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1. 发明申请

US20110212632A1 HIGH DENSITY ELECTRICAL CONNECTOR AND PCB FOOTPRINT 有权
标题翻译：高密度电气连接器和PCB盖板
公开(公告)号：US20110212632A1
公开(公告)日：2011-09-01
申请号：US13070324
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, JR.
发明人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, JR.
IPC分类号： H01R12/51 , H05K1/11 , H01R24/00
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
摘要翻译：一种互连系统，其包括子卡和背板电连接器，每个连接器以连接器占用面积安装到印刷电路板。背板连接器具有导电元件，其具有过渡区域，其允许配合接触部分以均匀的间距定位，而接触尾部可被成形以改善信号完整性或提供更紧凑和/或机械坚固的覆盖区。两个连接器中的导电元件构造成使得接地导体的接触尾部从列到列对准，但是一列中的接地导体的平面部分与另一列中的一对信号导体对准，这改善了机械和信号完整性。可以通过用跨接多列的接地导体的焊盘形成连接器覆盖区来改善机械完整性。

2. 发明申请

US20110212649A1 HIGH DENSITY ELECTRICAL CONNECTOR WITH VARIABLE INSERTION AND RETENTION FORCE 有权
标题翻译：具有可变插入和保持力的高密度电气连接器
公开(公告)号：US20110212649A1
公开(公告)日：2011-09-01
申请号：US13070343
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, JR.
发明人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, JR.
IPC分类号： H01R24/00
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.
摘要翻译：一种互连系统，其包括在连接器覆盖区处安装到印刷电路板的子卡和背板电连接器。子卡连接器中的波束形触点的弹簧比率随着背板连接器的配合而增加，使得保持力可能大于插入力。弹簧速率的这种变化可以通过将梁状接触件邻近连接器壳体的表面定位来实现。该表面可以包括与梁状接触件对准的突起。当连接器不配合时，梁形接触件可以与突起物间隔开。当连接器开始配合时，梁形接触件的中心部分可以压靠在突起上，这具有缩短梁长度和增加其刚度的作用。

3. 发明授权

US08272877B2 High density electrical connector and PCB footprint 有权
标题翻译：高密度电连接器和PCB占位面积
公开(公告)号：US08272877B2
公开(公告)日：2012-09-25
申请号：US13070324
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, Jr.
发明人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, Jr.
IPC分类号： H01R12/00
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
摘要翻译：一种互连系统，其包括子卡和背板电连接器，每个连接器以连接器占用面积安装到印刷电路板。背板连接器具有导电元件，其具有过渡区域，其允许配合接触部分以均匀的间距定位，而接触尾部可被成形以改善信号完整性或提供更紧凑和/或机械坚固的覆盖区。两个连接器中的导电元件构造成使得接地导体的接触尾部从列到列对准，但是一列中的接地导体的平面部分与另一列中的一对信号导体对准，这改善了机械和信号完整性。可以通过用跨接多列的接地导体的焊盘形成连接器覆盖区来改善机械完整性。

4. 发明授权

US08182289B2 High density electrical connector with variable insertion and retention force 有权
标题翻译：具有可变插入和保持力的高密度电连接器
公开(公告)号：US08182289B2
公开(公告)日：2012-05-22
申请号：US13070343
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Donald A. Girard, Jr. , Huilin Ren
发明人： Philip T. Stokoe , Mark W. Gailus , Donald A. Girard, Jr. , Huilin Ren
IPC分类号： H01R13/648
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.
摘要翻译：一种互连系统，其包括在连接器覆盖区处安装到印刷电路板的子卡和背板电连接器。子卡连接器中的波束形触点的弹簧比率随着背板连接器的配合而增加，使得保持力可能大于插入力。弹簧速率的这种变化可以通过将梁状接触件邻近连接器壳体的表面定位来实现。该表面可以包括与梁状接触件对准的突起。当连接器不配合时，梁形接触件可以与突起物间隔开。当连接器开始配合时，梁形接触件的中心部分可以压靠在突起上，这具有缩短梁长度和增加其刚度的作用。

5. 发明申请

US20110104948A1 SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE 有权
标题翻译：表面贴装内置电容
公开(公告)号：US20110104948A1
公开(公告)日：2011-05-05
申请号：US12612510
申请日：2009-11-04
申请人： Donald A. Girard, JR. , Mark W. Gailus , Philip T. Stokoe
发明人： Donald A. Girard, JR. , Mark W. Gailus , Philip T. Stokoe
IPC分类号： H01R13/66 , H05K7/02 , H05K3/34 , H05K1/11 , H05K1/16
CPC分类号： H01R13/6466 , H01R13/6587 , H05K3/34 , Y10T29/49144
摘要： An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.
摘要翻译：具有集成到电连接器的印刷电路板占位面积的电容器的互连系统。每个电容器的一端在印刷电路板上与连接器中的导电元件的接触尾部共享焊盘。共享焊盘不通过过孔连接到内部电路结构。相反，通常形成为连接器安装垫的一部分的通孔形成为单独的相邻垫的一部分。电容器的第二端附接到相邻的焊盘，通过电容器在导电元件和通孔之间形成电连接。将电容器集成到占位面积中减少了所需的通孔数量，从而提高了信号完整性。电容器可以与连接器分开地放置在印刷电路板上，或者可以并入到连接器中，从而允许将连接器和电容器放置在一个操作中。

