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1. 发明授权

US08088225B2 Substrate support system for reduced autodoping and backside deposition 有权
标题翻译：用于减少自动掺杂和背面沉积的基板支撑系统
公开(公告)号：US08088225B2
公开(公告)日：2012-01-03
申请号：US12641712
申请日：2009-12-18
申请人： Matt G. Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory M. Bartlett , Joseph P. Italiano , Bob Haro
发明人： Matt G. Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory M. Bartlett , Joseph P. Italiano , Bob Haro
IPC分类号： C23C16/458 , C23C16/00 , H01L21/306
CPC分类号： H01L21/68735 , H01J37/32871 , H01L21/67028
摘要： A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).
摘要翻译：衬底支撑系统包括具有在其顶表面和底表面之间延伸的多个通道的衬底保持器。衬底保持器支撑衬底背面的周边部分，使得在衬底和衬底保持器之间形成薄的间隙。中空的支撑构件为衬底的下侧提供支撑，并且构造成将气体向上输送到衬底保持器的一个或多个通道中。向上输送的气体流入基板和基板支架之间的间隙。根据实施例，气体然后围绕衬底边缘向外和向上流动（以阻止反应物气体在衬底上方的背面沉积）或向下穿过衬底保持器的通道（如果有的话），其不会引回到中空支撑件（通过从扩散的掺杂剂原子远离衬底背面来抑制自掺杂）。

2. 发明授权

US07648579B2 Substrate support system for reduced autodoping and backside deposition 有权
标题翻译：用于减少自动掺杂和背面沉积的基板支撑系统
公开(公告)号：US07648579B2
公开(公告)日：2010-01-19
申请号：US11057111
申请日：2005-02-11
申请人： Matt G. Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory M. Bartlett , Joseph P. Italiano , Bob Haro
发明人： Matt G. Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory M. Bartlett , Joseph P. Italiano , Bob Haro
IPC分类号： C23C16/458 , C23C16/00 , H01L21/306
CPC分类号： H01L21/68735 , H01J37/32871 , H01L21/67028
摘要： A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).
摘要翻译：衬底支撑系统包括具有在其顶表面和底表面之间延伸的多个通道的衬底保持器。衬底保持器支撑衬底背面的周边部分，使得在衬底和衬底保持器之间形成薄的间隙。中空的支撑构件为衬底的下侧提供支撑，并且构造成将气体向上输送到衬底保持器的一个或多个通道中。向上输送的气体流入基板和基板支架之间的间隙。根据实施例，气体然后围绕衬底边缘向外和向上流动（以阻止反应物气体在衬底上方的背面沉积）或向下穿过衬底保持器的通道（如果有的话），其不会引回到中空支撑件（通过从扩散的掺杂剂原子远离衬底背面来抑制自掺杂）。

3. 发明申请

US20100089314A1 SUBSTRATE SUPPORT SYSTEM FOR REDUCED AUTODOPING AND BACKSIDE DEPOSITION 有权
标题翻译：用于减少自动化和背面沉积的基板支撑系统
公开(公告)号：US20100089314A1
公开(公告)日：2010-04-15
申请号：US12641712
申请日：2009-12-18
申请人： Matt G. Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory M. Bartlett , Joseph P. Italiano , Bob Haro
发明人： Matt G. Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory M. Bartlett , Joseph P. Italiano , Bob Haro
IPC分类号： B05C13/00
CPC分类号： H01L21/68735 , H01J37/32871 , H01L21/67028
摘要： A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).
摘要翻译：衬底支撑系统包括具有在其顶表面和底表面之间延伸的多个通道的衬底保持器。衬底保持器支撑衬底背面的周边部分，使得在衬底和衬底保持器之间形成薄的间隙。中空的支撑构件为衬底的下侧提供支撑，并且构造成将气体向上输送到衬底保持器的一个或多个通道中。向上输送的气体流入基板和基板支架之间的间隙。根据实施例，气体然后围绕衬底边缘向外和向上流动（以阻止反应物气体在衬底上方的背面沉积）或向下穿过衬底保持器的通道（如果有的话），其不会引回到中空支撑件（通过从扩散的掺杂剂原子远离衬底背面来抑制自掺杂）。

