专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06459160B1 Package with low stress hermetic seal 失效
公开(公告)号：US06459160B1
公开(公告)日：2002-10-01
申请号：US10054099
申请日：2002-01-22
申请人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
发明人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
IPC分类号： H01L2348
CPC分类号： H01L23/10 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/16152 , H01L2924/16315 , H01L2224/0401
摘要： A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.

2. 发明授权

US06111314A Thermal cap with embedded particles 失效
标题翻译：具有嵌入式颗粒的热盖
公开(公告)号：US06111314A
公开(公告)日：2000-08-29
申请号：US140583
申请日：1998-08-26
申请人： David L. Edwards , Patrick A. Coico , Sushumna Iruvanti , Frank L. Pompeo , Raed A. Sherif , Hilton T. Toy
发明人： David L. Edwards , Patrick A. Coico , Sushumna Iruvanti , Frank L. Pompeo , Raed A. Sherif , Hilton T. Toy
IPC分类号： H01L23/367 , H01L23/373 , H01L23/42 , H01L23/12
CPC分类号： H01L23/3737 , H01L23/367 , H01L23/3733 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/16152
摘要： The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.
摘要翻译：本发明一般涉及一种用于提高使用散热膏冷却半导体模块中的芯片的冷却设计的可靠性的新方法及其结构。更具体地说，本发明包括一种结构和方法，该结构和方法使用热冷却帽内部的与热膏接触的表面化学改性。盖的内表面通过包埋具有与用于热膏中的一种或多种固体相同的化学组成的颗粒来改性。颗粒可以通过铸造，喷砂或将颗粒永久地压入表面而嵌入盖中。

3. 发明授权

US5239443A Blind hole cold plate cooling system 失效
标题翻译：盲孔冷板冷却系统
公开(公告)号：US5239443A
公开(公告)日：1993-08-24
申请号：US872567
申请日：1992-04-23
申请人： Albert J. Fahey , Gaetano P. Messina , John B. Pavelka , Raed A. Sherif
发明人： Albert J. Fahey , Gaetano P. Messina , John B. Pavelka , Raed A. Sherif
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908
摘要： Disclosed is a blind hole cold plate cooling system including:a fluid inlet manifold having at least one jet nozzle;a heat transfer plate having a first and second principal surface, the first principal surface having a complementary cavity for receiving the jet nozzle, the second principal surface being planar for contact with at least one heat generatinq device; andan annular gap defined by the outer periphery of jet nozzle and the surface of the complementary cavity.
摘要翻译：盲孔冷板冷却系统包括：具有至少一个喷嘴的流体入口歧管; 具有第一和第二主表面的传热板，所述第一主表面具有用于接收喷射喷嘴的互补空腔，所述第二主表面是平面的，用于与至少一个热发生装置接触; 以及由喷嘴的外围和互补腔的表面限定的环形间隙。

4. 发明授权

US06342407B1 Low stress hermetic seal 失效
标题翻译：低应力密封
公开(公告)号：US06342407B1
公开(公告)日：2002-01-29
申请号：US09731619
申请日：2000-12-07
申请人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
发明人： Lewis Sigmund Goldmann , Eric Daniel Perfecto , Raed A. Sherif , William Frederick Shutler , Hilton T. Toy
IPC分类号： H01L2144
CPC分类号： H01L23/10 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/16152 , H01L2924/16315 , H01L2224/0401
摘要： A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.
摘要翻译：密封电子电路模块包括具有顶表面的陶瓷芯片载体，具有配合表面的盖和在载体和盖之间的载体周边处的密封。密封件包括位于载体周边的载体顶部的非金属软下框架，优选聚酰亚胺。存在形成为与从顶盖向下朝向下框架向下的上框架匹配的上粘合层。软下框架上方是下金属粘合层。在上框架和下粘合层之间是焊接层，其被加热以将盖密封到芯片载体。软框架可以包括通道，通过下金属粘合层和焊料通过通过软层的通道形成金属对金属的通孔密封件，或者可以将下金属粘合层的侧向延伸到远端超出软下框架周边的位置。

5. 发明授权

US6049456A Electronic module adjustment design and process using shims 有权
标题翻译：电子模块调整设计和使用垫片的过程
公开(公告)号：US6049456A
公开(公告)日：2000-04-11
申请号：US152904
申请日：1998-09-14
申请人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
发明人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/09701
摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.
摘要翻译：描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。最优选地，垫片符合盖板或底板的周边。还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。选择一个或多个垫片，其等于初始读数和第二读数之间的差。拆下盖板，并用适当的垫片更换垫片。然后将盖板固定在基板上。还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。

6. 发明授权

US5990418A Hermetic CBGA/CCGA structure with thermal paste cooling 失效
标题翻译：气密CBGA / CCGA结构与散热膏冷却
公开(公告)号：US5990418A
公开(公告)日：1999-11-23
申请号：US902556
申请日：1997-07-29
申请人： Kevin G. Bivona , Jeffrey T. Coffin , Stephen S. Drofitz, Jr. , Lewis S. Goldmann , Mario J. Interrante , Sushumna Iruvanti , Raed A. Sherif
发明人： Kevin G. Bivona , Jeffrey T. Coffin , Stephen S. Drofitz, Jr. , Lewis S. Goldmann , Mario J. Interrante , Sushumna Iruvanti , Raed A. Sherif
IPC分类号： H01L23/00 , H01L23/16 , H01L23/42 , H01L23/02
CPC分类号： H01L23/562 , H01L23/16 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251
摘要： A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).
摘要翻译：一种用于在集成电路芯片产生的热量的有效耗散的同时在衬底和盖子之间气密密封集成电路芯片的装置和方法。该装置包括集成电路芯片，载体基板，界面冷却剂和盖子。集成电路芯片附着到载体衬底的顶部。接口冷却剂设置在集成电路芯片的顶部，并且盖子被放置在载体基板/集成电路芯片组合的顶部上并且接触界面冷却剂。界面冷却剂提供用于将热量从集成电路芯片传导到盖子的热路径。衬底通过陶瓷球栅阵列（CBGA）或陶瓷柱栅阵列（CCGA）连接到电路板。

