专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06524657B2 Solvent systems for polymeric dielectric materials 失效
公开(公告)号：US06524657B2
公开(公告)日：2003-02-25
申请号：US10143039
申请日：2002-05-07
申请人： Oana M. Leonte , Tadashi Nakano , Kelly M. Beres , Kreisler Lau
发明人： Oana M. Leonte , Tadashi Nakano , Kelly M. Beres , Kreisler Lau
IPC分类号： B05D136
CPC分类号： H01L21/02118 , C08J3/095 , H01L21/02126 , H01L21/02216 , H01L21/02222 , H01L21/02282 , H01L21/312 , Y10T428/31504
摘要： Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.

2. 发明授权

US06413202B1 Solvent systems for polymeric dielectric materials 失效
标题翻译：高分子电介质材料溶剂体系
公开(公告)号：US06413202B1
公开(公告)日：2002-07-02
申请号：US09340976
申请日：1999-06-28
申请人： Oana M. Leonte , Tadashi Nakano , Kelly M. Beres , Kreisler Lau
发明人： Oana M. Leonte , Tadashi Nakano , Kelly M. Beres , Kreisler Lau
IPC分类号： C08G7902
CPC分类号： H01L21/02118 , C08J3/095 , H01L21/02126 , H01L21/02216 , H01L21/02222 , H01L21/02282 , H01L21/312 , Y10T428/31504
摘要： Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
摘要翻译：已经发现芳族脂族醚溶剂如苯甲醚，甲基苯甲醚和苯乙醚可用于配制聚合物电介质材料的涂料溶液和作为涂布过程中的清洁溶剂。在衬底上形成电介质膜的方法包括将介电材料的涂布溶液在配方溶剂中沉积到衬底的表面上，并将芳族脂族醚溶剂沉积在衬底表面的边缘部分上。该方法用于形成包括亚芳基醚介电聚合物，氢化硅氧烷树脂，有机氢硅氧烷树脂，旋涂玻璃材料，固化以形成纳米多孔介电二氧化硅材料的部分水解和部分缩合的烷氧基硅烷组合物的介电材料的膜，以及聚（ perhydrido）硅氮烷。

3. 发明授权

US06878796B2 Solvent systems for polymeric dielectric materials 失效
标题翻译：高分子电介质材料溶剂体系
公开(公告)号：US06878796B2
公开(公告)日：2005-04-12
申请号：US10299320
申请日：2002-11-18
申请人： Oana Leonte , Tadashi Nakano , Kelly Beres , Kreisler Lau
发明人： Oana Leonte , Tadashi Nakano , Kelly Beres , Kreisler Lau
IPC分类号： C08J3/09 , H01L21/312 , C08G79/02 , B05D1/36
CPC分类号： H01L21/02118 , C08J3/095 , H01L21/02126 , H01L21/02216 , H01L21/02222 , H01L21/02282 , H01L21/312 , Y10T428/31504
摘要： Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
摘要翻译：已经发现芳族脂族醚溶剂如苯甲醚，甲基苯甲醚和苯乙醚可用于配制聚合物电介质材料的涂料溶液和作为涂布过程中的清洁溶剂。在衬底上形成电介质膜的方法包括将介电材料的涂布溶液在配方溶剂中沉积到衬底的表面上，并将芳族脂族醚溶剂沉积在衬底表面的边缘部分上。该方法用于形成包括亚芳基醚介电聚合物，氢化硅氧烷树脂，有机氢硅氧烷树脂，旋涂玻璃材料，固化以形成纳米多孔介电二氧化硅材料的部分水解和部分缩合的烷氧基硅烷组合物的介电材料的膜，以及聚（ perhydrido）硅氮烷。

