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1. 发明授权

US11961785B2 Circuit carrier arrangement and method for producing such a circuit carrier arrangement 有权
公开(公告)号：US11961785B2
公开(公告)日：2024-04-16
申请号：US18215854
申请日：2023-06-29
申请人： Vitesco Technologies GmbH
发明人： Jens Reiter , Rico Hartmann , Christian Lammel
IPC分类号： H01L23/40 , H01L25/11 , H05K1/18
CPC分类号： H01L23/4006 , H05K1/18 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L25/115 , H05K2201/09063 , H05K2201/1059 , H05K2201/10598 , H05K2201/10757
摘要： A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

2. 发明授权

US11699633B1 Pressure balancing clamp for press-pack insulated gate bipolar transistor module 有权
公开(公告)号：US11699633B1
公开(公告)日：2023-07-11
申请号：US18148986
申请日：2022-12-30
申请人： Beijing University of Technology
发明人： Tong An , Rui Zhou , Yakun Zhang , Fei Qin
IPC分类号： H01L23/40 , H01L23/473 , F16F15/04
CPC分类号： H01L23/4006 , H01L23/473 , F16F15/04 , H01L2023/4025 , H01L2023/4081 , H01L2023/4087
摘要： Disclosed is a pressure balancing clamp for a press-pack insulated gate bipolar transistor (IGBT) module. The pressure balancing clamp for a press-pack IGBT module includes a bracket, where the bracket is provided with two longitudinally arranged pressure equalizing plates in a sliding way; the pressure equalizing plates are connected through pressure sensors; the upper and lower ends inside the bracket are respectively connected with the pressure equalizing plates through hydraulic devices and a displacement compensation device; opposite surfaces of the two pressure equalizing plates are respectively provided with heat dissipation and confluence devices. The pressure sensors are in one-to-one correspondence with the hydraulic devices and are electrically connected. The hydraulic devices adjust the pressure according to the readings of the pressure sensors in corresponding directions, so that the pressure of the press-pack IGBT module is balanced.

3. 发明授权

US10879149B2 Locating unit with base seat locating structure 有权
公开(公告)号：US10879149B2
公开(公告)日：2020-12-29
申请号：US16384951
申请日：2019-04-16
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin
IPC分类号： H01L23/40
CPC分类号： H01L23/4006 , H01L23/4093 , H01L2023/4081
摘要： A locating unit with a base seat locating structure. The base seat locating structure includes a base seat and a locating unit. The base seat has a pair of locating holes each having a first locating hole section and a second locating hole section and a connection section connected therebetween. The second locating hole section has a locating recess. The locating unit has a main body having a first side and a second side and a through hole passing through the main body between the first and second sides. A first protruding key and a second protruding key protrude from the second side beside the through hole. The first and second protruding keys are displaceably assembled and connected with the locating holes. Free ends of the first and second protruding keys respectively have a first end section and a second end section connected and assembled with the locating recesses.

4. 发明授权

US10082665B2 DMD assembly, DLP optical engine and DLP projection device 有权
公开(公告)号：US10082665B2
公开(公告)日：2018-09-25
申请号：US15600950
申请日：2017-05-22
申请人： Hisense Co., Ltd.
发明人： Naiwen Hou , Xintuan Tian , Changming Yang
IPC分类号： G03B21/16 , H04N9/31 , H01L23/40 , G02B26/08 , G03B21/00 , G03B21/14 , G02B7/00
CPC分类号： G02B26/0833 , G02B7/003 , G02B7/181 , G03B21/008 , G03B21/145 , G03B21/16 , H01L23/4006 , H01L2023/405 , H01L2023/4056 , H01L2023/4081 , H01L2023/4087 , H04N9/3102 , H04N9/3114 , H04N9/315
摘要： The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device. The DMD assembly includes a base, a driver board, a chip substrate with a DMD chip and a fixing frame, where a first side of the base is provided with a mounting groove for mounting the chip substrate, a second side of the base is attached to the driver board, and the first side is opposite to the second side; a conductive spring leaf on the base extends through a bottom of the mounting groove and is beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaf; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first hole corresponds to position of the second hole, and the driver board and the fixing frame are fixed by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted.

