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1. 发明授权

US06472744B2 Semiconductor module including a plurality of semiconductor devices detachably 失效
标题翻译：半导体模块可拆卸地包括多个半导体器件
公开(公告)号：US06472744B2
公开(公告)日：2002-10-29
申请号：US09084097
申请日：1998-05-26
申请人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
发明人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
IPC分类号： H01L2500
CPC分类号： H01L25/105 , H01L2224/48227 , H01L2225/1023 , H01L2924/09701 , H01L2924/1533 , H01L2924/3025 , H01R12/82 , H05K7/1431 , H01L2924/00
摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
摘要翻译：半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可分离地保持半导体器件的插座。

2. 发明授权

US06696754B2 Semiconductor module including a plurality of semiconductor devices detachably 失效
标题翻译：半导体模块可拆卸地包括多个半导体器件
公开(公告)号：US06696754B2
公开(公告)日：2004-02-24
申请号：US10214306
申请日：2002-08-08
申请人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
发明人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
IPC分类号： H01L2334
CPC分类号： H01L25/105 , H01L2224/48227 , H01L2225/1023 , H01L2924/09701 , H01L2924/1533 , H01L2924/3025 , H01R12/82 , H05K7/1431 , H01L2924/00
摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
摘要翻译：半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可拆卸地保持半导体器件的插座。

3. 发明授权

US06881611B1 Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device 有权
标题翻译：用于制造半导体器件的方法和模具，半导体器件和用于安装器件的方法
公开(公告)号：US06881611B1
公开(公告)日：2005-04-19
申请号：US09635124
申请日：2000-08-08
申请人： Norio Fukasawa , Toshimi Kawahara , Muneharu Morioka , Mitsunada Osawa , Yasuhiro Shinma , Hirohisa Matsuki , Masanori Onodera , Junichi Kasai , Shigeyuki Maruyama , Masao Sakuma , Yoshimi Suzuki , Masashi Takenaka
发明人： Norio Fukasawa , Toshimi Kawahara , Muneharu Morioka , Mitsunada Osawa , Yasuhiro Shinma , Hirohisa Matsuki , Masanori Onodera , Junichi Kasai , Shigeyuki Maruyama , Masao Sakuma , Yoshimi Suzuki , Masashi Takenaka
IPC分类号： B29C43/18 , H01L21/301 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L29/06 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , B29C43/18 , B29C2043/3444 , B29C2043/3628 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/566 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49572 , H01L23/4985 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L29/0657 , H01L2221/68377 , H01L2224/02371 , H01L2224/04105 , H01L2224/13022 , H01L2224/13024 , H01L2224/16225 , H01L2224/16235 , H01L2224/274 , H01L2224/29111 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83191 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L2225/1005 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0134 , H01L2924/15174 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3011 , H01L2924/3511 , H01L2924/00 , H01L2924/01028 , H01L2924/01051 , H01L2924/3512 , H01L2224/05599 , H01L2924/00012
摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.
摘要翻译：一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序与树脂层13一起切割基板16，使得半导体元件11彼此分离。

4. 发明授权

US5804467A Semiconductor device and method of producing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5804467A
公开(公告)日：1998-09-08
申请号：US855647
申请日：1997-05-13
申请人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
发明人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/498 , H01L21/44 , H01L21/50
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/49 , H01L2224/11003 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/3011 , Y10T29/49146 , Y10T29/49171
摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
摘要翻译：半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