6. 发明授权

US08241067B2 Surface mount footprint in-line capacitance 有权
标题翻译：表面贴装尺寸的在线电容
公开(公告)号：US08241067B2
公开(公告)日：2012-08-14
申请号：US12612510
申请日：2009-11-04
申请人： Donald A. Girard, Jr. , Mark W. Gailus , Philip T. Stokoe
发明人： Donald A. Girard, Jr. , Mark W. Gailus , Philip T. Stokoe
IPC分类号： H01R13/66
CPC分类号： H01R13/6466 , H01R13/6587 , H05K3/34 , Y10T29/49144
摘要： An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.
摘要翻译：具有集成到电连接器的印刷电路板占位面积的电容器的互连系统。每个电容器的一端在印刷电路板上与连接器中的导电元件的接触尾部共享焊盘。共享焊盘不通过过孔连接到内部电路结构。相反，通常形成为连接器安装垫的一部分的通孔形成为单独的相邻垫的一部分。电容器的第二端附接到相邻的焊盘，通过电容器在导电元件和通孔之间形成电连接。将电容器集成到占位面积中减少了所需的通孔数量，从而提高了信号完整性。电容器可以与连接器分开地放置在印刷电路板上，或者可以并入到连接器中，从而允许将连接器和电容器放置在一个操作中。

7. 发明授权

US5860816A Electrical connector assembled from wafers 失效
标题翻译：从晶圆组装的电连接器
公开(公告)号：US5860816A
公开(公告)日：1999-01-19
申请号：US977285
申请日：1997-11-24
申请人： Daniel B. Provencher , Philip T. Stokoe , Mark W. Gailus
发明人： Daniel B. Provencher , Philip T. Stokoe , Mark W. Gailus
IPC分类号： H01R12/50 , H01R13/514 , H01R13/7195 , H01R43/24 , H01R9/09
CPC分类号： H01R13/7195 , H01R23/6873 , H01R43/24
摘要： A modular electrical connector made from wafers. Each wafer contains one column of contact elements and is made separately. The wafers are of two different types, which snap together to form two row modules. The modules contain attachment features that allow them to be organized on a metal stiffener. Shield members can be optionally attached to each wafer so that the connector can be made in either a shielded or unshielded versions. In addition, each wafer includes windows through which selected contact elements can be cut to either improve the performance of the shields or to allow attachments of resistors.
摘要翻译：由晶圆制成的模块化电连接器。每个晶片包含一列接触元件，并分别制成。晶片有两种不同的类型，它们卡在一起形成两个行模块。模块包含附件功能，可以将它们组织在金属加强筋上。屏蔽构件可以可选地附接到每个晶片，使得连接器可以被制成屏蔽或非屏蔽版本。此外，每个晶片包括窗口，通过该窗口，可以切割所选择的接触元件以改善屏蔽的性能或允许电阻器的附接。

8. 发明授权

US09225085B2 High performance connector contact structure 有权
标题翻译：高性能连接器接触结构
公开(公告)号：US09225085B2
公开(公告)日：2015-12-29
申请号：US13930351
申请日：2013-06-28
申请人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

9. 发明授权

US5702258A Electrical connector assembled from wafers 失效
标题翻译：从晶圆组装的电连接器
公开(公告)号：US5702258A
公开(公告)日：1997-12-30
申请号：US623582
申请日：1996-03-28
申请人： Daniel B. Provencher , Philip T. Stokoe , Mark W. Gailus
发明人： Daniel B. Provencher , Philip T. Stokoe , Mark W. Gailus
IPC分类号： H01R12/50 , H01R13/514 , H01R13/7195 , H01R43/24 , H01R9/09
CPC分类号： H01R13/7195 , H01R23/6873 , H01R43/24
摘要： A modular electrical connector made from wafers. Each wafer contains one column of contact elements and is made separately. The wafers are of two different types, which snap together to form two row modules. The modules contain attachment features that allow them to be organized on a metal stiffener. Shield members can be optionally attached to each wafer so that the connector can be made in either a shielded or unshielded versions. In addition, each wafer includes windows through which selected contact elements can be cut to either improve the performance of the shields or to allow attachment of resistors.
摘要翻译：由晶圆制成的模块化电连接器。每个晶片包含一列接触元件，并分别制成。晶片有两种不同的类型，它们卡在一起形成两个行模块。模块包含附件功能，可以将它们组织在金属加强筋上。屏蔽构件可以可选地附接到每个晶片，使得连接器可以制成屏蔽或非屏蔽版本。此外，每个晶片包括窗口，通过该窗口，可以切割所选择的接触元件以改善屏蔽的性能或允许电阻器的附着。

10. 发明授权

US5403206A Shielded electrical connector 失效
标题翻译：屏蔽电连接器
公开(公告)号：US5403206A
公开(公告)日：1995-04-04
申请号：US43195
申请日：1993-04-05
申请人： David M. McNamara , Daniel B. Provencher , Philip T. Stokoe , William E. Howard , Mark W. Gailus
发明人： David M. McNamara , Daniel B. Provencher , Philip T. Stokoe , William E. Howard , Mark W. Gailus
IPC分类号： H01R13/10 , H01R12/50 , H01R13/11 , H01R13/658 , H01R13/6585 , H01R13/6594 , H01R24/00
CPC分类号： H01R23/6873 , H01R13/6585 , H01R13/6594 , H01R23/688 , H01R12/724
摘要： Electrical connectors are provided with shield units each having a plurality of shields joined by a bridge. Preferably the shield units are mounted in a base stiffened by means apertured to carry mounting ear means.
摘要翻译：电连接器设置有各自具有通过桥连接的多个屏蔽的屏蔽单元。优选地，屏蔽单元安装在通过孔径加强的基座中以携带安装耳朵装置。

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