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1. 发明授权

US5804467A Semiconductor device and method of producing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5804467A
公开(公告)日：1998-09-08
申请号：US855647
申请日：1997-05-13
申请人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
发明人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/498 , H01L21/44 , H01L21/50
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/49 , H01L2224/11003 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/3011 , Y10T29/49146 , Y10T29/49171
摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
摘要翻译：半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

2. 发明授权

US6034428A Semiconductor integrated circuit device having stacked wiring and insulating layers 失效
标题翻译：具有堆叠布线和绝缘层的半导体集成电路器件
公开(公告)号：US6034428A
公开(公告)日：2000-03-07
申请号：US745203
申请日：1996-11-08
申请人： Toshimi Kawahara , Hiroyuki Ishiguro , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Shinya Nakaseko , Yoshitugu Katoh , Junichi Kasai
发明人： Toshimi Kawahara , Hiroyuki Ishiguro , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Shinya Nakaseko , Yoshitugu Katoh , Junichi Kasai
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498 , H05K3/40 , H01L23/053
CPC分类号： H01L23/3121 , H01L23/49816 , H01L23/49822 , H01L24/49 , H05K3/4084 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H05K2201/0394 , H05K2203/0195 , H05K2203/063
摘要： A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.
摘要翻译：半导体器件包括半导体芯片和连接到半导体芯片的多层构件。多层构件包括交替堆叠的一个或多个布线层和一个或多个绝缘层。一个或多个绝缘层具有孔。多层构件具有电极部件，其包括通过所述孔使上述一个或多个布线层变形而获得的上述一个或多个布线层的变形部分。

3. 发明授权

US5679978A Semiconductor device having resin gate hole through substrate for resin encapsulation 失效
标题翻译：具有用于树脂封装的树脂门孔通孔衬底的半导体器件
公开(公告)号：US5679978A
公开(公告)日：1997-10-21
申请号：US330848
申请日：1994-10-24
申请人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
发明人： Toshimi Kawahara , Shinya Nakaseko , Mitsunada Osawa , Shinichirou Taniguchi , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/498 , H01L23/10
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/49 , H01L2224/11003 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/3011 , Y10T29/49146 , Y10T29/49171
摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
摘要翻译：半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

4. 发明授权

US6111306A Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same 失效
公开(公告)号：US6111306A
公开(公告)日：2000-08-29
申请号：US944511
申请日：1997-10-06
申请人： Toshimi Kawahara , Sinya Nakaseko , Mitsunada Osawa , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai , Shinichirou Taniguchi , Yuji Sakurai
发明人： Toshimi Kawahara , Sinya Nakaseko , Mitsunada Osawa , Mayumi Osumi , Hiroyuki Ishiguro , Yoshitugu Katoh , Junichi Kasai , Shinichirou Taniguchi , Yuji Sakurai
IPC分类号： H01L21/48 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/498 , H01L23/02 , H01L23/15
CPC分类号： H01L21/568 , H01L21/4853 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/11003 , H01L2224/16225 , H01L2224/16227 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , Y10T29/49144 , Y10T29/53483
摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

5. 发明授权

US5844309A Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition 失效
标题翻译：粘合剂组合物，使用该组合物的半导体器件和使用该组合物制造半导体器件的方法
公开(公告)号：US5844309A
公开(公告)日：1998-12-01
申请号：US754061
申请日：1996-12-03
申请人： Yukio Takigawa , Shigeaki Yagi , Toshimi Kawahara , Mitsunada Osawa , Hiroyuki Ishiguro , Shinya Nakaseko , Takashi Hozumi , Masaaki Seki
发明人： Yukio Takigawa , Shigeaki Yagi , Toshimi Kawahara , Mitsunada Osawa , Hiroyuki Ishiguro , Shinya Nakaseko , Takashi Hozumi , Masaaki Seki
IPC分类号： H01L21/58 , H01L23/10 , H01L23/053
CPC分类号： H01L24/83 , H01L23/10 , H01L24/29 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/16195 , H01L2924/181 , H01L2924/351
摘要： An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.
摘要翻译：一种粘合剂组合物，其包括：主要成分，其包含树脂材料，用于溶解所述主要成分的溶剂和添加到所述主要成分中的填料，其中所述填料具有使得其表面的凹凸深度所述粘合剂组合物在所述粘合剂组合物施加到被粘物上之后等于或小于15μm，并干燥以在热压缩过程之前蒸发所述溶剂。本发明还公开了一种使用粘合剂组合物的半导体器件，使用粘合剂组合物的粘合方法和使用该粘合剂组合物的半导体器件的制造方法。