7. 发明授权

US5881945A Multi-layer solder seal band for semiconductor substrates and process 失效
标题翻译：用于半导体衬底的多层焊接密封带和工艺
公开(公告)号：US5881945A
公开(公告)日：1999-03-16
申请号：US846935
申请日：1997-04-30
申请人： David L. Edwards , Armando S. Cammarano , Jeffrey T. Coffin , Mark G. Courtney , Stephen S. Drofitz, Jr. , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , Sushumna Iruvanti , Frank L. Pompeo , William E. Sablinski , Raed A. Sherif , Hilton T. Toy
发明人： David L. Edwards , Armando S. Cammarano , Jeffrey T. Coffin , Mark G. Courtney , Stephen S. Drofitz, Jr. , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , Sushumna Iruvanti , Frank L. Pompeo , William E. Sablinski , Raed A. Sherif , Hilton T. Toy
IPC分类号： B23K35/14 , B23K35/26 , H01L21/50 , H01L21/60 , H01L23/02 , H01L23/10 , B23K31/02 , B23K35/22
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/16 , H01L2224/73253 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.
摘要翻译：本发明一般涉及为半导体衬底和芯片载体提供密封带的新方案。更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。这种多层金属密封提供增强的气密寿命和环境保护。对于优选实施例，多层金属密封带是用于为模块产生低成本，高可靠性气密密封的三层焊料夹层结构。该焊料夹层具有较高的熔化温度较厚的焊料内芯和较低熔点的薄互连焊料层，其中薄的互连焊料层可具有相似或不同的熔点。

8. 发明授权

US5623394A Apparatus for cooling of chips using a plurality of customized thermally conductive materials 失效
标题翻译：使用多种定制导热材料冷却芯片的装置
公开(公告)号：US5623394A
公开(公告)日：1997-04-22
申请号：US690883
申请日：1996-08-02
申请人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
发明人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
IPC分类号： H01L23/373 , H01L23/42 , H01L23/64 , H01L25/065 , H05K7/20
CPC分类号： H01L24/32 , H01L23/3737 , H01L23/42 , H01L23/642 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , Y10T29/49144
摘要： The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
摘要翻译：本发明一般涉及使用多种导热材料定制冷却芯片的新设备和方法。更具体地，本发明包括通过使用多种导热材料提供MCM（多芯片模块）的定制冷却的装置和方法。

9. 发明授权

US06350944B1 Solar module array with reconfigurable tile 有权
标题翻译：具有可重构瓦片的太阳能模块阵列
公开(公告)号：US06350944B1
公开(公告)日：2002-02-26
申请号：US09580286
申请日：2000-05-30
申请人： Raed A. Sherif , Karim S. Boutros
发明人： Raed A. Sherif , Karim S. Boutros
IPC分类号： H01L31042
CPC分类号： H01L31/042 , Y02E10/50 , Y10S136/292 , Y10S136/293 , Y10S323/906 , Y10T307/653
摘要： A reconfigurable solar panel system having a plurality of solar cells arranged in a predefined pattern on a printed circuit board having a predefined pattern of interconnection paths to form at least one solar cell module. The solar panel being made of at least one solar cell module and having the capability to be configured and reconfigured by programming at least one integrated circuit that communicates with each and every solar cell on the solar module. The present invention is capable of monitoring, controlling, and protecting the solar panel, as well as being reconfigured before, during and after the panel is assembled. With the present invention it is also possible to reconfigure the solar panel after it has been employed in an application, such as a satellite that is in orbit.
摘要翻译：一种可重新配置的太阳能电池板系统，其具有以预定图案布置在印刷电路板上的多个太阳能电池板，该印刷电路板具有预定的互连路径图案，以形成至少一个太阳能电池模块。太阳能电池板由至少一个太阳能电池模块制成，并且具有通过编程与太阳能模块上的每个太阳能电池通信的至少一个集成电路来配置和重新配置的能力。本发明能够监测，控制和保护太阳能电池板，以及在面板组装之前，期间和之后进行重新配置。利用本发明，也可以在将太阳能电池板应用于诸如正在轨道的卫星的应用中之后重新配置。

10. 发明授权

US06330157B1 Variable thermal exchanger and method thereof 有权
标题翻译：可变热交换器及其方法
公开(公告)号：US06330157B1
公开(公告)日：2001-12-11
申请号：US09469158
申请日：1999-12-21
申请人： Raschid J. Bezama , Raed A. Sherif
发明人： Raschid J. Bezama , Raed A. Sherif
IPC分类号： H05K720
CPC分类号： H01L23/473 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.
摘要翻译：本发明涉及一种用于从电子部件或散热器进行热交换的装置或装置及其方法。更具体地说，本发明涉及散热器，其结合了一种创新的热机械致动装置，其调节散热器散热的能力及其方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式