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    • 4. 发明申请
    • Substrate support system for reduced autodoping and backside deposition
    • 用于减少自动掺杂和背面沉积的基板支撑系统
    • US20050193952A1
    • 2005-09-08
    • US11057111
    • 2005-02-11
    • Matt GoodmanJereon StoutyesdijkRavinder AggarwalMike HalpinTony KeetonMark HawkinsLee HaenArmand FerroPaul BrabantRobert VyneGregory BartlettJoseph ItalianoBob Haro
    • Matt GoodmanJereon StoutyesdijkRavinder AggarwalMike HalpinTony KeetonMark HawkinsLee HaenArmand FerroPaul BrabantRobert VyneGregory BartlettJoseph ItalianoBob Haro
    • C23C16/00C23C16/458C30B25/12C30B25/14H01L21/00H01L21/687
    • H01L21/68735H01J37/32871H01L21/67028
    • A substrate support system comprises a relatively thin circular substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder includes a single substrate support ledge or a plurality of substrate support spacer vanes configured to support a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. The vanes can be angled to resist backside deposition of reactant gases as the substrate holder is rotated. A hollow support member provides support to an underside of the substrate holder. The hollow support member is configured to convey gas (e.g., inert gas or cleaning gas) upward into one or more of the passages of the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment of the invention, the gas in the gap can then flow either (1) outward and upward around the substrate edge or (2) downward through passages of the substrate holder, if any, that do not lead back into the hollow support member. The gas that flows outward and upward around the substrate edge inhibits backside deposition of reactant gases above the substrate. The gas that flows downward through the passages that do not lead back to the support member advantageously inhibits autodoping by sweeping out-diffused dopant atoms away from the substrate front side. In one embodiment, the support member comprises a hollow multi-armed support spider that conveys gas into selected ones of the passages. In another embodiment, the support member comprises a bowl- or cup-shaped structure that conveys gas upward into all of the passages. In yet another embodiment, the support member comprises a bowl- or cup-shaped structure that conveys gas upward into all but one or more of the passages.
    • 衬底支撑系统包括相对薄的圆形衬底保持器,其具有在其顶表面和底表面之间延伸的多个通道。 衬底保持器包括单个衬底支撑凸缘或多个衬底支撑间隔器叶片,其构造成支撑衬底背面的周边部分,使得在衬底和衬底保持器之间形成薄的间隙。 当基板保持器旋转时,叶片可以成角度以抵抗反应气体的背面沉积。 中空的支撑构件为衬底保持器的下侧提供支撑。 中空支撑构件被构造成将气体(例如,惰性气体或清洁气体)向上输送到衬底保持器的一个或多个通道中。 向上输送的气体流入基板和基板支架之间的间隙。 根据本发明的实施例,间隙中的气体然后可以(1)围绕衬底边缘向外和向上流动,或者(2)向下通过衬底保持器的通道(如果有的话),其不会引导回到空心 支持会员 在衬底边缘周围向外和向上流动的气体阻止在衬底上方的反应物气体的背面沉积。 通过通道向下流动的气体不会返回到支撑构件,有利地通过从扩散的掺杂​​剂原子远离衬底正面来扫除自发掺杂。 在一个实施例中,支撑构件包括将气体输送到选定的通道中的中空多臂支撑蜘蛛。 在另一个实施例中,支撑构件包括将气体向上输送到所有通道中的碗形或杯状结构。 在另一个实施例中,支撑构件包括碗形或杯状结构,其将气体向上输送到除了一个或多个通道中的所有通道中。
    • 6. 发明申请
    • Wafer holder with peripheral lift ring
    • 带外围电梯环的晶圆架
    • US20050011458A1
    • 2005-01-20
    • US10903083
    • 2004-07-30
    • Ravinder AggarwalTony KeetonMatthew Goodman
    • Ravinder AggarwalTony KeetonMatthew Goodman
    • C23C16/458C23C16/48H01L21/687H01L21/306
    • H01L21/68735C23C16/4584C23C16/4585C23C16/481H01L21/68742
    • A wafer holder for supporting a wafer within a CVD processing chamber includes a vertically moveable lift ring configured to support the bottom peripheral surface of the wafer, and an inner plug having a top flat surface configured to support the wafer during wafer processing. The lift ring has a central aperture configured to closely surround the inner plug. When a wafer is to be loaded onto the wafer holder, the lift ring is elevated above the inner plug. The wafer is loaded onto the lift ring in the elevated position. Then, the lift ring is maintained in the elevated position for a time period sufficient to allow the wafer temperature to rise to a level that is sufficient to significantly reduce or even substantially prevent thermal shock to the wafer when the wafer is brought into contact with the inner plug. The lift ring is then lowered into surrounding engagement with the inner plug. This is the wafer processing position of the wafer holder.
    • 用于在CVD处理室内支撑晶片的晶片保持器包括构造成支撑晶片的底部周边表面的可垂直移动的提升环,以及配置成在晶片处理期间支撑晶片的顶部平坦表面的内部插塞。 提升环具有构造成紧密围绕内塞的中心孔。 当将晶片装载到晶片保持器上时,升降环升高到内塞上方。 晶片在提升位置被装载到提升环上。 然后,提升环保持在升高位置一段足以允许晶片温度上升至足以显着降低甚至基本上防止晶片对晶片的热冲击的水平的时间,当晶片与 内塞 然后升降环下降到与内塞的周围接合。 这是晶片保持器的晶片加工位置。