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1. 发明申请

US20200054881A1 HERMETIC TERMINAL FOR AN AIMD HAVING A PIN JOINT IN A FEEDTHROUGH CAPACITOR OR CIRCUIT BOARD 审中-公开
公开(公告)号：US20200054881A1
公开(公告)日：2020-02-20
申请号：US16656775
申请日：2019-10-18
申请人： Greatbatch Ltd.
发明人： Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
IPC分类号： A61N1/375 , A61N1/05 , H01G4/40 , A61N1/08 , H01G2/10 , H01G2/22 , H01R13/7195 , H01G4/35
摘要： A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

2. 发明授权

US10170874B1 Cable assembly having a substrate with multiple passive filtering devices between two sections of the cable assembly 有权
公开(公告)号：US10170874B1
公开(公告)日：2019-01-01
申请号：US15704096
申请日：2017-09-14
申请人： TE CONNECTIVITY CORPORATION
发明人： Brian Patrick Costello
IPC分类号： H01R13/66 , H01R13/7195 , H01R12/70 , H05K1/18 , H05K1/11 , H01R13/514 , H01R13/405 , H01R13/504
摘要： A cable assembly includes multiple electrical cables and a filtering module. The electrical cables are arranged in a first cable section and a second cable section. Each electrical cable has a pair of signal conductors. The filtering module includes a substrate and multiple passive filtering devices mounted on the substrate. The filtering module is disposed between the first cable section and the second cable section along a length of the cable assembly and is mechanically connected to ends of the first and second cable sections. The passive filtering devices are electrically connected to the signal conductors of the electrical cables. The cable assembly is configured to be electrically connected between first and second connectors. The filtering module is configured to filter electrical signals conveyed along the electrical cables between the first and second connectors.

3. 发明授权

US10080889B2 Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD 有权
公开(公告)号：US10080889B2
公开(公告)日：2018-09-25
申请号：US14187295
申请日：2014-02-23
申请人： Greatbatch Ltd.
发明人： Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel
IPC分类号： A61N1/375 , H01G4/40 , A61N1/08 , A61N1/37 , H01R13/7195 , H03H1/00 , H01R13/52 , H01G2/02 , H01G2/10 , H03H7/01
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01G2/02 , H01G2/10 , H01G4/40 , H01R13/5224 , H01R13/7195 , H01R2201/12 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085
摘要： A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.

4. 发明授权

US10016595B2 MLCC filter on an AIMD circuit board with ground electrical connection to a gold braze between a hermetic feedthrough ferrule and insulator 有权
公开(公告)号：US10016595B2
公开(公告)日：2018-07-10
申请号：US15373139
申请日：2016-12-08
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC分类号： A61N1/08 , H01G4/40 , A61N1/375 , A61N1/37 , H01G4/35 , H01R13/7195 , H03H1/00 , H05K9/00 , H03H7/01 , H05K5/00 , H05K1/18 , H01G4/06
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K999/99 , H05K2201/10015
摘要： An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

5. 再颁专利

USRE46699E1 Low impedance oxide resistant grounded capacitor for an AIMD 有权
公开(公告)号：USRE46699E1
公开(公告)日：2018-02-06
申请号：US15358202
申请日：2016-11-22
申请人： Greatbatch Ltd.
发明人： Jason Woods , Richard L. Brendel , Robert A. Stevenson , Christopher Michael Williams , Robert Naugler , Christine A. Frysz
IPC分类号： A61N1/00 , A61N1/375 , H01G4/40 , H01R13/7195 , H01G4/228 , H01G2/02 , H01G4/35 , H03H1/00 , H03H7/01
CPC分类号： H01R13/7195 , A61N1/086 , A61N1/3754 , A61N2001/086 , H01G4/06 , H01G4/228 , H01G4/35 , H01G4/40 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085
摘要： A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

6. 发明授权

US09108066B2 Low impedance oxide resistant grounded capacitor for an AIMD 有权
标题翻译：用于AIMD的低阻抗氧化物接地电容器
公开(公告)号：US09108066B2
公开(公告)日：2015-08-18
申请号：US14202653
申请日：2014-03-10
申请人： Greatbatch Ltd.
发明人： Jason Woods , Richard L. Brendel , Robert A. Stevenson , Christopher M. Williams , Robert Naugler , Christine A. Frysz
IPC分类号： A61N1/00 , A61N1/375 , H01G4/40 , H01R13/7195 , H03H1/00 , H01G4/35 , H01G2/02 , H01G4/228 , H03H7/01
CPC分类号： A61N1/3754 , H01G2/02 , H01G4/228 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085
摘要： A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.
摘要翻译：用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间，在体液侧和器件侧之间。馈通电容器设置在器件侧。第一低阻抗电连接在电容器的第一端金属化和导体之间。第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

