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    • 7. 发明申请
    • Silicide Micromechanical Device and Methods to Fabricate Same
    • 硅化物微机械装置及其制造方法
    • US20120318649A1
    • 2012-12-20
    • US13164126
    • 2011-06-20
    • Michael A. GuillornEric A. JosephFei LiuZhen Zhang
    • Michael A. GuillornEric A. JosephFei LiuZhen Zhang
    • H01H57/00H01L21/285
    • B81C1/00666B81C1/00952H01H1/0094H01H2001/0078
    • A method is disclosed to fabricate an electro-mechanical device such as a MEMS or NEMS switch. The method includes providing a silicon layer disposed over an insulating layer that is disposed on a silicon substrate; releasing a portion of the silicon layer from the insulating layer so that it is at least partially suspended over a cavity in the insulating layer; depositing a metal (e.g., Pt) on at least one surface of at least the released portion of the silicon layer and, using a thermal process, fully siliciding at least the released portion of the silicon layer using the deposited metal. The method eliminates silicide-induced stress to the released Si member, as the entire Si member is silicided. Furthermore no conventional wet chemical etch is used after forming the fully silicided material thereby reducing a possibility of causing corrosion of the silicide and an increase in stiction.
    • 公开了一种制造诸如MEMS或NEMS开关的机电装置的方法。 该方法包括提供设置在设置在硅衬底上的绝缘层上的硅层; 从所述绝缘层释放所述硅层的一部分,使得其至少部分地悬挂在所述绝缘层中的空腔上; 在至少所述硅层的释放部分的至少一个表面上沉积金属(例如Pt),并且使用热处理,使用沉积的金属至少完全硅化硅层的释放部分。 当整个Si元件被硅化时,该方法消除了对释放的Si元件的硅化物引起的应力。 此外,在形成完全硅化材料之后,也不使用常规的湿化学蚀刻,从而减少引起硅化物腐蚀和粘性增加的可能性。