5. 发明授权

US06379997B1 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same 失效
标题翻译：半导体器件及其制造方法以及半导体器件单元及其制造方法
公开(公告)号：US06379997B1
公开(公告)日：2002-04-30
申请号：US09593658
申请日：2000-06-13
申请人： Toshimi Kawahara , Sinya Nakaseko , Mitsunada Osawa , Mayumi Osumi , Hiroyuki Ishiquro , Yoshitugu Katoh , Junichi Kasai , Shinichirou Taniguchi , Yuji Sakurai
发明人： Toshimi Kawahara , Sinya Nakaseko , Mitsunada Osawa , Mayumi Osumi , Hiroyuki Ishiquro , Yoshitugu Katoh , Junichi Kasai , Shinichirou Taniguchi , Yuji Sakurai
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/11003 , H01L2224/16225 , H01L2224/16227 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10162 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , Y10T29/49144 , Y10T29/53483 , H01L2224/45099 , H01L2924/00 , H01L2924/01026 , H01L2924/01046 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.
摘要翻译：半导体器件包括半导体元件，保持半导体元件的保持基板，设置在保持基板上以围绕半导体元件并具有与保持基板和框体之间形成的空间连通的孔的框体，以及框架体和保持基板形成壳体，多个引线具有连接到半导体元件的内部引线部分和在框架主体外部延伸的外部引线部分，以及填充该空间并将半导体元件和内部引线部分封装的树脂。所有外部引线部分从壳体的一侧延伸到壳体外部。

6. 发明授权

US6034428A Semiconductor integrated circuit device having stacked wiring and insulating layers 失效
标题翻译：具有堆叠布线和绝缘层的半导体集成电路器件
公开(公告)号：US6034428A
公开(公告)日：2000-03-07
申请号：US745203
申请日：1996-11-08
申请人： Toshimi Kawahara , Hiroyuki Ishiguro , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Shinya Nakaseko , Yoshitugu Katoh , Junichi Kasai
发明人： Toshimi Kawahara , Hiroyuki Ishiguro , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Shinya Nakaseko , Yoshitugu Katoh , Junichi Kasai
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498 , H05K3/40 , H01L23/053
CPC分类号： H01L23/3121 , H01L23/49816 , H01L23/49822 , H01L24/49 , H05K3/4084 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H05K2201/0394 , H05K2203/0195 , H05K2203/063
摘要： A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.
摘要翻译：半导体器件包括半导体芯片和连接到半导体芯片的多层构件。多层构件包括交替堆叠的一个或多个布线层和一个或多个绝缘层。一个或多个绝缘层具有孔。多层构件具有电极部件，其包括通过所述孔使上述一个或多个布线层变形而获得的上述一个或多个布线层的变形部分。

7. 发明授权

US6111306A Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same 失效
公开(公告)号：US6111306A
公开(公告)日：2000-08-29
申请号：US944511
申请日：1997-10-06
申请人： Toshimi Kawahara , Sinya Nakaseko , Mitsunada Osawa , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai , Shinichirou Taniguchi , Yuji Sakurai
发明人： Toshimi Kawahara , Sinya Nakaseko , Mitsunada Osawa , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai , Shinichirou Taniguchi , Yuji Sakurai
IPC分类号： H01L21/48 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/498 , H01L23/02 , H01L23/15
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/11003 , H01L2224/16225 , H01L2224/16227 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , Y10T29/49144 , Y10T29/53483
摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

8. 发明授权

US5679978A Semiconductor device having resin gate hole through substrate for resin encapsulation 失效
标题翻译：具有用于树脂封装的树脂门孔通孔衬底的半导体器件
公开(公告)号：US5679978A
公开(公告)日：1997-10-21
申请号：US330848
申请日：1994-10-24
申请人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
发明人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/498 , H01L23/10
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/49 , H01L2224/11003 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/3011 , Y10T29/49146 , Y10T29/49171
摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
摘要翻译：半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

