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1. 发明授权

US06908025B2 Preparing MCM hat for removal 失效
标题翻译：准备MCM帽子去除
公开(公告)号：US06908025B2
公开(公告)日：2005-06-21
申请号：US10604111
申请日：2003-06-26
申请人： Patrick A. Coico , Steven P. Ostrander , Sudipta K. Ray
发明人： Patrick A. Coico , Steven P. Ostrander , Sudipta K. Ray
IPC分类号： B23K1/018 , B23K31/02 , B23K31/00
CPC分类号： B23K1/018 , Y10T29/4973 , Y10T29/4975 , Y10T29/49824
摘要： A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.
摘要翻译：一种制备用于帽子去除的MCM的方法和装置，其中帽子包括热耦合到相应芯片的活塞。该装置包括加热器，该加热器定位成回流活塞和帽子的基座之间的接头; 以及用于将活塞偏压离开相应芯片的牵开器。该设备和过程的实施防止活塞在机械剪切过程中跨过相应芯片的顶部移动以去除帽子，以冲击芯片和周围部件。此外，由于活塞缩回，因此减少了活塞撞击或碎裂的可能性。此外，防止切入具有倾斜背面的相应芯片。因此，在进行其他维修时需要更换芯片和其他电子部件可能会大大降低。

2. 发明授权

US06278193B1 Optical sensing method to place flip chips 有权
标题翻译：放置倒装芯片的光学感应方法
公开(公告)号：US06278193B1
公开(公告)日：2001-08-21
申请号：US09206157
申请日：1998-12-07
申请人： Patrick A. Coico , James H. Covell
发明人： Patrick A. Coico , James H. Covell
IPC分类号： H01L23544
CPC分类号： H01L24/81 , H01L23/544 , H01L2223/5442 , H01L2223/54473 , H01L2224/81801 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/14
摘要： A method and structure for manufacturing semiconductor devices comprising providing a chip and a substrate, aligning the chip and the substrate, attaching the chip to the substrate and optionally verifying chip/substrate alignment, the aligning comprising providing at least one chip alignment mark on a first side of the chip (wherein the chip alignment mark corresponds to chip pads on a second side of the chip) and aligning the alignment mark with substrate pads on the substrate.
摘要翻译：一种用于制造半导体器件的方法和结构，包括提供芯片和衬底，对准芯片和衬底，将芯片连接到衬底并且可选地验证芯片/衬底对准，该对准包括在第一衬底上提供至少一个芯片对准标记（其中芯片对准标记对应于芯片的第二侧上的芯片焊盘），并将对准标记与衬底上的衬底焊盘对准。

3. 发明授权

US5773561A Polymer sealants/adhesives and use thereof in electronic package assembly 失效
标题翻译：聚合物密封剂/粘合剂及其在电子封装组件中的用途
公开(公告)号：US5773561A
公开(公告)日：1998-06-30
申请号：US692033
申请日：1996-08-02
申请人： Krishna Gandhi Sachdev , Michael Berger , Patrick A. Coico , Frank L. Pompeo
发明人： Krishna Gandhi Sachdev , Michael Berger , Patrick A. Coico , Frank L. Pompeo
IPC分类号： C08L79/08 , C08G73/10 , C09J179/08 , C09J183/10 , H01L21/52 , C08G69/26
CPC分类号： C09J183/10 , C08G73/1042 , C08G73/106 , C09J179/08 , Y10T428/31681
摘要： The present invention relates generally to a new adhesive comprising a vinyl containing siloxane-containing polyimide for use in TSM capping of electronic package assemblies with adhesive capability of providing a seal band width of less than 4mm and even less than 2mm, solubility in non-toxic and environmentally safe solvents and durable adhesive properties and to a method for making the polyimides, a method for using the polyimides to make electronic packages and electronic packages made using the adhesive. The preferred vinyl-containing siloxane containing polyimide is a block type polymer containing blocks of a dianhydride-aromatic diamine oligomeric reaction product joined by non-vinyl/vinyl containing siloxane diamine forming links.
摘要翻译：本发明一般涉及包含含乙烯基的含硅氧烷的聚酰亚胺的新型粘合剂，用于电子封装组件的TSM封盖，具有提供小于4mm甚至小于2mm的密封带宽度的粘合能力，在无毒的溶解度和环境安全的溶剂和耐久的粘合性能以及制造聚酰亚胺的方法，使用聚酰亚胺制造使用该粘合剂制成的电子封装和电子封装的方法。优选的含乙烯基的含硅氧烷的聚酰亚胺是含有通过非乙烯基/乙烯基的硅氧烷二胺形成连接物连接的二酐 - 芳族二胺低聚反应产物的嵌段的嵌段型聚合物。

4. 发明授权

US08687364B2 Directly connected heat exchanger tube section and coolant-cooled structure 有权
标题翻译：直接连接热交换器管段和冷却剂冷却结构
公开(公告)号：US08687364B2
公开(公告)日：2014-04-01
申请号：US13283933
申请日：2011-10-28
申请人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： B23P15/26 , H05K7/20781 , H05K7/20827 , Y10T29/4935 , Y10T29/49826
摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.
摘要翻译：提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合与冷却剂回路流体连通以便于冷却剂流过管段。冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

