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    • 1. 发明授权
    • Connector having improved contacts
    • 连接器具有改善的接触
    • US08961227B2
    • 2015-02-24
    • US13348801
    • 2012-01-12
    • Mark W. GailusBrian P. KirkThomas S. Cohen
    • Mark W. GailusBrian P. KirkThomas S. Cohen
    • H01R13/648H01R13/26H01R24/62
    • H01R13/26H01R13/6585H01R13/6597H01R24/62
    • An electrical connector for connecting a conductor of a daughter card connector wafer with a blade in the housing of a backplane connector. The daughter card conductor has a body with two elongated beams extending outward from the body. The two elongated beams each have an outer edge and an inner edge, whereby an opening is defined between the inner edges. The backplane conductor has a body with a narrowed tab portion extending outward from said second conductor body. The narrowed tab portion having outer opposite edges and is sized so that the narrowed tab portion fits between at least a portion of the outer edges of the two elongated beams, and in some cases between at least a portion of the inner edges of the two elongated beams.
    • 一种用于将子卡连接器晶片的导体与背板连接器的外壳中的刀片连接的电连接器。 子卡导体具有一个具有从身体向外延伸的两个细长梁的主体。 两个细长梁各自具有外边缘和内边缘,由此在内边缘之间限定开口。 背板导体具有主体,该主体具有从所述第二导体本体向外延伸的窄的突片部分。 狭窄的突片部分具有外部相对的边缘,并且其尺寸使得狭窄的突片部分配合在两个细长梁的外边缘的至少一部分之间,并且在一些情况下,在两个细长的梁的内边缘的至少一部分之间 梁。
    • 7. 发明申请
    • HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
    • 高速,高密度电气连接器
    • US20090011641A1
    • 2009-01-08
    • US11958457
    • 2007-12-18
    • THOMAS S. COHENBrian KirkMarc B. Cartier, JR.
    • THOMAS S. COHENBrian KirkMarc B. Cartier, JR.
    • H01R13/648H01R13/02H01R43/00
    • H01R12/727H01R12/585H01R12/724H01R13/514H01R13/516H01R13/6461H01R13/6587H01R13/6599H01R43/16H01R43/24Y10T29/4922
    • An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
    • 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地间隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
    • 9. 发明授权
    • High speed high density electrical connector
    • 高速高密度电连接器
    • US07163421B1
    • 2007-01-16
    • US11183564
    • 2005-07-18
    • Thomas S. CohenBrian KirkMarc B. Cartier, Jr.
    • Thomas S. CohenBrian KirkMarc B. Cartier, Jr.
    • H01R13/648
    • H01R12/727H01R12/585H01R12/724H01R13/514H01R13/516H01R13/6461H01R13/6587H01R13/6599H01R43/16H01R43/24Y10T29/4922
    • An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
    • 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。