7. 发明授权

US6106335A Crosstalk correction in electrical connectors 失效
标题翻译：电连接器中的串扰校正
公开(公告)号：US6106335A
公开(公告)日：2000-08-22
申请号：US92570
申请日：1998-06-05
申请人： James R. Merchant , Howard Reynolds , Rowland White
发明人： James R. Merchant , Howard Reynolds , Rowland White
IPC分类号： H01R13/33 , H01R4/24 , H01R13/506 , H01R13/6464 , H01R13/66 , H01R13/7195 , H01R24/64 , H02R13/66
CPC分类号： H01R13/506 , H01R13/6464 , H01R13/7195 , H01R24/64 , H01R4/2429 , Y10S439/941
摘要： Two rows of insulation displacement contacts are received in a connector housing. The contacts each comprise an insulation displacement end, a medial portion and a tail end. The medial portions are arranged across the housing body in grooves and the tail portions of the two rows extend from the housing in a common plane. Two non-proximate contacts of each row are connected at their medial portions by a capacitative coupling member which may comprise a chip capacitor or a pair of conducting plates connected by a bridge portion.
摘要翻译：两排绝缘位移触头接收在连接器外壳中。触头各自包括绝缘位移端，中间部分和尾端。中间部分跨过壳体主体设置在凹槽中，并且两排的尾部部分在壳体中在共同的平面内延伸。每行的两个非邻近触点在其中间部分处由电容耦合构件连接，电容耦合构件可包括通过桥接部连接的芯片电容器或一对导电板。

8. 发明授权

US5830016A Interference-proof device for electric connector 失效
标题翻译：电连接器用防干扰装置
公开(公告)号：US5830016A
公开(公告)日：1998-11-03
申请号：US790405
申请日：1997-01-29
申请人： Johnson Chuang
发明人： Johnson Chuang
IPC分类号： H01R13/66 , H01R13/7195
CPC分类号： H01R13/6666 , H01R13/6658 , H01R13/7195
摘要： An interference-proof device for electric connectors including many mutually opposed conductors arranged in lines and formed on material strips, the conductors have their respectively contact portions to be integrally and respectively connected to the material strips, many connect portions in identical shape are formed on the contact portions, many interference-proof members can be mounted between the connect portions; one portion of the conductors are used for connecting to a negative pole of a circuit board, and the other portion of the conductors are used for connecting to a plurality of pins; an interference-proof device for electric connectors capable of being mass produced yet its wave filtering effect being perfect can thus be formed.
摘要翻译：一种用于电连接器的防干扰装置，包括许多相互相对的导体，排列成线条并形成在材料条上，导体分别具有接触部分，以一体地分别连接到材料条上，许多相同形状的连接部分形成在接触部分，许多抗干扰构件可以安装在连接部分之间; 导体的一部分用于连接到电路板的负极，并且导体的另一部分用于连接到多个引脚; 因此可以形成能够大批量生产的电连接器的抗干扰装置，其波滤效果是完美的。

9. 发明授权

US5769666A Filtered connector 失效
标题翻译：过滤连接器
公开(公告)号：US5769666A
公开(公告)日：1998-06-23
申请号：US773609
申请日：1996-12-27
申请人： Kun-Tsan Wu
发明人： Kun-Tsan Wu
IPC分类号： H01R12/50 , H01R13/7195 , H01R13/66
CPC分类号： H01R13/7195 , H01R23/6873
摘要： An electrical filtered connector (10) comprises a unitary housing (12) defining a cavity (14) for receiving a complementary connector therein. A plurality of horizontal passageways (18) are disposed in the housing (12) lengthwise for receiving a corresponding number of contacts (20) therein. A plurality of vertical apertures (28) are disposed corresponding to and communicative to the passageways (18) respectively for receiving a corresponding number of capacitors (32) therein. A holding shell (36) is inserted into the housing (12) to protectively retain the capacitors (32) in the corresponding apertures (28), respectively. An internal shield (50) is inserted into the cavity (14) for shielding the housing (12) and cavity (14) and maintaining the holding shell (36) in position in the housing (12).
摘要翻译：电过滤连接器（10）包括限定用于在其中接收互补连接器的空腔（14）的整体式壳体（12）。多个水平通道（18）在纵向上设置在壳体（12）中，用于在其中接收相应数量的触点（20）。多个垂直孔（28）分别设置在通道（18）上并与其通信，以在其中接收相应数量的电容器（32）。保持壳体（36）插入到壳体（12）中，以分别将电容器（32）保护地保持在相应的孔（28）中。内部屏蔽件（50）被插入到空腔（14）中，用于屏蔽壳体（12）和空腔（14）并将保持壳体（36）保持在壳体（12）中的适当位置。

10. 发明授权

US5702258A Electrical connector assembled from wafers 失效
标题翻译：从晶圆组装的电连接器
公开(公告)号：US5702258A
公开(公告)日：1997-12-30
申请号：US623582
申请日：1996-03-28
申请人： Daniel B. Provencher , Philip T. Stokoe , Mark W. Gailus
发明人： Daniel B. Provencher , Philip T. Stokoe , Mark W. Gailus
IPC分类号： H01R12/50 , H01R13/514 , H01R13/7195 , H01R43/24 , H01R9/09
CPC分类号： H01R13/7195 , H01R23/6873 , H01R43/24
摘要： A modular electrical connector made from wafers. Each wafer contains one column of contact elements and is made separately. The wafers are of two different types, which snap together to form two row modules. The modules contain attachment features that allow them to be organized on a metal stiffener. Shield members can be optionally attached to each wafer so that the connector can be made in either a shielded or unshielded versions. In addition, each wafer includes windows through which selected contact elements can be cut to either improve the performance of the shields or to allow attachment of resistors.
摘要翻译：由晶圆制成的模块化电连接器。每个晶片包含一列接触元件，并分别制成。晶片有两种不同的类型，它们卡在一起形成两个行模块。模块包含附件功能，可以将它们组织在金属加强筋上。屏蔽构件可以可选地附接到每个晶片，使得连接器可以制成屏蔽或非屏蔽版本。此外，每个晶片包括窗口，通过该窗口，可以切割所选择的接触元件以改善屏蔽的性能或允许电阻器的附着。

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