4. 发明申请

US20050193952A1 Substrate support system for reduced autodoping and backside deposition 有权
标题翻译：用于减少自动掺杂和背面沉积的基板支撑系统
公开(公告)号：US20050193952A1
公开(公告)日：2005-09-08
申请号：US11057111
申请日：2005-02-11
申请人： Matt Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory Bartlett , Joseph Italiano , Bob Haro
发明人： Matt Goodman , Jereon Stoutyesdijk , Ravinder Aggarwal , Mike Halpin , Tony Keeton , Mark Hawkins , Lee Haen , Armand Ferro , Paul Brabant , Robert Vyne , Gregory Bartlett , Joseph Italiano , Bob Haro
IPC分类号： C23C16/00 , C23C16/458 , C30B25/12 , C30B25/14 , H01L21/00 , H01L21/687
CPC分类号： H01L21/68735 , H01J37/32871 , H01L21/67028
摘要： A substrate support system comprises a relatively thin circular substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder includes a single substrate support ledge or a plurality of substrate support spacer vanes configured to support a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. The vanes can be angled to resist backside deposition of reactant gases as the substrate holder is rotated. A hollow support member provides support to an underside of the substrate holder. The hollow support member is configured to convey gas (e.g., inert gas or cleaning gas) upward into one or more of the passages of the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment of the invention, the gas in the gap can then flow either (1) outward and upward around the substrate edge or (2) downward through passages of the substrate holder, if any, that do not lead back into the hollow support member. The gas that flows outward and upward around the substrate edge inhibits backside deposition of reactant gases above the substrate. The gas that flows downward through the passages that do not lead back to the support member advantageously inhibits autodoping by sweeping out-diffused dopant atoms away from the substrate front side. In one embodiment, the support member comprises a hollow multi-armed support spider that conveys gas into selected ones of the passages. In another embodiment, the support member comprises a bowl- or cup-shaped structure that conveys gas upward into all of the passages. In yet another embodiment, the support member comprises a bowl- or cup-shaped structure that conveys gas upward into all but one or more of the passages.
摘要翻译：衬底支撑系统包括相对薄的圆形衬底保持器，其具有在其顶表面和底表面之间延伸的多个通道。衬底保持器包括单个衬底支撑凸缘或多个衬底支撑间隔器叶片，其构造成支撑衬底背面的周边部分，使得在衬底和衬底保持器之间形成薄的间隙。当基板保持器旋转时，叶片可以成角度以抵抗反应气体的背面沉积。中空的支撑构件为衬底保持器的下侧提供支撑。中空支撑构件被构造成将气体（例如，惰性气体或清洁气体）向上输送到衬底保持器的一个或多个通道中。向上输送的气体流入基板和基板支架之间的间隙。根据本发明的实施例，间隙中的气体然后可以（1）围绕衬底边缘向外和向上流动，或者（2）向下通过衬底保持器的通道（如果有的话），其不会引导回到空心支持会员在衬底边缘周围向外和向上流动的气体阻止在衬底上方的反应物气体的背面沉积。通过通道向下流动的气体不会返回到支撑构件，有利地通过从扩散的掺杂剂原子远离衬底正面来扫除自发掺杂。在一个实施例中，支撑构件包括将气体输送到选定的通道中的中空多臂支撑蜘蛛。在另一个实施例中，支撑构件包括将气体向上输送到所有通道中的碗形或杯状结构。在另一个实施例中，支撑构件包括碗形或杯状结构，其将气体向上输送到除了一个或多个通道中的所有通道中。

5. 发明授权

US06883250B1 Non-contact cool-down station for wafers 失效
标题翻译：用于晶圆的非接触式冷却站
公开(公告)号：US06883250B1
公开(公告)日：2005-04-26
申请号：US10701681
申请日：2003-11-04
申请人： Ravinder Aggarwal , Bob Haro
发明人： Ravinder Aggarwal , Bob Haro
IPC分类号： H01L21/00 , F26B7/00 , F25D25/00
CPC分类号： H01L21/67196 , H01L21/67109
摘要： A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.
摘要翻译：用于在晶片经过半导体处理之后冷却晶片的固定式冷却站通过根据伯努利原理流动气体来支撑晶片。冷却站的上壁包含多个气体出口，其引导气体流过晶片的顶表面。以这种方式，在晶片上形成低压区域，并且将晶片悬挂在冷却站内，而不直接接触用于支撑的任何表面。除了为晶片提供电梯之外，气体是导热气体，其可以通过将热量远离其来冷却晶片。

