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    • 1. 发明授权
    • Channel hot electron monitor
    • 通道热电子监视器
    • US4382229A
    • 1983-05-03
    • US210937
    • 1980-11-28
    • Peter E. CottrellRonald R. Troutman
    • Peter E. CottrellRonald R. Troutman
    • G01R31/26G01R31/22
    • G01R31/2621
    • This teaches that by measuring the rate of change in gate current of an insulating gate field effect transistor, under normal operating conditions, the time required to achieve a predetermined change in source-to-drain current in the transistor can be found. Because changes in gate current depends more on sensitivity on charge trapping in the oxide than do changes in channel current, and since the gate current occurs only in the small region of electron emission, the effects on gate current are more quickly developed than the secondary effect of reduced channel current due to the charge in gate oxide caused by the presence of trapped electrons.
    • 这表明,通过测量绝缘栅场效应晶体管的栅极电流的变化率,在正常工作条件下,可以找到实现晶体管中源极 - 漏极电流的预定变化所需的时间。 因为栅极电流的变化更多地取决于在沟道电流中改变氧化物中的电荷捕获的灵敏度,并且由于栅极电流仅发生在电子发射的小区域中,所以对栅极电流的影响比次级效应更快地发展 由于俘获电子的存在引起的栅极氧化物中的电荷引起的沟道电流减小。
    • 2. 发明授权
    • Twin diode overvoltage protection structure
    • 双二极管过压保护结构
    • US4626882A
    • 1986-12-02
    • US632098
    • 1984-07-18
    • Peter E. CottrellWilliam J. CraigRonald R. Troutman
    • Peter E. CottrellWilliam J. CraigRonald R. Troutman
    • H01L27/08H01L21/761H01L27/02H01L27/092H01L29/78
    • H01L27/0251H01L21/761H01L27/0925
    • Disclosed is an overvoltage protection structure which when used with CMOS circuits it protects them from overvoltage conditions while minimizing latch-up conditions in the structure. It consists of a well region of an opposite conductivity to that of the substrate defining a pocket region having a conductivity type which is similar to that of the substrate. A first PN junction diode is formed in a portion of the well region and a second PN junction diode is formed in the pocket region. The two diodes have opposite polarity and they both are connected to a signal line in such a way that one of the two diodes will be forward biased if the voltage on the signal line exceeds the bounds of the power supply voltages. The pocket region is connected to a V.sub.SS terminal which is normally grounded and the well region is connected to a power supply V.sub.DD. The doping concentration in the well region is predetermined to have a gradient so that minority carriers injected from one of the diodes in the well region will be repulsed and prevented from moving into the substrate region where they would be majority carriers and they could cause latch-up in the structure or at the very least adversely affect the voltage level of the substrate. Instead the injected carriers recombine in the well region or are collected by the adjacent isolated pocket region.When the second diode is forward biased, the minority carriers are injected into the isolated pocket region and are prevented from reaching the substrate by the underlying well region. This prevents these carriers from affecting the operation of adjacent circuits.
    • 公开了一种过电压保护结构,当与CMOS电路一起使用时,其保护它们免于过压状况,同时最小化结构中的闩锁状态。 它由与衬底相反的导电性的阱区域组成,该阱区限定具有类似于衬底的导电类型的穴区。 第一PN结二极管形成在阱区的一部分中,并且第二PN结二极管形成在腔区中。 两个二极管具有相反的极性,并且它们都以这样的方式连接到信号线,使得如果信号线上的电压超过电源电压的范围,则两个二极管中的一个将被正向偏置。 口袋区域连接到通常接地的VSS端子,并且阱区域连接到电源VDD。 阱区中的掺杂浓度被预定为具有梯度,使得从阱区中的二极管中的一个注入的少数载流子将被排斥并被阻止移动到它们将成为多数载流子的衬底区域中,并且它们可能导致闭锁 - 或者至少不利地影响衬底的电压电平。 相反,注入的载体在阱区域中重新组合或由相邻的隔离袋区域收集。 当第二二极管被正向偏置时,少数载流子被注入到隔离的袋区域中并被下面的阱区域阻止到达衬底。 这防止这些载波影响相邻电路的操作。
    • 3. 发明授权
    • Charge pumping structure for a substrate bias generator
    • 用于衬底偏置发生器的电荷泵浦结构
    • US4670669A
    • 1987-06-02
    • US640421
    • 1984-08-13
    • Peter E. CottrellWilliam J. CraigRonald R. Troutman
    • Peter E. CottrellWilliam J. CraigRonald R. Troutman
    • H01L27/04H01L21/822H01L27/02H03K3/354
    • H01L27/0222
    • A charge pumping structure is disclosed for use in a substrate bias voltage generator. It includes a capacitor on a substrate region for coupling to a first node periodic voltage signals received at a second node. A first diode structure provides a current path from the first node to the substrate and a second diode structure provides a current path between the first node and a reference potential, which is typically the ground. The first diode structure includes a PN junction diode, an isolation ring for collecting minority charge carriers injected into the substrate and is constructed on a portion of the substrate that has a lower doping concentration than the underlying substrate portion establishing a built-in electric field which inhibits the flow of minority carriers from the first diode to the underlying substrate. The second diode structure may include a pocket type PN junction diode constructed so that majority carriers are prevented from moving back into the substrate from which the substrate bias voltage generator will have to remove them.
