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1. 发明授权

US06330157B1 Variable thermal exchanger and method thereof 有权
标题翻译：可变热交换器及其方法
公开(公告)号：US06330157B1
公开(公告)日：2001-12-11
申请号：US09469158
申请日：1999-12-21
申请人： Raschid J. Bezama , Raed A. Sherif
发明人： Raschid J. Bezama , Raed A. Sherif
IPC分类号： H05K720
CPC分类号： H01L23/473 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.
摘要翻译：本发明涉及一种用于从电子部件或散热器进行热交换的装置或装置及其方法。更具体地说，本发明涉及散热器，其结合了一种创新的热机械致动装置，其调节散热器散热的能力及其方法。

2. 发明授权

US06459160B1 Package with low stress hermetic seal 失效
公开(公告)号：US06459160B1
公开(公告)日：2002-10-01
申请号：US10054099
申请日：2002-01-22
申请人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
发明人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
IPC分类号： H01L2348
CPC分类号： H01L23/10 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/16152 , H01L2924/16315 , H01L2224/0401
摘要： A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.

3. 发明授权

US06111314A Thermal cap with embedded particles 失效
标题翻译：具有嵌入式颗粒的热盖
公开(公告)号：US06111314A
公开(公告)日：2000-08-29
申请号：US140583
申请日：1998-08-26
申请人： David L. Edwards , Patrick A. Coico , Sushumna Iruvanti , Frank L. Pompeo , Raed A. Sherif , Hilton T. Toy
发明人： David L. Edwards , Patrick A. Coico , Sushumna Iruvanti , Frank L. Pompeo , Raed A. Sherif , Hilton T. Toy
IPC分类号： H01L23/367 , H01L23/373 , H01L23/42 , H01L23/12
CPC分类号： H01L23/3737 , H01L23/367 , H01L23/3733 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/16152
摘要： The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.
摘要翻译：本发明一般涉及一种用于提高使用散热膏冷却半导体模块中的芯片的冷却设计的可靠性的新方法及其结构。更具体地说，本发明包括一种结构和方法，该结构和方法使用热冷却帽内部的与热膏接触的表面化学改性。盖的内表面通过包埋具有与用于热膏中的一种或多种固体相同的化学组成的颗粒来改性。颗粒可以通过铸造，喷砂或将颗粒永久地压入表面而嵌入盖中。

4. 发明授权

US5239443A Blind hole cold plate cooling system 失效
标题翻译：盲孔冷板冷却系统
公开(公告)号：US5239443A
公开(公告)日：1993-08-24
申请号：US872567
申请日：1992-04-23
申请人： Albert J. Fahey , Gaetano P. Messina , John B. Pavelka , Raed A. Sherif
发明人： Albert J. Fahey , Gaetano P. Messina , John B. Pavelka , Raed A. Sherif
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908
摘要： Disclosed is a blind hole cold plate cooling system including:a fluid inlet manifold having at least one jet nozzle;a heat transfer plate having a first and second principal surface, the first principal surface having a complementary cavity for receiving the jet nozzle, the second principal surface being planar for contact with at least one heat generatinq device; andan annular gap defined by the outer periphery of jet nozzle and the surface of the complementary cavity.
摘要翻译：盲孔冷板冷却系统包括：具有至少一个喷嘴的流体入口歧管; 具有第一和第二主表面的传热板，所述第一主表面具有用于接收喷射喷嘴的互补空腔，所述第二主表面是平面的，用于与至少一个热发生装置接触; 以及由喷嘴的外围和互补腔的表面限定的环形间隙。

5. 发明授权

US08697987B2 Solar cell having front grid metallization that does not contact the active layers 有权
标题翻译：具有不接触有源层的前栅格金属化的太阳能电池
公开(公告)号：US08697987B2
公开(公告)日：2014-04-15
申请号：US10961256
申请日：2004-10-08
申请人： Hector L. Cotal , Raed A. Sherif
发明人： Hector L. Cotal , Raed A. Sherif
IPC分类号： H01L31/042
CPC分类号： H01L31/022425 , H01L31/0547 , Y02E10/52
摘要： A solar cell has a photovoltaic element having a back electrical contact, and a front current-collection grid cap structure overlying and contacting the photovoltaic solar cell element. The front current-collection grid cap structure is made of a doped semiconductor material and has openings therethrough to the photovoltaic solar cell element. An anti-reflection layer formed of an anti-reflection material overlies and contacts the photovoltaic solar cell element in the openings of the front current-collection grid cap structure. An edge stripe of a cap-top protective material, preferably the same as the anti-reflection material, overlies and contacts each top grid-cap margin of the top cap structure but not a top grid-cap central region of the top cap-structure. A metallic electrical current collector overlies and contacts the top cap structure and at least some of the edge stripe, but does not contact the anti-reflection layer and does not contact the photovoltaic solar cell element.
摘要翻译：太阳能电池具有背光电接触的光电元件和覆盖并接触光伏太阳能电池元件的前集电栅格结构。前集电栅极盖结构由掺杂的半导体材料制成，并且具有穿过其的光电太阳能电池元件的开口。由防反射材料形成的抗反射层在前集电栅格盖结构的开口中覆盖并接触光伏太阳能电池元件。盖顶保护材料的边缘条纹，优选地与防反射材料相同，覆盖并接触顶盖结构的每个顶部格栅盖边缘，但不覆盖顶盖结构的顶部格栅帽中心区域。金属电流收集器覆盖并接触顶帽结构和至少一些边缘条纹，但是不接触抗反射层并且不接触光伏太阳能电池元件。

