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1. 发明授权

US07458495B2 Flip chip bonding tool 有权
标题翻译：倒装芯片焊接工具
公开(公告)号：US07458495B2
公开(公告)日：2008-12-02
申请号：US10964292
申请日：2004-10-13
申请人： Ran Fu , Deming Liu , Chi Chuen Chaw , Hing Leung Li , Chak Hau Pang , Hing Suen Siu
发明人： Ran Fu , Deming Liu , Chi Chuen Chaw , Hing Leung Li , Chak Hau Pang , Hing Suen Siu
IPC分类号： B23K1/06 , B29C65/08
CPC分类号： B23K20/106 , B23K2101/40 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01061 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/3011 , H01L2224/0401
摘要： A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
摘要翻译：提供了一种用于将半导体芯片接合到表面的接合工具和方法，其中所述接合工具包括具有陶瓷材料的接合末端，优选为碳化钛。接合端可操作以保持芯片，并且诸如超声波换能器的键合能量发生器耦合到接合尖端，以将粘合能量施加到接合尖端和芯片以将芯片粘合到表面。接合端可以进一步包括马氏体，使得碳化钛存在于硬质相中，并且马氏体作为粘合剂存在于软相中。

2. 发明授权

US09465383B2 Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components 有权
标题翻译：使用成像装置调整至少一个用于处理半导体部件的处理装置的装置和方法
公开(公告)号：US09465383B2
公开(公告)日：2016-10-11
申请号：US14311856
申请日：2014-06-23
申请人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Chung Yan Lau
发明人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Chung Yan Lau
IPC分类号： G06F7/00 , G05B19/418
CPC分类号： G05B19/4182 , G05B2219/39106 , G05B2219/40554 , G05B2219/45031 , G05B2219/45054 , Y02P90/083
摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.
摘要翻译：公开了一种处理电子部件的装置。该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

3. 发明授权

US09218995B2 Transfer apparatus for transferring electronic devices and changing their orientations 有权
标题翻译：用于传送电子设备和改变其方向的传送设备
公开(公告)号：US09218995B2
公开(公告)日：2015-12-22
申请号：US14258463
申请日：2014-04-22
申请人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
发明人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
IPC分类号： B65G47/84 , H01L21/677 , H01L21/67
CPC分类号： H01L21/67718 , H01L21/67132
摘要： A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.
摘要翻译：一种用于将电子设备从晶片传送到测试处理器的传送设备。传送装置包括：i）可围绕轴线旋转的旋转装置; 以及ii）多个保持器，其构造成保持用于从晶片转移到测试处理器的电子设备。多个保持器联接到旋转装置并且可从旋转装置延伸以从晶片拾取电子装置。具体地说，多个保持器周向地布置并相对于旋转装置的轴线倾斜，以便将晶片上的电子设备的取向改变到测试处理器上的电子设备的期望取向。

4. 发明授权

US09261536B2 Test contactor for electrical testing of electronic components 有权
标题翻译：用于电子元件电气测试的测试接触器
公开(公告)号：US09261536B2
公开(公告)日：2016-02-16
申请号：US13584971
申请日：2012-08-14
申请人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Kai Fung Lau
发明人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Kai Fung Lau
IPC分类号： G01R31/20 , G01R31/02 , G01R31/26 , G01R31/302 , H01R11/18 , H01R13/00 , H05K1/00 , G01R1/067 , G01R1/04 , G01R1/073
CPC分类号： G01R1/06772 , G01R1/0416 , G01R1/07342
摘要： A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.
摘要翻译：一种用于电子部件的测试装置包括安装块和布置在安装块上的多个接触条。接触条被配置成使得电子部件的电引线可操作以在偏置方向上按压和弯曲接触片，以确保电子部件测试期间电引线和接触片之间的良好接触。此外，位于安装块上的预加载块可操作以在电引线和接触片之间接触之前在偏压方向上接触并施加预接触力。

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