6. 发明授权

US09574062B2 Chloroprene rubber composition and vulcanized rubber thereof, and rubber molded product, vibration-damping rubber member, engine mount, and hose using vulcanized rubber 有权
标题翻译：氯丁橡胶组合物及其硫化橡胶，橡胶成型体，减震橡胶部件，发动机支架和使用硫化橡胶的软管
公开(公告)号：US09574062B2
公开(公告)日：2017-02-21
申请号：US14003590
申请日：2012-02-22
申请人： Yasushi Abe , Hiroyuki Ishiguro
发明人： Yasushi Abe , Hiroyuki Ishiguro
IPC分类号： C08K3/04 , C08F36/18 , B32B1/00 , B32B1/08 , C08K5/3445 , C08K5/00 , C08K5/11 , C08K5/3447
CPC分类号： C08K3/04 , B32B1/00 , B32B1/08 , C08F36/18 , C08K5/0016 , C08K5/11 , C08K5/3445 , C08K5/3447 , Y10T428/1372 , Y10T428/1386 , C08L11/00
摘要： The invention provides compositions of chloroprene rubbers having improved vibration-damping properties under low temperature conditions without deterioration of mechanical properties, permanent compression set and tension fatigue in the final product. The chloroprene rubbers of the invention contain a xanthogen-modified chloroprene rubber and/or a mercaptan-modified chloroprene rubber in an amount of 100 parts by mass, a carbon black having an average particle diameter of 70 mn to 600 mn and a DBP oil absorption (as determined by Absorption A method of JIS-K6221) of 15 ml/100 g in an amount of 15 to 150 parts by mass, and a plasticizer represented by the chemical formula R1COO—(CH2)8—COOR2 wherein R1 and R2 each represent an alkyl group having 1 to 7 carbons.
摘要翻译：本发明提供氯丁橡胶组合物，其在低温条件下具有改善的减震性能，而不会降低最终产品的机械性能，永久压缩永久变形和张力疲劳。本发明的氯丁二烯橡胶含有量为100质量份的黄原酸改性氯丁橡胶和/或硫醇改性氯丁橡胶，平均粒径为70〜600nm的碳黑和DBP吸油量（通过JIS-K6221的吸收A法测定）为15〜150质量份的15ml / 100g，以及由化学式R1COO-（CH2）8-COOR2表示的增塑剂，其中R1和R2各自表示碳原子数为1〜7的烷基。

7. 发明授权

US5849165A Oxygen sensor for preventing silicon poisoning 失效
标题翻译：用于防止硅中毒的氧传感器
公开(公告)号：US5849165A
公开(公告)日：1998-12-15
申请号：US408132
申请日：1995-03-21
申请人： Takao Kojima , Hiroyuki Ishiguro , Masaru Yamano , Toshiki Sawada , Kazuo Taguchi , Masahiko Yamada , Noriaki Kondo
发明人： Takao Kojima , Hiroyuki Ishiguro , Masaru Yamano , Toshiki Sawada , Kazuo Taguchi , Masahiko Yamada , Noriaki Kondo
IPC分类号： G01N27/407 , G01N27/416 , G01N27/12 , G01N27/409 , G01N27/41
CPC分类号： G01N27/4075 , G01N27/4077
摘要： Oxygen sensor element (ZrO.sub.2 solid electrolyte etc) for detecting oxygen concentration in an exhaust gas has a protective layer which is made of a heat-resistant metal oxide and which carries a component of a IIa subgroup element (Ca, Mg etc) on the side exposed to the exhaust gas of the sensor element, at least a part of the protective layer being present as a nonstoichiometric compound (Ti oxide etc) with respect to the heat-resistant metal oxide. Si-poisoning is prevented. Heater for heating the sensor element is provided for preventing Si-poisoning at low temperatures.
摘要翻译：用于检测排气中的氧浓度的氧传感器元件（ZrO 2固体电解质等）具有由耐热性金属氧化物构成的保护层，该保护层在侧面具有IIa族成分元素（Ca，Mg等）的成分暴露于传感器元件的废气中，保护层的至少一部分作为非化学计量的化合物（Ti氧化物等）相对于耐热金属氧化物存在。预防中毒。提供用于加热传感器元件的加热器用于在低温下防止Si中毒。

