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1. 发明授权

US09484674B2 Differential electrical connector with improved skew control 有权
标题翻译：差分电连接器具有改进的扭曲控制
公开(公告)号：US09484674B2
公开(公告)日：2016-11-01
申请号：US14209079
申请日：2014-03-13
申请人： Marc B. Cartier, Jr. , Mark W. Gailus , Vysakh Sivarajan
发明人： Marc B. Cartier, Jr. , Mark W. Gailus , Vysakh Sivarajan
IPC分类号： H01R13/648 , H01R13/658 , H01R13/6476 , H01R43/16 , H01R43/24 , H01R12/72 , H01R13/514
CPC分类号： H01R13/658 , H01R12/724 , H01R13/514 , H01R13/6476 , H01R43/16 , H01R43/24
摘要： An improved electrical connector is provided by compensating for skew in signal conductors of a differential pair while ensuring a uniform impedance along the differential pair. Skew is equalized by regions of lower dielectric constant preferentially positioned adjacent the longer conductor of each pair. Impedance along the length of the signal conductor is equalized by a compensation portion in the first conductor that offsets for a change in impedance associated with the change in dielectric constant adjacent the longer conductor. The compensation portion may be a widening in the first conductive element relative to a nominal width of the conductive element. The skew compensation portion may be along a longer edge of the longer conductor and the impedance compensation portion may be along the shorter edge of the longer conductor.
摘要翻译：通过补偿差分对的信号导体中的偏斜而提供改进的电连接器，同时确保沿着差分对的均匀阻抗。偏移量通过优先位于每对较长导体附近的较低介电常数的区域来均衡。沿着信号导体的长度的阻抗由第一导体中的补偿部分相等，抵消与较长导体相邻的介电常数变化相关的阻抗变化。补偿部分可以相对于导电元件的标称宽度在第一导电元件中变宽。偏斜补偿部分可以沿着较长导体的较长边缘，并且阻抗补偿部分可以沿着较长导体的较短边缘。

2. 发明授权

US09225085B2 High performance connector contact structure 有权
标题翻译：高性能连接器接触结构
公开(公告)号：US09225085B2
公开(公告)日：2015-12-29
申请号：US13930351
申请日：2013-06-28
申请人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

3. 发明授权

US07335063B2 High speed, high density electrical connector 有权
标题翻译：高速，高密度电连接器
公开(公告)号：US07335063B2
公开(公告)日：2008-02-26
申请号：US11635090
申请日：2006-12-07
申请人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
发明人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

4. 发明申请

US20130112468A1 MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTRONIC SYSTEM 有权
公开(公告)号：US20130112468A1
公开(公告)日：2013-05-09
申请号：US13553414
申请日：2012-07-19
申请人： Thomas S. COHEN , Marc B. Cartier, JR. , Mark W. Gailus
发明人： Thomas S. COHEN , Marc B. Cartier, JR. , Mark W. Gailus
IPC分类号： H05K1/11
CPC分类号： H01R13/646 , H01R13/514 , H01R13/6471 , H01R13/6587 , H01R23/688 , H05K1/0231 , H05K1/0237 , H05K1/115 , H05K1/116 , H05K1/14 , H05K3/429 , H05K7/1445 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

5. 发明授权

US08226438B2 Midplane especially applicable to an orthogonal architecture electronic system 有权
标题翻译：中平面特别适用于正交架构电子系统
公开(公告)号：US08226438B2
公开(公告)日：2012-07-24
申请号：US12789621
申请日：2010-05-28
申请人： Thomas S. Cohen , Marc B. Cartier, Jr. , Mark W. Gailus
发明人： Thomas S. Cohen , Marc B. Cartier, Jr. , Mark W. Gailus
IPC分类号： H01R13/648
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译：中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

6. 发明授权

US07816932B2 Test system with high frequency interposer 有权
标题翻译：高频插入式测试系统
公开(公告)号：US07816932B2
公开(公告)日：2010-10-19
申请号：US12070864
申请日：2008-02-21
申请人： Marc B. Cartier, Jr.
发明人： Marc B. Cartier, Jr.
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R1/06772 , G01R1/07314 , G01R3/00 , G01R31/31905
摘要： An interposer with a conductive housing is disclosed. Conductive members pass through insulators positioned in openings in the conductive housing. The conductive housing may be grounded, providing a closely spaced ground structure for signal conductors passing through the conductive housing and therefore providing a desirable impedance to signals carried by the conductive members. Such an interposer may be used in a test system to couple high speed signals between instruments that generate or measure test signals and devices under test.
摘要翻译：公开了具有导电壳体的插入件。导电构件通过位于导电壳体中的开口中的绝缘体。导电壳体可以接地，为通过导电壳体的信号导体提供紧密间隔的接地结构，因此为由导电构件承载的信号提供期望的阻抗。这样的插入器可以用于测试系统中，以在产生或测量测试信号和被测器件的仪器之间耦合高速信号。

7. 发明授权

US07753731B2 High speed, high density electrical connector 有权
标题翻译：高速，高密度电连接器
公开(公告)号：US07753731B2
公开(公告)日：2010-07-13
申请号：US11958457
申请日：2007-12-18
申请人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
发明人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

8. 发明申请

US20090061684A1 MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTRONIC SYSTEM 有权
标题翻译： MIDPLANE特别适用于正交建筑电子系统
公开(公告)号：US20090061684A1
公开(公告)日：2009-03-05
申请号：US12203270
申请日：2008-09-03
申请人： Thomas S. Cohen , Marc B. Cartier, JR. , Mark W. Gailus
发明人： Thomas S. Cohen , Marc B. Cartier, JR. , Mark W. Gailus
IPC分类号： H01R24/00 , H01R13/648
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译：中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

9. 发明授权

US07422484B2 Midplane especially applicable to an orthogonal architecture electronic system 有权
标题翻译：中平面特别适用于正交架构电子系统
公开(公告)号：US07422484B2
公开(公告)日：2008-09-09
申请号：US11522530
申请日：2006-09-18
申请人： Thomas S. Cohen , Marc B. Cartier, Jr. , Mark W. Gailus
发明人： Thomas S. Cohen , Marc B. Cartier, Jr. , Mark W. Gailus
IPC分类号： H01R13/648
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译：中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

10. 发明授权

US08814595B2 High speed, high density electrical connector 有权
标题翻译：高速，高密度电连接器
公开(公告)号：US08814595B2
公开(公告)日：2014-08-26
申请号：US13354783
申请日：2012-01-20
申请人： Thomas S. Cohen , Huilin Ren , Marc B. Cartier, Jr. , Trent K. Do , Mark W. Gailus
发明人： Thomas S. Cohen , Huilin Ren , Marc B. Cartier, Jr. , Trent K. Do , Mark W. Gailus
IPC分类号： H01R13/648
CPC分类号： H01R13/04 , H01R13/6461 , H01R13/6473 , H01R13/6587
摘要： A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.
摘要翻译：宽侧耦合连接器组件具有两组导体，每个独立的平面。通过提供相同的路径长度，差分对的导体之间不存在偏斜，并且那些导体的阻抗相同。导体组是通过将第一组导体嵌入绝缘壳体而形成的，绝缘壳体具有带通道的顶表面。第二组导体放置在通道内，使得两组导体之间不会形成气隙。第二绝缘壳体填充在第二组导体上并进入通道以形成完整的晶片。第一组和第二组导体和叶片的端部在x和y坐标上均匀点动以减少串扰并提高电气性能。

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