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1. 发明申请

US20120187332A1 HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOSTRUCTURED METALLIC NETWORK-POLYMER COMPOSITES 有权
标题翻译：基于纳米结构金属网络聚合物复合材料的高热导率热界面材料
公开(公告)号：US20120187332A1
公开(公告)日：2012-07-26
申请号：US13357190
申请日：2012-01-24
申请人： Sushumna Iruvanti , Theodorian Borca-Tasciuc , Hafez Raeisi-Fard , Fengyuan Lai , Kamyar Pashayi , Joel Plawsky
发明人： Sushumna Iruvanti , Theodorian Borca-Tasciuc , Hafez Raeisi-Fard , Fengyuan Lai , Kamyar Pashayi , Joel Plawsky
IPC分类号： C09K5/06 , C09K5/14 , B82Y30/00 , B82Y40/00
CPC分类号： C08K3/08 , B82Y30/00 , C08K2003/0806 , C08L63/00 , C09D139/06 , C09K5/063 , C09K5/14
摘要： A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
摘要翻译：复合结构提供作为具有较低填料负载的热界面结构的高热导率。该复合结构是通过将纳米颗粒以低填料负载分散在基体中而形成的，并且控制烧结复合结构以诱导纳米颗粒与基体内连接的渗透导热网络结构的结合。

2. 发明申请

US20110180923A1 RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE 失效
标题翻译：金属热界面的可靠性提高
公开(公告)号：US20110180923A1
公开(公告)日：2011-07-28
申请号：US12693646
申请日：2010-01-26
申请人： JAMES N. HUMENIK , SUSHUMNA IRUVANTI , RICHARD LANGLOIS , HSICHANG LIU , GOVINDARAJAN NATARAJAN , KAMAL K. SIKKA , HILTON T. TOY , JIANTAO ZHENG , GREGG B. MONJEAU , MARK KAPFHAMMER
发明人： JAMES N. HUMENIK , SUSHUMNA IRUVANTI , RICHARD LANGLOIS , HSICHANG LIU , GOVINDARAJAN NATARAJAN , KAMAL K. SIKKA , HILTON T. TOY , JIANTAO ZHENG , GREGG B. MONJEAU , MARK KAPFHAMMER
IPC分类号： H01L23/02 , H01L21/58
CPC分类号： H01L23/42 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.
摘要翻译：芯片的前端结合到芯片载体的顶表面。密封材料被分配在芯片载体的顶表面的周边。提供具有第一侧和第二侧的焊料TIM。 TIM的第一面接触芯片的背面。进行回流以融化TIM。 TIM的第二面粘合到盖子上。密封材料固化。盖子附接到芯片载体的顶表面。回填材料被注入到芯片载体的顶表面和盖子之间的空间中。回填材料邻接TIM的两侧。回填材料固化。 TIM焊料裂纹和相关的热降解得到缓解。

3. 发明申请

US20090109628A1 Chip Cooling System with Convex Portion 审中-公开
标题翻译：带凸部的芯片冷却系统
公开(公告)号：US20090109628A1
公开(公告)日：2009-04-30
申请号：US11928165
申请日：2007-10-30
申请人： Raschid J. Bezama , James N. Humenik , Sushumna Iruvanti , Govindarajan Natarajan
发明人： Raschid J. Bezama , James N. Humenik , Sushumna Iruvanti , Govindarajan Natarajan
IPC分类号： H01L23/367 , F28F7/00
CPC分类号： H01L23/367 , F28F13/00 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof.
摘要翻译：公开了集成电路芯片的冷却方法和系统。用于冷却集成电路芯片的方法可以包括：提供冷却机构; 在冷却机构和集成电路芯片之间定位界面介质; 并通过接口介质与冷却机构和集成电路芯片接口; 其中所述冷却机构，所述集成电路芯片或所述界面介质中的至少一个在其界面表面上包括凸部。

4. 发明授权

US07268428B2 Thermal paste containment for semiconductor modules 有权
标题翻译：用于半导体模块的散热膏容纳
公开(公告)号：US07268428B2
公开(公告)日：2007-09-11
申请号：US11160997
申请日：2005-07-19
申请人： David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
发明人： David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
IPC分类号： H01L23/34
CPC分类号： H01L23/04 , H01L23/10 , H01L23/3675 , H01L23/42 , H01L24/32 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/16152 , H01L2924/16153 , H01L2924/1616 , Y10S257/924
摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
摘要翻译：公开了半导体模块结构和形成半导体模块结构的方法。该结构包括安装在基板上并被盖子覆盖的模具。热化合物设置在模具和盖子之间的热间隙内。围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

5. 发明授权

US06444496B1 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof 失效
标题翻译：作为芯片和散热器之间的传热介质的热糊状预成型件及其方法
公开(公告)号：US06444496B1
公开(公告)日：2002-09-03
申请号：US09619886
申请日：2000-07-20
申请人： David L. Edwards , Glenn G. Daves , Shaji Farooq , Sushumna Iruvanti , Frank L. Pompeo
发明人： David L. Edwards , Glenn G. Daves , Shaji Farooq , Sushumna Iruvanti , Frank L. Pompeo
IPC分类号： H01L2144
CPC分类号： H05K7/20454 , H01L23/42 , H01L2224/16225 , H01L2224/73253 , H01L2924/16152
摘要： The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.
摘要翻译：本发明一般涉及将热膏引入半导体封装的新设备和方法。更具体地说，本发明包括使用至少一个热糊状物预制件来冷却密封半导体封装中的至少一个芯片的装置和方法。将热糊预制件过冷，并从可分离转印片材转移到模块组件上，或者使用附接和/或嵌入的网格放置在模块部件上。热糊状物的预制件可以是简单或复杂的形状，并且能够冷却模块中的一个或多个芯片。