    • 公开了用于衬底偏置电压发生器的电荷泵送结构。 它包括在衬底区域上的电容器,用于耦合到第一节点在第二节点处接收的周期性电压信号。 第一二极管结构提供从第一节点到衬底的电流路径,并且第二二极管结构提供第一节点和通常为地的参考电位之间的电流路径。 第一二极管结构包括PN结二极管,用于收集注入到衬底中的少数电荷载流子的隔离环,并且构建在衬底的一部分上,该衬底具有比下面的衬底部分更低的掺杂浓度,建立内置的电场, 抑制少数载流子从第一二极管流到下面的衬底。 第二二极管结构可以包括袖珍型PN结二极管,其被构造成使得多数载流子被阻止移回到衬底中,衬底偏置电压发生器将从该衬底移除它们。
    • 7. 发明授权
    • Transient gate tunneling current control
    • 瞬态栅极隧道电流控制
    • US06577178B1
    • 2003-06-10
    • US10064504
    • 2002-07-23
    • Kerry BernsteinPeter E. CottrellEdward J. NowakNorman J. RohrerDouglas W. Stout
    • Kerry BernsteinPeter E. CottrellEdward J. NowakNorman J. RohrerDouglas W. Stout
    • H03K1730
    • H03K19/00361H03K19/0948
    • A circuit includes a resistance-capacitance (RC) structure connected to a first set of transistors and a second set of transistors that perform the same logical function as the first set of transistors. The first set of transistors have thinner gate oxides than the second set of transistors. The RC structure drains an electric field from the first set of transistors, such that the first set of transistors are on only during initial transistor switching. In other words, the RC structure turns off the first set of transistors after transistor switching is completed. Also, the first set of transistors and the second set of transistors share common inputs and outputs. The first set of transistors exhibit higher tunneling currents than the second set of transistors. The thinner gate oxides of the first set of transistors cause the first set of transistors to exhibit higher device currents than the second set of transistors. The RC structure includes a capacitor connected to a gate of the first set of transistors and a resistor connected to the capacitor and to ground.
    • 电路包括连接到第一组晶体管的电阻 - 电容(RC)结构和执行与第一组晶体管相同的逻辑功能的第二组晶体管。 第一组晶体管具有比第二组晶体管更薄的栅极氧化物。 RC结构从第一组晶体管引出电场,使得第一组晶体管仅在初始晶体管切换期间导通。 换句话说,在晶体管切换完成之后,RC结构关闭第一组晶体管。 此外,第一组晶体管和第二组晶体管共享公共输入和输出。 第一组晶体管表现出比第二组晶体管更高的隧穿电流。 第一组晶体管的较薄的栅极氧化物导致第一组晶体管表现出比第二组晶体管更高的器件电流。 RC结构包括连接到第一组晶体管的栅极的电容器和连接到电容器并接地的电阻器。
    • 8. 发明授权
    • Simple process for making complementary transistors
    • 制造互补晶体管的简单过程
    • US4480375A
    • 1984-11-06
    • US448124
    • 1982-12-09
    • Peter E. CottrellHenry J. Geipel, Jr.
    • Peter E. CottrellHenry J. Geipel, Jr.
    • H01L27/092H01L21/8238H01L29/78H01L21/22H01L21/263
    • H01L21/823814Y10S438/981
    • A very simple process is provided, with reduced processing time, for making a CMOS structure using a single polysilicon, or other refractory metal, layer which includes forming a thin gate oxide on both N and P type semiconductor layers of a common substrate, forming a gate electrode simultaneously on the N type and on the P type layers and selectively implanting an N type impurity to form N+ source and drain regions in the P type layer. The semiconductor layers are then oxidized to form substantially thicker oxide, such a silicon dioxide, adjacent to the sides of the gate electrode over the P type layer than the thickness of the oxide adjacent to the sides of the gate electrode over the N type layer. Without using a mask, a P type impurity is implanted into the N type layer to form P+ source and drain regions.
    • 提供了一种非常简单的方法,缩短了处理时间,用于制造使用单个多晶硅的CMOS结构或其它难熔金属层,其包括在公共基板的N型和P型半导体层上形成薄的栅极氧化物,形成 栅电极同时在N型和P型层上,并且选择性地注入N型杂质以在P型层中形成N +源极和漏极区。 然后氧化氧化半导体层以形成比在N型层上与栅电极相邻的氧化物的厚度相邻的,比P型层更靠近栅电极侧面的基本上较厚的氧化物,例如二氧化硅。 在不使用掩模的情况下,将P型杂质注入到N型层中以形成P +源极和漏极区。