8. 发明授权

US4806739A Plate-like ceramic heater 失效
标题翻译：板状陶瓷加热器
公开(公告)号：US4806739A
公开(公告)日：1989-02-21
申请号：US136438
申请日：1987-12-17
申请人： Takao Kojima , Hiroyuki Ishiguro , Yoshiki Kawachi , Tetsusyo Yamada
发明人： Takao Kojima , Hiroyuki Ishiguro , Yoshiki Kawachi , Tetsusyo Yamada
IPC分类号： H05B3/20 , H05B3/28 , H05B3/26
CPC分类号： H05B3/283
摘要： A heater including an electron-conductive pattern designed to generate heat, which has a partially and/or entirely stabilized ZrO.sub.2 -base substrate, an Al.sub.2 O.sub.3 -base coating layer disposed on the surface of the substrate, and an electron-conductive pattern to generate heat disposed on the coating layer.
摘要翻译：一种包括设计成产生热量的电子传导图案的加热器，其具有部分和/或完全稳定的ZrO 2基底基板，设置在基板表面上的Al 2 O 3基涂层以及产生热量的电子传导图案设置在涂层上。

9. 发明授权

US06700603B1 Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material 有权
标题翻译：用于检查在柔性材料的连续基片上形成的分立布线图案的检查系统
公开(公告)号：US06700603B1
公开(公告)日：2004-03-02
申请号：US09486698
申请日：2000-03-03
申请人： Tetsuya Okuchi , Hiroyuki Ishiguro , Yoshio Mori , Takeshi Kitamura
发明人： Tetsuya Okuchi , Hiroyuki Ishiguro , Yoshio Mori , Takeshi Kitamura
IPC分类号： H04N718
CPC分类号： G01N21/86 , G01N21/956 , G01R31/01 , G01R31/309
摘要： An inspection system for inspecting discrete wiring patterns on a continuous substrate sheet of a flexible material by making the use of the substrate sheet as a feeding carrier. The system is capable of assuring accurate positioning of the wiring patterns (14) for reliable inspection even with the use of the flexible substrate sheet (10) as the sole feeding carrier. The inspection system includes an inspection zone (30) provided with camera (51, 54) for inspecting the individual wiring patterns (14) and detecting a position of said wiring pattern on the substrate sheet. A draw-in roller (31, 32) is provided to introduce the substrate into the inspection zone. Associated with the draw-in roller is a draw-out roller (32, 33) which draws out the substrate sheet from the inspection zone and is positioned to define the inspection zone between the draw-in roller and the draw-out roller as well as to give a tension to the substrate sheet for extending the substrate sheet straight through the inspection zone. A controller (60) is provided to control a position of the substrate sheet passing through the inspection zone based upon a position signal detected by the camera as indicative of the position of the individual wiring patterns on the substrate sheet within the inspection zone. Thus, the wiring pattern can be exactly positioned within the inspection zone relative to the camera for reliable inspection thereby.
摘要翻译：一种检查系统，用于通过使用基片作为馈送载体来检查柔性材料的连续基片上的分立布线图案。即使使用柔性基片（10）作为唯一的馈送载体，该系统也能够确保布线图案（14）的精确定位以进行可靠的检查。该检查系统包括一个检查区（30），该检查区设置有用于检查各个布线图案（14）的相机（51,54），并且检测该基片上的该布线图形的位置。提供了一个引入辊（31,32）以将衬底引入检查区。与引入辊相关联的是从检查区域抽出基板的抽出辊（32,33），并且定位成在牵引辊和拉出辊之间限定检查区域以使基板张力张紧，以将基板片材直线延伸穿过检查区域。提供控制器（60），用于基于由照相机检测到的位置信号来控制通过检查区域的基板的位置，指示检查区域内的基板上的各个布线图案的位置。因此，布线图案可以相对于相机精确地定位在检查区域内，从而可靠地检查。

10. 发明授权

US4733056A Heater backed with a ceramic substrate 失效
标题翻译：加热器配有陶瓷基板
公开(公告)号：US4733056A
公开(公告)日：1988-03-22
申请号：US896863
申请日：1986-08-15
申请人： Takao Kojima , Hiroyuki Ishiguro
发明人： Takao Kojima , Hiroyuki Ishiguro
IPC分类号： H05B3/12 , F01N3/027 , H01C7/00 , H05B3/16 , H05B3/28 , H01C1/012
CPC分类号： H05B3/283 , F01N3/027
摘要： A heater backed with a ceramic substrate having a ceramic substrate as a base plate and heating element formed thereon, which comprises a conductor for retaining ionized elements, said conductor branching from a terminal lead portion of the minus side connected to the heater element under an applied electric current and extending at the back side of the base plate, along the heating element pattern at least partly thereof. A protecting layer may be provided on the surface of said conductor. The conductor is connected with the lead portion through a conducting through hole.
摘要翻译：背衬有陶瓷基板的加热器，其具有陶瓷基板作为基板和形成在其上的加热元件，该陶瓷基板包括用于保持电离元件的导体，所述导体从负侧的端子引线部分分支，连接到加热元件，电流，并且在基板的背面沿其加热元件图案至少部分延伸。可以在所述导体的表面上设置保护层。导体通过导电孔与引线部分连接。

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