9. 发明授权

US5844309A Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition 失效
标题翻译：粘合剂组合物，使用该组合物的半导体器件和使用该组合物制造半导体器件的方法
公开(公告)号：US5844309A
公开(公告)日：1998-12-01
申请号：US754061
申请日：1996-12-03
申请人： Yukio Takigawa , Shigeaki Yagi , Toshimi Kawahara , Mitsunada Osawa , Hiroyuki Ishiguro , Shinya Nakaseko , Takashi Hozumi , Masaaki Seki
发明人： Yukio Takigawa , Shigeaki Yagi , Toshimi Kawahara , Mitsunada Osawa , Hiroyuki Ishiguro , Shinya Nakaseko , Takashi Hozumi , Masaaki Seki
IPC分类号： H01L21/58 , H01L23/10 , H01L23/053
CPC分类号： H01L24/83 , H01L23/10 , H01L24/29 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/16195 , H01L2924/181 , H01L2924/351
摘要： An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.
摘要翻译：一种粘合剂组合物，其包括：主要成分，其包含树脂材料，用于溶解所述主要成分的溶剂和添加到所述主要成分中的填料，其中所述填料具有使得其表面的凹凸深度所述粘合剂组合物在所述粘合剂组合物施加到被粘物上之后等于或小于15μm，并干燥以在热压缩过程之前蒸发所述溶剂。本发明还公开了一种使用粘合剂组合物的半导体器件，使用粘合剂组合物的粘合方法和使用该粘合剂组合物的半导体器件的制造方法。

10. 发明授权

US5226582A Method for wire-bonding an integrated circuit 失效
标题翻译：集成电路引线接合方法
公开(公告)号：US5226582A
公开(公告)日：1993-07-13
申请号：US880027
申请日：1992-05-08
申请人： Akihiro Kubota , Mitsunada Osawa
发明人： Akihiro Kubota , Mitsunada Osawa
IPC分类号： B23K20/00 , H01L21/60
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/4851 , H01L2224/48511 , H01L2224/48599 , H01L2224/78301 , H01L2224/85045 , H01L2224/851 , H01L2224/85181 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754
摘要： A wire-bonding method of an IC uses a capillary having a hole for guiding a bonding wire, the capillary moving vertically and horizontally with respect to the IC so as to bridge a loop between a first bonding and a subsequent second bonding of the wire on predetermined places. The method comprises the steps of heating a wire end extruding from a first opening of the hole to form a ball of the wire; performing the first bonding by a nail head bonding method; pulling the wire coming from the second opening. The tension imposed on the wire hardens a portion of the wire having been softened during the heating process, but is adequately low not break the wire; and moving the capillary so as to perform the second bonding. In a wire-bonding apparatus including a spool and a capillary having a hole to guide the wire therethrough, where the capillary does a first bonding by a nail head bonding method and is movable vertically and horizontally so as to bridge a loop between the first bonding and a subsequent second bonding, there is provided a tension bar, located behind the capillary and rectangular to the wire, to hook the wire at a portion between the capillary and the spool located apart from the center line of the hole. The tension bar is movable from the capillary so as to pull the wire via the hole from the first bonding thus completed. Thus imposed tension hardens the portion of the wire soften by the heat process.
摘要翻译： IC的引线接合方法使用具有用于引导接合线的孔的毛细管，毛细管相对于IC垂直和水平移动，以便在第一接合和随后的线的第二接合之间桥接环预定地点。该方法包括以下步骤：加热从孔的第一开口挤出的线端部以形成线的球; 通过钉头粘合法进行第一粘合; 拉出来自第二个开口的线。施加在线上的张力在加热过程中硬化已经软化的线的一部分，但是足够低不能断开线; 并移动毛细管以便执行第二接合。在包括线轴和毛细管的引线接合装置中，所述毛细管具有用于引导线穿过其中的毛细管，其中毛细管通过钉头接合方法进行第一接合并且可以垂直和水平移动，以便在第一接合并且随后的第二接合，设置有位于毛细管后面并且与电线成矩形的拉杆，以将线缆钩在毛细管和位于远离孔的中心线的线轴之间的部分处。张力杆可以从毛细管移动，以便从这样完成的第一粘合通过孔拉出电线。因此施加的张力会使通过加热过程软化的电线部分变硬。

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