6. 发明授权

US06214647B1 Method for bonding heatsink to multiple-height chip 失效
标题翻译：将散热片连接到多芯片芯片的方法
公开(公告)号：US06214647B1
公开(公告)日：2001-04-10
申请号：US09159239
申请日：1998-09-23
申请人： Giulio Di Giacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Sushumna Iruvanti , David J. Womac
发明人： Giulio Di Giacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Sushumna Iruvanti , David J. Womac
IPC分类号： H01L2144
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/09701
摘要： A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.
摘要翻译：一种用于将热导体热连接到至少一个芯片的方法和结构，所述热导体包括下表面和从与每个芯片对应的下表面延伸的至少一个活塞，每个芯片具有与每个芯片相对的上表面的活塞，所述芯片安装在基板上，所述方法包括以下步骤：使所述导热体和所述活塞的下表面金属化，向所述导热体的下表面施加焊料，在所述导热体的上表面芯片和活塞，定位衬底和热导体，使得衬底与热导体对准，将热导体偏压朝向衬底，将活塞偏压到芯片，使得热膏在每个之间具有一致的厚度芯片和活塞，回流焊料，使得焊料将基板粘合到热导体和活塞上与热导体进行冶金结合，其中在回流步骤之后，活塞和热导体形成整体结构，用于保持每个芯片和活塞之间的热粘合剂的厚度一致，其实现相当薄的热糊层，并且更大的热传导。

7. 发明授权

US5706171A Flat plate cooling using a thermal paste retainer 失效
标题翻译：平板冷却使用热粘贴保持器
公开(公告)号：US5706171A
公开(公告)日：1998-01-06
申请号：US560568
申请日：1995-11-20
申请人： David Linn Edwards , Sushumna Iruvanti , Gaetano Paolo Messina , Raed A. Sherif
发明人： David Linn Edwards , Sushumna Iruvanti , Gaetano Paolo Messina , Raed A. Sherif
IPC分类号： H01L23/42 , H05K7/20
CPC分类号： H05K7/20454 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/1305 , H01L2924/3011
摘要： Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.
摘要翻译：诸如糊状物或凝胶之类的热物质通过形成隔板而被限制在平坦冷却板的表面和安装在芯片载体或衬底的表面上的芯片的相对表面之间的糊料间隙中，优选为网格，在一个或多个芯片的外围。分隔件横向放置在与芯片相邻的位置并且与浆料间隙连通以形成毛细管，从而将粘性热材料的运动限制在重复的双向流出浆料间隙中，同时芯片和平面冷却板表面。栅格优选紧密地配合在形成在平坦冷却板的表面中的槽内，并且优选地由板簧支撑，使得热材料被限制在栅格的单元内，同时提供平板冷却板和扁平冷却板之间的相对运动的支撑和/或阻尼底物或载体。

8. 发明授权

US5604978A Method for cooling of chips using a plurality of materials 失效
标题翻译：使用多种材料冷却芯片的方法
公开(公告)号：US5604978A
公开(公告)日：1997-02-25
申请号：US455463
申请日：1995-05-31
申请人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
发明人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
IPC分类号： H01L23/373 , H01L23/42 , H01L23/64 , H01L25/065 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3737 , H01L23/42 , H01L23/642 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , Y10T29/49144
摘要： The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
摘要翻译：本发明一般涉及使用多种导热材料定制冷却芯片的新设备和方法。更具体地，本发明包括通过使用多种导热材料提供MCM（多芯片模块）的定制冷却的装置和方法。

9. 发明授权

US08232636B2 Reliability enhancement of metal thermal interface 失效
标题翻译：金属热界面的可靠性提高
公开(公告)号：US08232636B2
公开(公告)日：2012-07-31
申请号：US12693646
申请日：2010-01-26
申请人： James N Humenik , Sushumna Iruvanti , Richard Langlois , Hsichang Liu , Govindarajan Natarajan , Kamal K Sikka , Hilton T Toy , Jiantao Zheng , Gregg B Monjeau , Mark Kapfhammer
发明人： James N Humenik , Sushumna Iruvanti , Richard Langlois , Hsichang Liu , Govindarajan Natarajan , Kamal K Sikka , Hilton T Toy , Jiantao Zheng , Gregg B Monjeau , Mark Kapfhammer
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/42 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.
摘要翻译：芯片的前端结合到芯片载体的顶表面。密封材料被分配在芯片载体的顶表面的周边。提供具有第一侧和第二侧的焊料TIM。 TIM的第一面接触芯片的背面。进行回流以融化TIM。 TIM的第二面粘合到盖子上。密封材料固化。盖子附接到芯片载体的顶表面。回填材料被注入到芯片载体的顶表面和盖子之间的空间中。回填材料邻接TIM的两侧。回填材料固化。 TIM焊料裂纹和相关的热降解得到缓解。

10. 发明申请

US20080299707A1 THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES 有权
标题翻译：半导体模块的热固性容器
公开(公告)号：US20080299707A1
公开(公告)日：2008-12-04
申请号：US11955598
申请日：2007-12-13
申请人： David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
发明人： David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
IPC分类号： H01L21/52
CPC分类号： H01L23/04 , H01L23/10 , H01L23/3675 , H01L23/42 , H01L24/32 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/16152 , H01L2924/16153 , H01L2924/1616 , Y10S257/924
摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
摘要翻译：公开了半导体模块结构和形成半导体模块结构的方法。该结构包括安装在基板上并被盖子覆盖的模具。热化合物设置在模具和盖子之间的热间隙内。围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

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