5. 发明申请

US20180213682A1 SECURING MECHANISM AND ELECTRONIC DEVICE WITH SAME 审中-公开
公开(公告)号：US20180213682A1
公开(公告)日：2018-07-26
申请号：US15454091
申请日：2017-03-09
申请人： AURAS Technology Co., Ltd.
发明人： AN-CHIH WU , MU-SHU FAN , HSIN-CHANG CHEN , HUNG-YI KUO , MING-CHIEH LI
IPC分类号： H05K7/20 , H01L23/40 , H01L23/367 , H05K7/14 , F28F9/00
CPC分类号： H05K7/2049 , F28F9/002 , H01L23/3672 , H01L23/4093 , H01L2023/405 , H01L2023/4081
摘要： A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source.

6. 发明申请

US20170271229A1 Spatially selective roughening of encapsulant to promote adhesion with functional structure 审中-公开
公开(公告)号：US20170271229A1
公开(公告)日：2017-09-21
申请号：US15462858
申请日：2017-03-19
申请人： Infineon Technologies AG
发明人： Norbert Joson SANTOS , Edward FUERGUT , Sanjay Kumar MURUGAN
IPC分类号： H01L23/31 , H01L23/00 , H01L21/56 , H01L21/3105 , H01L21/02 , H01L23/495 , H01L21/67 , H01L33/48 , H01L33/54 , H01L33/62 , H01L33/64 , H01L33/60 , H01L33/58 , H01L23/40 , H01L43/02 , H01L23/367
CPC分类号： H01L23/3114 , H01L21/0206 , H01L21/31058 , H01L21/565 , H01L21/67126 , H01L23/24 , H01L23/3107 , H01L23/3135 , H01L23/3142 , H01L23/3675 , H01L23/4006 , H01L23/49541 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/642 , H01L43/02 , H01L2023/405 , H01L2023/4081 , H01L2023/4087 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/12041 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00012 , H01L2224/45099
摘要： An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.

7. 发明申请

US20160329264A1 SEMICONDUCTOR ASSEMBLY 有权
标题翻译：半导体大会
公开(公告)号：US20160329264A1
公开(公告)日：2016-11-10
申请号：US14442049
申请日：2012-12-07
申请人： ABB TECHNOLOGY LTD
发明人： Olle EKWALL , Erik DORÉ , Franc DUGAL , Raffael SCHNELL
IPC分类号： H01L23/40 , H02M7/00 , H01L25/07 , H01L25/11 , H01L23/367 , H01L23/473
CPC分类号： H01L23/4012 , H01L23/3675 , H01L23/4006 , H01L23/473 , H01L24/72 , H01L25/071 , H01L25/074 , H01L25/117 , H01L25/16 , H01L2023/4031 , H01L2023/4081 , H01L2023/4087 , H01L2924/1305 , H01L2924/13055 , H02M7/003 , H05K7/209 , H01L2924/00
摘要： A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.
摘要翻译：半导体组件包括具有半导体模块和冷却器的堆叠，其中半导体模块设置成与冷却器接触。夹紧组件适于在堆叠的两侧施加力。该堆叠在其两侧之间设置有通孔，并且夹持组件的一部分包括延伸穿过堆叠的通孔的导电部分。由此，提供紧凑的机械布置，同时获得改进的电性能，例如较低的电感和更均匀的电流分布。

8. 发明授权

US09448597B2 Electronic device with serviceable CPU 有权
标题翻译：具有可维修CPU的电子设备
公开(公告)号：US09448597B2
公开(公告)日：2016-09-20
申请号：US14028655
申请日：2013-09-17
申请人： Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
发明人： Aaron R. Cox , Zhen De Fu , Lei R. Li , Jason E. Minyard , Joni E. Saylor
IPC分类号： G06F1/18 , H05K7/14 , G06F1/20 , H01L23/40
CPC分类号： G06F1/181 , G06F1/183 , G06F1/20 , H01L23/4006 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H05K7/1401 , H05K7/1431 , Y10T29/4913 , H01L2924/00
摘要： An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.
摘要翻译：电子设备包括盖子中的开口，从开口延伸到电路板的套筒以及CPU组件。 CPU组件包括一个CPU托架，并可插入套管中，以将CPU托架与电路板上的CPU连接器相连。将CPU组件安装到电子设备中的方法包括将CPU组件插入到从开口延伸到电路板的套筒内的电子设备的盖中的开口中。可维修的CPU组件包括热连接到散热器的下部的下侧的CPU载体，包括多个引导特征以在安装期间正确对准CPU组件的CPU组件基座，以及包括至少一个手柄连接的手柄组件到散热器的上部。