6. 外观设计

USD600223S1 Susceptor ring 有权
标题翻译：受难环
公开(公告)号：USD600223S1
公开(公告)日：2009-09-15
申请号：US29322630
申请日：2008-08-07
申请人： Ravinder Aggarwal , Bob Haro
设计人： Ravinder Aggarwal , Bob Haro

7. 发明申请

US20050091992A1 NON-CONTACT COOL-DOWN STATION FOR WAFERS 失效
标题翻译：非接触式冷却站
公开(公告)号：US20050091992A1
公开(公告)日：2005-05-05
申请号：US10701681
申请日：2003-11-04
申请人： Ravinder Aggarwal , Bob Haro
发明人： Ravinder Aggarwal , Bob Haro
IPC分类号： H01L21/00 , F25D25/00 , B05C13/00 , B05C13/02 , B05C21/00 , F26B7/00 , F27D15/02
CPC分类号： H01L21/67196 , H01L21/67109
摘要： A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.
摘要翻译：用于在晶片经过半导体处理之后冷却晶片的固定式冷却站通过根据伯努利原理流动气体来支撑晶片。冷却站的上壁包含多个气体出口，其引导气体流过晶片的顶表面。以这种方式，在晶片上形成低压区域，并且将晶片悬挂在冷却站内，而不直接接触用于支撑的任何表面。除了为晶片提供电梯之外，气体是导热气体，其可以通过将热量远离其来冷却晶片。

8. 发明申请

US20050145180A1 Non-contact cool-down station for wafers 失效
公开(公告)号：US20050145180A1
公开(公告)日：2005-07-07
申请号：US11059188
申请日：2005-02-15
申请人： Ravinder Aggarwal , Bob Haro
发明人： Ravinder Aggarwal , Bob Haro
IPC分类号： H01L21/00 , G03D5/00 , C23C16/00 , F27D1/00 , H01L21/31 , H01L21/469
CPC分类号： H01L21/67196 , H01L21/67109
摘要： A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.

9. 发明授权

US08394229B2 Susceptor ring 有权
标题翻译：受难环
公开(公告)号：US08394229B2
公开(公告)日：2013-03-12
申请号：US12187933
申请日：2008-08-07
申请人： Ravinder Aggarwal , Bob Haro
发明人： Ravinder Aggarwal , Bob Haro
IPC分类号： C23C16/00 , C23C16/50 , C23F1/00 , H01L21/306
CPC分类号： C23C16/4585 , C23C16/46
摘要： A one-piece susceptor ring for housing at least one temperature measuring device is provided. The susceptor ring includes a plate having an aperture formed therethrough and a pair of side ribs integrally connected to a lower surface of the plate. The side ribs are located on opposing sides of the aperture. The susceptor ring further includes a bore formed in each of the pair of side ribs. Each bore is configured to receive a temperature measuring device therein.
摘要翻译：提供用于容纳至少一个温度测量装置的一体式基座环。基座环包括具有穿过其形成的孔的板和与板的下表面一体连接的一对侧肋。侧肋位于孔的相对侧上。基座环还包括形成在一对侧肋中的每一个中的孔。每个孔配置成在其中接收温度测量装置。

10. 发明授权

US07147720B2 Non-contact cool-down station for wafers 失效
标题翻译：用于晶圆的非接触式冷却站
公开(公告)号：US07147720B2
公开(公告)日：2006-12-12
申请号：US11059188
申请日：2005-02-15
申请人： Ravinder Aggarwal , Bob Haro
发明人： Ravinder Aggarwal , Bob Haro
IPC分类号： C23C16/00 , H01L21/00
CPC分类号： H01L21/67196 , H01L21/67109
摘要： A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.
摘要翻译：用于在晶片经过半导体处理之后冷却晶片的固定式冷却站通过根据伯努利原理流动气体来支撑晶片。冷却站的上壁包含多个气体出口，其引导气体流过晶片的顶表面。以这种方式，在晶片上形成低压区域，并且将晶片悬挂在冷却站内，而不直接接触用于支撑的任何表面。除了为晶片提供电梯之外，气体是导热气体，其可以通过将热量远离其来冷却晶片。

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