6. 发明授权

US06218730B1 Apparatus for controlling thermal interface gap distance 失效
标题翻译：用于控制热界面间隙距离的装置
公开(公告)号：US06218730B1
公开(公告)日：2001-04-17
申请号：US09226458
申请日：1999-01-06
申请人： Hilton T. Toy , Raed A. Sherif
发明人： Hilton T. Toy , Raed A. Sherif
IPC分类号： H01L2312
CPC分类号： H01L23/10 , H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15312 , H01L2924/16152 , H01L2924/16315 , H01L2924/19105 , H01L2224/0401
摘要： Tolerances in chip, substrate and hardware dimensions are accommodated by means of a floating sealing structure to insure that compliant thermally conductive paste disposed between the chip and its lid is as trim as possible in order to reduce thermal resistance of the paste so as to be able to run the chip at a cooler temperature. Standoffs are also preferably employed to insure proper paste gap thickness.
摘要翻译：芯片，基板和硬件尺寸的公差通过浮动密封结构来适应，以确保设置在芯片和盖子之间的兼容的导热浆料尽可能地修整，以便降低粘合剂的热阻，以便能够在较冷的温度下运行芯片。也优选使用支座以确保适当的浆料间隙厚度。

7. 发明授权

US5706171A Flat plate cooling using a thermal paste retainer 失效
标题翻译：平板冷却使用热粘贴保持器
公开(公告)号：US5706171A
公开(公告)日：1998-01-06
申请号：US560568
申请日：1995-11-20
申请人： David Linn Edwards , Sushumna Iruvanti , Gaetano Paolo Messina , Raed A. Sherif
发明人： David Linn Edwards , Sushumna Iruvanti , Gaetano Paolo Messina , Raed A. Sherif
IPC分类号： H01L23/42 , H05K7/20
CPC分类号： H05K7/20454 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/1305 , H01L2924/3011
摘要： Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.
摘要翻译：诸如糊状物或凝胶之类的热物质通过形成隔板而被限制在平坦冷却板的表面和安装在芯片载体或衬底的表面上的芯片的相对表面之间的糊料间隙中，优选为网格，在一个或多个芯片的外围。分隔件横向放置在与芯片相邻的位置并且与浆料间隙连通以形成毛细管，从而将粘性热材料的运动限制在重复的双向流出浆料间隙中，同时芯片和平面冷却板表面。栅格优选紧密地配合在形成在平坦冷却板的表面中的槽内，并且优选地由板簧支撑，使得热材料被限制在栅格的单元内，同时提供平板冷却板和扁平冷却板之间的相对运动的支撑和/或阻尼底物或载体。

8. 发明授权

US5604978A Method for cooling of chips using a plurality of materials 失效
标题翻译：使用多种材料冷却芯片的方法
公开(公告)号：US5604978A
公开(公告)日：1997-02-25
申请号：US455463
申请日：1995-05-31
申请人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
发明人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
IPC分类号： H01L23/373 , H01L23/42 , H01L23/64 , H01L25/065 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3737 , H01L23/42 , H01L23/642 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , Y10T29/49144
摘要： The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
摘要翻译：本发明一般涉及使用多种导热材料定制冷却芯片的新设备和方法。更具体地，本发明包括通过使用多种导热材料提供MCM（多芯片模块）的定制冷却的装置和方法。

9. 发明授权

US06342407B1 Low stress hermetic seal 失效
标题翻译：低应力密封
公开(公告)号：US06342407B1
公开(公告)日：2002-01-29
申请号：US09731619
申请日：2000-12-07
申请人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
发明人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
IPC分类号： H01L2144
CPC分类号： H01L23/10 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/16152 , H01L2924/16315 , H01L2224/0401
摘要： A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.
摘要翻译：密封电子电路模块包括具有顶表面的陶瓷芯片载体，具有配合表面的盖和在载体和盖之间的载体周边处的密封。密封件包括位于载体周边的载体顶部的非金属软下框架，优选聚酰亚胺。存在形成为与从顶盖向下朝向下框架向下的上框架匹配的上粘合层。软下框架上方是下金属粘合层。在上框架和下粘合层之间是焊接层，其被加热以将盖密封到芯片载体。软框架可以包括通道，通过下金属粘合层和焊料通过通过软层的通道形成金属对金属的通孔密封件，或者可以将下金属粘合层的侧向延伸到远端超出软下框架周边的位置。

10. 发明授权

US6049456A Electronic module adjustment design and process using shims 有权
标题翻译：电子模块调整设计和使用垫片的过程
公开(公告)号：US6049456A
公开(公告)日：2000-04-11
申请号：US152904
申请日：1998-09-14
申请人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
发明人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/09701
摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.
摘要翻译：描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。最优选地，垫片符合盖板或底板的周边。还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。选择一个或多个垫片，其等于初始读数和第二读数之间的差。拆下盖板，并用适当的垫片更换垫片。然后将盖板固定在基板上。还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。

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