9. 发明授权

US09435590B2 Thin heat transfer device for thermal management 有权
标题翻译：薄型传热装置，用于热管理
公开(公告)号：US09435590B2
公开(公告)日：2016-09-06
申请号：US14247058
申请日：2014-04-07
申请人： Microsoft Technology Licensing, LLC
发明人： Jeffrey Taylor Stellman
IPC分类号： F28F13/00 , B23P15/26 , H05K7/20 , G06F1/20 , H01L23/40 , H01L23/427
CPC分类号： F28F13/00 , B23P15/26 , F28F2013/005 , F28F2275/08 , F28F2280/00 , G06F1/20 , G06F1/203 , H01L23/4006 , H01L23/4093 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H05K7/20509 , Y10T29/4935 , H01L2924/00
摘要： A thin design heat transfer device for thermal management is described herein. The heat transfer device uses a cold plate that is independent or “floating” relative to a spring mechanism employed to generate contact pressure with a heat-generating device. A bridge component associated with the spring mechanism is designed to span over the cold plate and contact the cold plate when the spring deforms, which therefore allows the cold plate to be independent of the spring mechanism. The independence between the cold plate and the spring mechanism enables deformation in the spring mechanism to drive contact pressure while eliminating or reducing corresponding deformation in the cold plate. Consequently, components of the heat transfer device may be made relatively thin and have less stiffness than traditional designs, but still provide acceptable contact pressure and quality for effective thermal management.
摘要翻译：本文描述了用于热管理的薄设计传热装置。传热装置使用相对于用于与发热装置产生接触压力的弹簧机构独立或“浮动”的冷板。与弹簧机构相关联的桥梁部件设计成跨越冷板并且当弹簧变形时接触冷板，从而允许冷板独立于弹簧机构。冷板和弹簧机构之间的独立性使得能够在弹簧机构中变形以驱动接触压力，同时消除或减少冷板中的相应变形。因此，传热装置的部件可以制成相对较薄并且具有比传统设计更小的刚度，但仍然提供可接受的接触压力和质量用于有效的热管理。

10. 发明授权

US09382938B2 Sprung washer and fixing device 有权
标题翻译：弹簧垫圈和固定装置
公开(公告)号：US09382938B2
公开(公告)日：2016-07-05
申请号：US14052930
申请日：2013-10-14
申请人： FUJITSU LIMITED
发明人： Mitsuaki Hayashi , Osamu Saito , Wataru Takano , Takaharu Izuno , Kenji Joko , Hideaki Matsumoto , Takashi Shirakami , Minoru Fujii
IPC分类号： F16B43/00 , H01L23/40 , F16B5/02
CPC分类号： F16B43/00 , F16B5/0266 , H01L23/4006 , H01L2023/4075 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A fixing-device that fixes a second member to be fastened to a first member to be fastened, the fixing-device includes, a base fixed to the first member to be fastened, a sprung-washer attached to the base and interposed between the base and the second member to be fastened, and a fastener that fastens the second member to be fastened and the base to each other, wherein the sprung-washer includes a threaded-portion insertion-hole into which a threaded-portion of the fastener is inserted, an edge-portion that is formed around the threaded-portion insertion-hole, and with which a pressing-portion provided in the fastener comes into contact and that is thereby pressed when the fastener is tightened, and a leaf-spring that extends from the edge-portion forward in a direction in which the fastener is inserted into the threaded-portion insertion-hole and outward, and that has a bent-portion midway along the length of the leaf-spring.
摘要翻译：一种固定装置，其将要紧固的第二构件固定到要紧固的第一构件上，所述定影装置包括固定到要紧固的第一构件的基座，附接到所述基部并且插入在所述基座之间的弹簧垫圈以及要紧固的第二构件，以及将要紧固的第二构件和基座彼此紧固的紧固件，其中，所述簧上垫圈包括螺纹部分插入孔，所述紧固件的螺纹部分插入到所述螺纹部分插入孔中形成在所述螺纹部插入孔周围的边缘部，并且设置在所述紧固件中的按压部与所述边缘部接触，并且由此在紧固件被紧固时被按压;以及叶簧，其从所述边缘部沿着所述紧固件插入所述螺纹部插入孔的方向向前方前方，并且在所述片簧的长度方向上具有弯曲部。

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