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    • 1. 发明申请
    • Manufacturing method of high resistivity silicon single crystal
    • 高电阻率硅单晶的制造方法
    • US20050000410A1
    • 2005-01-06
    • US10828555
    • 2004-04-21
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKouji SueokaShinsuke Sadamitsu
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKouji SueokaShinsuke Sadamitsu
    • C30B15/00C30B29/06C30B23/00C30B25/00C30B28/12C30B28/14
    • C30B29/06C30B15/00
    • To suppress a fluctuation in resistivity around a target value to thereby stably manufacture high resistivity silicon single crystals having almost the same resistivity values in a manufacturing method wherein a silicon raw material is molten to manufacture a high resistivity silicon single crystal in the range of from 100 to 2000 Ω cm with a CZ method. In a case where poly-silicon produced with a Siemens method using trichlorosilane as raw material is used as the silicon raw material, an impurity concentration in the silicon raw material is selected so as to be controlled in the range of from −5 to 50 ppta method in terms of (a donor concentration—an acceptor concentration) and the selected poly-silicon is used. In a case of a MCZ method, the poly-silicon is selected in the range of from −25 to 20 ppta and the selected poly-silicon is used. Instead of the raw material, poly-silicon produced with a Siemens method using monosilane as raw material is used. Alternatively, a silicon crystal manufactured with a CZ method or a MCZ method using poly-silicon raw material is used.
    • 为了抑制围绕目标值的电阻率的波动,从而在将硅原料熔融以制造范围为100的高电阻率硅单晶的制造方法中稳定地制造具有几乎相同的电阻率值的高电阻率硅单晶 到2000欧米加厘米与CZ方法。 在使用以三氯硅烷为原料的西门子方法制造的多晶硅作为硅原料的情况下,选择硅原料中的杂质浓度以控制在-5〜50ppta的范围内 使用(供体浓度 - 受体浓度)和选择的多晶硅的方法。 在MCZ方法的情况下,多晶硅的选择范围为-25〜20ppta,使用所选择的多晶硅。 使用以硅烷为原料的西门子法生产的多晶硅代替原料。 或者,使用以CZ法制造的硅晶体或使用多晶硅原料的MCZ法。
    • 2. 发明授权
    • High resistance silicon wafer and its manufacturing method
    • 高电阻硅晶片及其制造方法
    • US07397110B2
    • 2008-07-08
    • US10512405
    • 2003-04-16
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKoji SueokaShinsuke Sadamitsu
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKoji SueokaShinsuke Sadamitsu
    • H01L29/36H01L21/322
    • H01L21/3225
    • A high-resistance silicon wafer is manufactured in which a gettering ability, mechanical strength, and economical efficiency are excellent and an oxygen thermal donor is effectively prevented from being generated in a heat treatment for forming a circuit, which is implemented on the side of a device maker. A heat treatment for forming an oxygen precipitate nucleus is performed at 500 to 900° C. for 5 hours or more in a non-oxidizing atmosphere and a heat treatment for growing an oxygen precipitate is performed at 950 to 1050° C. for 10 hours or more on a high-oxygen and carbon-doped high-resistance silicon wafer in which resistivity is 100 Ωcm or more, an oxygen concentration is 14×1017 atoms/cm3 (ASTM F-121, 1979) or more and a carbon concentration is 0.5×1016 atoms/cm3 or more. By these heat treatments, a remaining oxygen concentration in the wafer is controlled to be 12×1017 atoms/cm3 (ASTM F-121, 1979) or less. Thus, there is provided a high-resistance, low-oxygen and high-strength silicon wafer in which resistivity is 100 Ωcm or more and an oxygen precipitate (BMD) having a size of 0.2 μm is formed so as to have high density of 1×104/cm2 or more.
    • 制造高电阻硅晶片,其中吸收能力,机械强度和经济效率优异,并且在用于形成电路的热处理中有效地防止了氧热供体的产生,该电路在 设备制造商。 在非氧化性气氛中,在500〜900℃下进行形成氧沉淀核的热处理5小时以上,在950〜1050℃下进行氧沉淀的热处理10小时 以上,电阻率为100Ωm以上的高氧和碳掺杂高电阻硅晶片,氧浓度为14×10 17原子/ cm 3(以下) ASTM F-121,1979)或更高,碳浓度为0.5×10 16原子/ cm 3以上。 通过这些热处理,将晶片中的剩余氧浓度控制为12×10 17原子/ cm 3(ASTM F-121,1979)或更小。 因此,提供了电阻率为100Ωm或更大的高电阻,低氧和高强度硅晶片,并且形成具有0.2μm大小的氧沉淀物(BMD),以便具有高密度的1×10 4/4以上。
    • 3. 发明授权
    • Manufacturing method of high resistivity silicon single crystal
    • 高电阻率硅单晶的制造方法
    • US07220308B2
    • 2007-05-22
    • US10828555
    • 2004-04-21
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKoujl SueokaShinsuke Sadamitsu
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKoujl SueokaShinsuke Sadamitsu
    • C30B15/20
    • C30B29/06C30B15/00
    • To suppress a fluctuation in resistivity around a target value to thereby stably manufacture high resistivity silicon single crystals having almost the same resistivity values in a manufacturing method wherein a silicon raw material is molten to manufacture a high resistivity silicon single crystal in the range of from 100 to 2000 Ω cm with a CZ method. In a case where poly-silicon produced with a Siemens method using trichlorosilane as raw material is used as the silicon raw material, an impurity concentration in the silicon raw material is selected so as to be controlled in the range of from −5 to 50 ppta method in terms of (a donor concentration—an acceptor concentration) and the selected poly-silicon is used. In a case of a MCZ method, the poly-silicon is selected in the range of from −25 to 20 ppta and the selected poly-silicon is used. Instead of the raw material, poly-silicon produced with a Siemens method using monosilane as raw material is used. Alternatively, a silicon crystal manufactured with a CZ method or a MCZ method using poly-silicon raw material is used.
