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1. 发明授权

US08272877B2 High density electrical connector and PCB footprint 有权
标题翻译：高密度电连接器和PCB占位面积
公开(公告)号：US08272877B2
公开(公告)日：2012-09-25
申请号：US13070324
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, Jr.
发明人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, Jr.
IPC分类号： H01R12/00
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
摘要翻译：一种互连系统，其包括子卡和背板电连接器，每个连接器以连接器占用面积安装到印刷电路板。背板连接器具有导电元件，其具有过渡区域，其允许配合接触部分以均匀的间距定位，而接触尾部可被成形以改善信号完整性或提供更紧凑和/或机械坚固的覆盖区。两个连接器中的导电元件构造成使得接地导体的接触尾部从列到列对准，但是一列中的接地导体的平面部分与另一列中的一对信号导体对准，这改善了机械和信号完整性。可以通过用跨接多列的接地导体的焊盘形成连接器覆盖区来改善机械完整性。

2. 发明授权

US08182289B2 High density electrical connector with variable insertion and retention force 有权
标题翻译：具有可变插入和保持力的高密度电连接器
公开(公告)号：US08182289B2
公开(公告)日：2012-05-22
申请号：US13070343
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Donald A. Girard, Jr. , Huilin Ren
发明人： Philip T. Stokoe , Mark W. Gailus , Donald A. Girard, Jr. , Huilin Ren
IPC分类号： H01R13/648
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.
摘要翻译：一种互连系统，其包括在连接器覆盖区处安装到印刷电路板的子卡和背板电连接器。子卡连接器中的波束形触点的弹簧比率随着背板连接器的配合而增加，使得保持力可能大于插入力。弹簧速率的这种变化可以通过将梁状接触件邻近连接器壳体的表面定位来实现。该表面可以包括与梁状接触件对准的突起。当连接器不配合时，梁形接触件可以与突起物间隔开。当连接器开始配合时，梁形接触件的中心部分可以压靠在突起上，这具有缩短梁长度和增加其刚度的作用。

3. 发明授权

US08241067B2 Surface mount footprint in-line capacitance 有权
标题翻译：表面贴装尺寸的在线电容
公开(公告)号：US08241067B2
公开(公告)日：2012-08-14
申请号：US12612510
申请日：2009-11-04
申请人： Donald A. Girard, Jr. , Mark W. Gailus , Philip T. Stokoe
发明人： Donald A. Girard, Jr. , Mark W. Gailus , Philip T. Stokoe
IPC分类号： H01R13/66
CPC分类号： H01R13/6466 , H01R13/6587 , H05K3/34 , Y10T29/49144
摘要： An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.
摘要翻译：具有集成到电连接器的印刷电路板占位面积的电容器的互连系统。每个电容器的一端在印刷电路板上与连接器中的导电元件的接触尾部共享焊盘。共享焊盘不通过过孔连接到内部电路结构。相反，通常形成为连接器安装垫的一部分的通孔形成为单独的相邻垫的一部分。电容器的第二端附接到相邻的焊盘，通过电容器在导电元件和通孔之间形成电连接。将电容器集成到占位面积中减少了所需的通孔数量，从而提高了信号完整性。电容器可以与连接器分开地放置在印刷电路板上，或者可以并入到连接器中，从而允许将连接器和电容器放置在一个操作中。

4. 发明授权

US09472904B2 Discrete packaging adapter for connector 有权
标题翻译：用于连接器的分立包装适配器
公开(公告)号：US09472904B2
公开(公告)日：2016-10-18
申请号：US14461851
申请日：2014-08-18
申请人： Donald A. Girard, Jr. , Robert Auger , Mark W. Gailus
发明人： Donald A. Girard, Jr. , Robert Auger , Mark W. Gailus
IPC分类号： H01R13/66 , H05K5/02 , H05K5/06 , H05K13/00 , H01R13/6466 , H01R13/6473
CPC分类号： H05K5/0247 , H01R13/6466 , H01R13/6473 , H01R13/6625 , H05K1/0231 , H05K1/181 , H05K3/301 , H05K5/0021 , H05K5/0217 , H05K5/065 , H05K13/00 , H05K2201/10015 , H05K2201/10515
摘要： An adapter has two conductors each with a U-shaped bend forming upper longer legs and lower shorter legs. The conductors face each other with the longer legs linearly aligned with each other and the shorter legs aligned with each other, thereby forming a first gap between the longer legs and a second gap between the shorter legs. The first gap is substantially smaller than the second gap, so that an electrical package can be placed across the first gap to contact the two upper longer legs, while the two shorter legs are spaced further apart to span a larger gap between conductors of a connector. Thus, the adapter enables the electrical package to be connected to conductors having a gap that is larger than the electrical package.
摘要翻译：适配器具有两个导体，每个导体具有U形弯曲形成上部更长的腿部和较短的腿部。导体彼此面对，其中较长的腿线彼此直线对准并且较短的腿彼此对准，从而在较长腿部之间形成第一间隙，并在较短腿部之间形成第二间隙。第一间隙基本上小于第二间隙，使得电气封装可跨越第一间隙放置以接触两个较长的较长的腿，同时两个较短的腿彼此间隔开，以跨越连接器的导体之间较大的间隙。因此，适配器使得电气封装件能够连接到具有大于电气封装件的间隙的导体。

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