4. 发明申请

US20070155997A1 Organic compositions 审中-公开
标题翻译：有机成分
公开(公告)号：US20070155997A1
公开(公告)日：2007-07-05
申请号：US10536884
申请日：2003-12-31
申请人： Bo Li , Kreisler Lau , Paul Apen
发明人： Bo Li , Kreisler Lau , Paul Apen
IPC分类号： C07C13/615
CPC分类号： C07C17/10 , C07C13/615 , C07C13/64 , C07C17/269 , C07C2603/74 , C07C2603/90 , C08G61/06 , C07C23/46 , C07C25/22
摘要： Compositions and methods of forming and using those compositions are provided herein where the composition comprises at least one oligomer or polymer of Formula I wherein E is a cage compound; each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; A is substituted or unsubstituted aryl with substituted or unsubstituted arylalkynyl group (substituents include hydrogen, halogen, alkyl, phenyl or substituted aryl; and aryl includes phenyl, biphenyl, naphthyl, terphenyl, anthracenyl, polyphenylene, polyphenylene ether, or substituted aryl); h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1.
摘要翻译：本文提供了组合物和形成和使用这些组合物的方法，其中组合物包含至少一种式I的低聚物或聚合物，其中E是笼形化合物; 每个Q相同或不同，选自芳基，支链芳基和取代芳基，其中取代基包括氢，卤素，烷基，芳基，取代的芳基，杂芳基，芳基醚，烯基，炔基，烷氧基，羟基烷基，羟基芳基，羟基烯基，羟基炔基，羟基或羧基; A是取代或未取代的具有取代或未取代的芳基炔基的芳基（取代基包括氢，卤素，烷基，苯基或取代的芳基;芳基包括苯基，联苯基，萘基，三联苯基，蒽基，聚亚苯基，聚苯醚或取代的芳基）。 h为0〜10; 我是从0到10; j为0〜10; w为0或1。

5. 发明申请

US20050090596A1 Organic composition 审中-公开
标题翻译：有机成分
公开(公告)号：US20050090596A1
公开(公告)日：2005-04-28
申请号：US10404676
申请日：2003-04-02
申请人： Paul Apen , Kreisler Lau , Boris Korolev , Bo Li , Ruslan Zherebin , Edward Sullivan , Christian Werner , Sonja Demel , Bernd Kellermeier , Andreas Kanschik-Conradsen
发明人： Paul Apen , Kreisler Lau , Boris Korolev , Bo Li , Ruslan Zherebin , Edward Sullivan , Christian Werner , Sonja Demel , Bernd Kellermeier , Andreas Kanschik-Conradsen
IPC分类号： C08G61/02 , C08G61/12 , C08K5/01
CPC分类号： C08G61/02 , C08G61/12
摘要： The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.
摘要翻译：本发明提供金刚烷或二金刚烷组合物，其可用作微电子应用如微芯片中的电介质材料。

6. 发明授权

US07307137B2 Low dielectric constant materials and methods of preparation thereof 有权
标题翻译：低介电常数材料及其制备方法
公开(公告)号：US07307137B2
公开(公告)日：2007-12-11
申请号：US10466651
申请日：2001-10-18
申请人： Kreisler Lau , Feng Quan Liu , Paul Apen , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek , Roger Leung
发明人： Kreisler Lau , Feng Quan Liu , Paul Apen , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek , Roger Leung
IPC分类号： C08G63/78
CPC分类号： C08G61/12 , C07C13/615 , C07C13/64 , C07C15/54 , C07C17/10 , C07C17/269 , C07C2603/74 , C07C2603/90 , C07F7/0805 , C08F238/00 , C08G61/02 , H01L2924/0002 , C07C23/46 , C07C25/22 , H01L2924/00
摘要： The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer. In yet another aspect of the inventive subject matter, spin-on low dielectric constant materials are formed having a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbone are crosslinked via the first and second reactive groups in a crosslinking reaction preferably without an additional crosslinker, and wherein a cage structure having at least eight (8) atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：本发明涉及低介电聚合物以及生产这些低介电常数聚合物，介电材料和层以及电子元件的方法。在本发明的一个方面，提供其中单体具有核心结构和多个臂的热固性单体的异构体混合物，并且热固性单体的异构体混合物聚合，其中聚合包括乙炔基其位于单体的至少一个臂中。在本发明主题的另一方面，形成旋涂低介电常数材料，其具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一并且第二主链在交联反应中通过第一和第二反应性基团交联，优选不含另外的交联剂，并且其中具有至少八个（8）原子的笼结构共价结合至第一和第二主链中的至少一个。

