器是整体的（如这里）到灯。

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