    • 为了抑制围绕目标值的电阻率的波动,从而在将硅原料熔融以制造范围为100的高电阻率硅单晶的制造方法中稳定地制造具有几乎相同的电阻率值的高电阻率硅单晶 到2000欧米加厘米与CZ方法。 在使用以三氯硅烷为原料的西门子方法制造的多晶硅作为硅原料的情况下,选择硅原料中的杂质浓度以控制在-5〜50ppta的范围内 使用(供体浓度 - 受体浓度)和选择的多晶硅的方法。 在MCZ方法的情况下,多晶硅的选择范围为-25〜20ppta,使用所选择的多晶硅。 使用以硅烷为原料的西门子法生产的多晶硅代替原料。 或者,使用以CZ法制造的硅晶体或使用多晶硅原料的MCZ法。
    • 4. 发明申请
    • High resistance silicon wafer and method for production thereof
    • 高电阻硅晶片及其制造方法
    • US20050253221A1
    • 2005-11-17
    • US10512405
    • 2003-04-16
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKoji SueokaShinsuke Sadamitsu
    • Nobumitsu TakaseHideshi NishikawaMakoto ItoKoji SueokaShinsuke Sadamitsu
    • H01L21/26H01L21/322H01L29/167H01L21/22
    • H01L21/3225
    • A high-resistance silicon wafer is manufactured in which a gettering ability, mechanical strength, and economical efficiency are excellent and an oxygen thermal donor is effectively prevented from being generated in a heat treatment for forming a circuit, which is implemented on the side of a device maker. A heat treatment for forming an oxygen precipitate nucleus is performed at 500 to 900° C. for 5 hours or more in a non-oxidizing atmosphere and a heat treatment for growing an oxygen precipitate is performed at 950 to 1050° C. for 10 hours or more on a high-oxygen and carbon-doped high-resistance silicon wafer in which resistivity is 100 Ωcm or more, an oxygen concentration is 14×1017 atoms/cm3 (ASTM F-121, 1979) or more and a carbon concentration is 0.5×1016 atoms/cm3 or more. By these heat treatments, a remaining oxygen concentration in the wafer is controlled to be 12×1017 atoms/cm3 (ASTM F-121, 1979) or less. Thus, there is provided a high-resistance, low-oxygen and high-strength silicon wafer in which resistivity is 100 Ωcm or more and an oxygen precipitate (BMD) having a size of 0.2 μm is formed so as to have high density of 1×104/cm2 or more.
    • 制造高电阻硅晶片,其中吸收能力,机械强度和经济效率优异,并且在用于形成电路的热处理中有效地防止了氧热供体的产生,该电路在 设备制造商。 在非氧化性气氛中,在500〜900℃下进行形成氧沉淀核的热处理5小时以上,在950〜1050℃下进行氧沉淀的热处理10小时 以上,电阻率为100Ωm以上的高氧和碳掺杂高电阻硅晶片,氧浓度为14×10 17原子/ cm 3(以下) ASTM F-121,1979)或更高,碳浓度为0.5×10 16原子/ cm 3以上。 通过这些热处理,将晶片中的剩余氧浓度控制为12×10 17原子/ cm 3(ASTM F-121,1979)或更小。 因此,提供了电阻率为100Ωm或更大的高电阻,低氧和高强度硅晶片,并且形成具有0.2μm大小的氧沉淀物(BMD),以便具有高密度的1×10 4/4以上。
    • 5. 发明授权
    • Outboard motor control system
    • 舷外马达控制系统
    • US09139276B2
    • 2015-09-22
    • US14368810
    • 2012-05-09
    • Makoto Ito
    • Makoto Ito
    • B63H21/22B63H20/12B63H5/08B63H21/21B63H25/02B63H20/00B63H25/42
    • B63H20/12B63H5/08B63H21/21B63H21/265B63H25/02B63H25/42B63H2020/003
    • A plurality of outboard motors are mounted to a stern of a watercraft and configured to be steered independently. A target steering angle setting section is configured to set a target steering angle for each of the outboard motors. Actuators are configured to steer the outboard motors such that the steering angle of each of the outboard motors is equal or substantially equal to a target steering angle. An actual steering angle detecting section is configured to detect an actual steering angle of each of the outboard motors. A control section is programmed and configured to control the steering operation of the outboard motors such that, when a steering angle difference defining a difference between the actual steering angles of adjacently arranged outboard motors becomes equal to or larger than a prescribed value, an increase of the steering angle difference is prevented.
    • 多个舷外马达安装在船舶船尾,并被配置成独立转向。 目标转向角设定部被配置为对每个舷外马达设定目标转向角。 致动器构造成转向舷外马达,使得每个舷外马达的转向角等于或基本上等于目标转向角。 实际的转向角检测部被配置为检测每个舷外马达的实际转向角。 控制部被编程和配置为控制舷外马达的转向操作,使得当定义相邻排列的外侧马达的实际转向角之间的差异的转向角差异等于或大于规定值时,增加 防止转向角差。