7. 发明授权

US06444715B1 Low dielectric materials and methods of producing same 失效
公开(公告)号：US06444715B1
公开(公告)日：2002-09-03
申请号：US09587851
申请日：2000-06-06
申请人： Shyama Mukherjee , Roger Leung , Kreisler Lau
发明人： Shyama Mukherjee , Roger Leung , Kreisler Lau
IPC分类号： C08J928
CPC分类号： H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02343 , H01L21/31695 , Y10T428/259
摘要： In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.

8. 发明授权

US06849696B2 Low dielectric constant organic dielectrics based on cage-like structures 失效
标题翻译：基于笼状结构的低介电常数有机电介质
公开(公告)号：US06849696B2
公开(公告)日：2005-02-01
申请号：US10293024
申请日：2002-11-12
申请人： Kreisler Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Roger Leung
发明人： Kreisler Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Roger Leung
IPC分类号： C08G65/40 , C08F8/00 , C08F257/02 , C08F277/00 , C08F281/00 , C08G61/12 , C08G81/00 , C08J3/24 , C08L1/00 , C08L51/00 , C08L67/00 , C08L67/06 , C08L71/12 , H01L20060101 , H01L21/312
CPC分类号： C08J3/246 , C08F257/02 , C08G61/12 , C08L51/003 , Y10S977/902 , Y10S977/963 , C08L2666/02
摘要： A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：低介电常数材料具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一和第二主链通过第一和第二反应性基团在交联反应而没有额外的交联剂，并且其中具有至少10个原子的笼状结构与第一和第二主链中的至少一个共价结合。

9. 发明申请

US20050020702A1 Organic compositions 审中-公开
标题翻译：有机成分
公开(公告)号：US20050020702A1
公开(公告)日：2005-01-27
申请号：US10735579
申请日：2003-12-12
申请人： Bo Li , Paul Apen , Kreisler Lau , Edward Sullivan
发明人： Bo Li , Paul Apen , Kreisler Lau , Edward Sullivan
IPC分类号： C07C17/10 , C07C17/266 , C07C25/22 , C07C25/24 , C08G61/02 , C08L65/00 , H01L21/312 , H01L21/316 , H01L21/768 , H01L23/14 , H01L23/532 , H05K1/00 , H05K1/02 , H05K1/03 , C08J9/38
CPC分类号： C07C17/10 , C07C17/266 , C07C25/22 , C07C25/24 , C08G61/02 , C08L65/00 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L21/31695 , H01L23/145 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/024 , H05K1/0313 , H05K3/4676 , C07C23/46 , H01L2924/00
摘要： The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.
摘要翻译：本发明提供一种组合物，其包含（a）热固性组分，其包含：（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中E，Q，G， h，I，j和w如下所述，（b）与热固性组分（a）键合的致孔剂。优选地，造孔剂选自未取代的聚降冰片烯，取代的聚降冰片烯，聚己内酯，未取代的聚苯乙烯，取代的聚苯乙烯，聚苊烯均聚物和聚苊烯共聚物。优选地，本发明组合物可以用作微芯片，多芯片模块，层叠电路板或印刷线路板中的电介质基板。

10. 发明授权

US06803441B2 Compositions and methods for thermosetting molecules in organic compositions 失效
标题翻译：有机组合物中热固性分子的组成和方法
公开(公告)号：US06803441B2
公开(公告)日：2004-10-12
申请号：US10267380
申请日：2002-10-08
申请人： Kreisler Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
发明人： Kreisler Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
IPC分类号： C08G6378
CPC分类号： C08G61/12 , C08G61/02 , C08G2650/60
摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
摘要翻译：在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。考虑的笼状化合物和核心结构包括金刚烷，二金刚烷，硅，苯基和亚噻吩基，而优选的臂包括亚芳基，支链亚芳基和亚芳基醚。热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式