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    • 5. 发明授权
    • Compositions and methods for thermosetting molecules in organic compositions
    • 有机组合物中热固性分子的组成和方法
    • US06803441B2
    • 2004-10-12
    • US10267380
    • 2002-10-08
    • Kreisler LauFeng Quan LiuBoris KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • Kreisler LauFeng Quan LiuBoris KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • C08G6378
    • C08G61/12C08G61/02C08G2650/60
    • In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
    • 在制造低介电常数聚合物的方法中,提供了一种热固性单体,其中该热固性单体具有笼形化合物或芳基核心结构,以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中,将热固性单体引入聚合物中以形成低介电常数聚合物,其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷,二金刚烷,硅,苯基和亚噻吩基,而优选的臂包括亚芳基,支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料,并且聚合物的介电常数可以通过改变臂的整个长度来控制。
    • 8. 发明授权
    • Compositions and methods for thermosetting molecules in organic compositions
    • 有机组合物中热固性分子的组成和方法
    • US07049386B2
    • 2006-05-23
    • US10176335
    • 2002-06-19
    • Kreisler S. LauFeng Quan LiuBoris A. KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • Kreisler S. LauFeng Quan LiuBoris A. KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • C08G63/78
    • C08G61/02C08G61/12C08G65/40C08G2650/60
    • In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
    • 在制造低介电常数聚合物的方法中,提供了一种热固性单体,其中该热固性单体具有笼形化合物或芳基核心结构,以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中,将热固性单体引入聚合物中以形成低介电常数聚合物,其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 沉积的笼状化合物和核心结构包括金刚烷,金刚烷,硅,苯基和亚噻吩基,而优选的臂包括芳烯,支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料,并且聚合物的介电常数可以通过改变臂的整个长度来控制。