5. 发明授权

US06339534B1 Compliant leads for area array surface mounted components 失效
标题翻译：符合区域阵列表面安装元件的导线
公开(公告)号：US06339534B1
公开(公告)日：2002-01-15
申请号：US09434269
申请日：1999-11-05
申请人： Patrick A. Coico , Luc Guerin
发明人： Patrick A. Coico , Luc Guerin
IPC分类号： H05K702
CPC分类号： H05K13/0465 , H01L23/49811 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01R12/57 , H05K3/3426 , Y02P70/613 , H01L2224/0401
摘要： An area array integrated circuit package having contact pads is provided with compliant rectangular shaped connection leads each attached to a contact pad. The leads are arranged and oriented on the surface of the package around the neutral point of the package such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.
摘要翻译：具有接触焊盘的区域阵列集成电路封装设置有各自附接到接触焊盘的柔性矩形连接引线。引线被布置和定向在封装的中性点周围的表面上，使得每个引线的平坦宽度尺寸面向接触阵列的中性点，从而提供对热诱导变形的最佳顺应性，并且导致改善的互连可靠性。

6. 发明授权

US6049456A Electronic module adjustment design and process using shims 有权
标题翻译：电子模块调整设计和使用垫片的过程
公开(公告)号：US6049456A
公开(公告)日：2000-04-11
申请号：US152904
申请日：1998-09-14
申请人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
发明人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/09701
摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.
摘要翻译：描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。最优选地，垫片符合盖板或底板的周边。还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。选择一个或多个垫片，其等于初始读数和第二读数之间的差。拆下盖板，并用适当的垫片更换垫片。然后将盖板固定在基板上。还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。

7. 发明授权

US5975409A Ceramic ball grid array using in-situ solder stretch 失效
标题翻译：陶瓷球栅阵列使用原位焊料拉伸
公开(公告)号：US5975409A
公开(公告)日：1999-11-02
申请号：US909865
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： H01L21/60 , H05K3/34 , B23K31/02 , B23K37/04
CPC分类号： H01L24/81 , H01L24/75 , H05K3/3436 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2203/0195 , H05K2203/0465 , H05K2203/082 , H05K2203/306 , Y02P70/613
摘要： A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
摘要翻译：提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。

8. 发明授权

US07518235B2 Method and structure to provide balanced mechanical loading of devices in compressively loaded environments 失效
标题翻译：在压缩负载环境中提供均衡的机械负载装置的方法和结构
公开(公告)号：US07518235B2
公开(公告)日：2009-04-14
申请号：US10906809
申请日：2005-03-08
申请人： Patrick A. Coico , David L. Edwards , Benjamin V. Fasano , Lewis S. Goldmann , Ellyn M. Ingalls , Michael S. June , Hilton T. Toy , Paul A. Zucco
发明人： Patrick A. Coico , David L. Edwards , Benjamin V. Fasano , Lewis S. Goldmann , Ellyn M. Ingalls , Michael S. June , Hilton T. Toy , Paul A. Zucco
IPC分类号： H01L23/34
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.
摘要翻译：集成电路芯片安装结构包括芯片载体，其电连接到具有安装在芯片载体上的集成电路芯片的电路板。此外，导热装置热连接到芯片，并且提供一组可压缩支撑构件以将施加的压缩载荷的一部分从导热装置传递到芯片和芯片载体。

9. 发明授权

US07468886B2 Method and structure to improve thermal dissipation from semiconductor devices 失效
标题翻译：改善半导体器件散热的方法和结构
公开(公告)号：US07468886B2
公开(公告)日：2008-12-23
申请号：US11681994
申请日：2007-03-05
申请人： Patrick A. Coico , David L. Edwards , Richard F. Indyk , David C. Long
发明人： Patrick A. Coico , David L. Edwards , Richard F. Indyk , David C. Long
IPC分类号： H05K7/20 , H01L21/48 , H01L23/10
CPC分类号： H01L21/4871 , H01L21/50 , H01L23/3675 , H01L24/16 , H01L24/31 , H01L25/16 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.
摘要翻译：改进模块组件散热的方法和结构包括将至少一个芯片的第一侧附接到单个芯片载体上，所述至少一个芯片具有与第一侧相对的第二侧; 将所述至少一个芯片的第二侧研磨成所需的表面轮廓; 在散热片和所述至少一个芯片的第二面中的至少一个上施加传热介质; 以及将所述散热器布置在所述至少一个芯片的第二侧上，其中所述传热介质在所述散热器和所述至少一个芯片的所述第二侧之间限定间隙。控制间隙以改善从至少一个芯片的第二侧到散热器的热传递。

10. 发明授权

US06255139B1 Method for providing a thermal path through particles embedded in a thermal cap 失效
标题翻译：提供通过嵌入在热盖中的颗粒的热路径的方法
公开(公告)号：US06255139B1
公开(公告)日：2001-07-03
申请号：US09369083
申请日：1999-08-05
申请人： David L. Edwards , Patrick A. Coico , Sushumna Iruvanti , Frank L. Pompeo , Raed A. Sherif , Hilton T. Toy
发明人： David L. Edwards , Patrick A. Coico , Sushumna Iruvanti , Frank L. Pompeo , Raed A. Sherif , Hilton T. Toy
IPC分类号： H01L2148
CPC分类号： H01L23/3737 , H01L23/367 , H01L23/3733 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/16152
摘要： The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.
摘要翻译：本发明一般涉及一种用于提高使用散热膏冷却半导体模块中的芯片的冷却设计的可靠性的新方法及其结构。更具体地说，本发明包括一种结构和方法，该结构和方法使用热冷却帽内部的与热膏接触的表面化学改性。盖的内表面通过包埋具有与用于热膏中的一种或多种固体相同的化学组成的颗粒来改性。颗粒可以通过铸造，喷砂或将颗粒永久地压入表面而嵌入盖中。

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