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1. 发明申请

US20100240159A1 MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT 有权
标题翻译：半导体激光元件的制造方法
公开(公告)号：US20100240159A1
公开(公告)日：2010-09-23
申请号：US12676666
申请日：2008-09-02
申请人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
发明人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
IPC分类号： H01L21/304
CPC分类号： B23K26/0624 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C03B33/0222 , H01L21/78 , H01S5/0201 , Y02P40/57
摘要： Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.
摘要翻译：最初在被加工物1中形成沿切割线5a，5b延伸的用于切割的切割8a，8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b，同时定位在物体1内的会聚点，并且形成为沿着切割线的线延伸的部分，除了与切割线5a相交的部分34b。这样，从切点8a的起点区域切断物体1时，能够切割8b的起点区域的影响更小，从而可以可靠地获得具有精确的切割面的条。因此，不需要在多个条中形成沿着切割线5b切割的起点区域，从而可以提高半导体激光元件的生产率。

2. 发明授权

US08110422B2 Manufacturing method of semiconductor laser element 有权
标题翻译：半导体激光元件的制造方法
公开(公告)号：US08110422B2
公开(公告)日：2012-02-07
申请号：US12676666
申请日：2008-09-02
申请人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
发明人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
IPC分类号： H01L21/00
CPC分类号： B23K26/0624 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C03B33/0222 , H01L21/78 , H01S5/0201 , Y02P40/57
摘要： Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.
摘要翻译：最初在被加工物1中形成沿切割线5a，5b延伸的用于切割的切割8a，8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b，同时定位在物体1内的会聚点，并且形成为沿着切割线的线延伸的部分，除了与切割线5a相交的部分34b。这样，从切点8a的起点区域切断物体1时，能够切割8b的起点区域的影响更小，从而可以可靠地获得具有精确的切割面的条。因此，不需要在多个条中形成沿着切割线5b切割的起点区域，从而可以提高半导体激光元件的生产率。

3. 发明申请

US20080218735A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080218735A1
公开(公告)日：2008-09-11
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： G01N21/00 , G02B27/02
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤（S13和S14），然后相对于每个移动透镜和物体另外沿着主表面，同时在释放之后调整透镜和主表面之间的间隙，从而形成改质区域。

4. 发明授权

US08624153B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08624153B2
公开(公告)日：2014-01-07
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/14
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和S12），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

5. 发明申请

US20060144828A1 Device and method for laser processing 审中-公开
标题翻译：用于激光加工的装置和方法
公开(公告)号：US20060144828A1
公开(公告)日：2006-07-06
申请号：US10537510
申请日：2003-12-04
申请人： Kenshi Fukumitsu , Fumitsugu Fukuyo , Koji Kuno
发明人： Kenshi Fukumitsu , Fumitsugu Fukuyo , Koji Kuno
IPC分类号： B23K26/16
CPC分类号： B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D1/221
摘要： A laser processing apparatus and a laser processing method which can accurately converge processing laser light at a predetermined position are provided. In the laser processing apparatus, a condenser lens 31 converges processing laser light L1 and rangefinding laser light L2 onto an object to be processed 1 on the same axis. Here, light-converging point position control means 40 detects reflected light L3 of the rangefinding laser light reflected by the front face 3 of the object 1, and places a light-converging point P1 of the processing laser light L1 at a predetermined position. Since the processing by the processing laser light L1 and the measurement of displacement of the front face 3 by the rangefinding laser light L2 are carried out on the same axis as such, the light-converging point P1 of processing laser light L1 can be prevented from shifting from the predetermined position because of vibrations of the stage 21 and the like. Therefore, the processing laser light L1 can accurately be converged at the predetermined position.
摘要翻译：提供了能够将处理激光准确地收敛在预定位置的激光加工装置和激光加工方法。在激光加工装置中，聚光透镜31将加工用激光L1和测距激光L 2在同一轴上会聚在待处理对象物1上。这里，聚光点位置控制装置40检测由物体1的正面3反射的测距激光的反射光L 3，并将处理用激光L 1的聚光点P1置于规定的位置。由于通过加工用激光L 1的处理和通过测距激光L 2进行的前面3的位移测量在同一轴上进行，因此处理用激光L 1的聚光点P 1 可以防止由于台架21等的振动而从预定位置移动。因此，处理用激光L 1能够精确地会聚在预定位置。

6. 发明申请

US20120196427A1 LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：激光工作方法，激光工作装置及其制造方法
公开(公告)号：US20120196427A1
公开(公告)日：2012-08-02
申请号：US13362781
申请日：2012-01-31
申请人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
发明人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
IPC分类号： H01L21/78 , B23P11/00 , B23K26/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.
摘要翻译：用由反射型空间光调制器调制的激光照射物体，使得会聚在物体内的激光的像差成为预定像差或更小。因此，在激光的会聚点所在的位置处产生的激光的像差尽可能地小，以增强该位置处的激光的能量密度，这使得可以形成经修改的具有高功能的区域作为切割的起点。此外，由于使用反射型空间光调制器，与透射型空间光调制器相比，可以提高激光的利用效率。

7. 发明授权

US08134099B2 Laser working method, laser working apparatus, and its manufacturing method 有权
标题翻译：激光加工方法，激光加工装置及其制造方法
公开(公告)号：US08134099B2
公开(公告)日：2012-03-13
申请号：US12671820
申请日：2008-07-28
申请人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
发明人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
IPC分类号： B23K26/38 , B23K26/06
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object to be processed 1 is irradiated with a laser light L modulated by a reflection type spatial light modulator 203 such that aberration of the laser light L converged inside the object 1 becomes a predetermined aberration or less. Therefore, aberration of the laser light L generated at a position on which a converging point P of the laser light L is located is made as small as possible, to enhance the energy density of the laser light L at that position, which makes it possible to form a modified region 7 with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator 203 is used, it is possible to improve the utilization efficiency of the laser light L as compared with a transmissive type spatial light modulator. Such improvement of the utilization efficiency of the laser light L is particularly important in the case in which the modified region 7 serving as a starting point for cutting is formed in the plate-shaped object 1.
摘要翻译：用由反射型空间光调制器203调制的激光L照射待处理物体1，使得会聚在物体1内的激光L的像差成为预定像差或更小。因此，在激光L的会聚点P所在的位置处产生的激光L的像差尽可能地小，以增强该位置处的激光L的能量密度，这使得它成为可能形成作为切割起点的高功能的改质区域7。此外，由于使用反射型空间光调制器203，与透射型空间光调制器相比，可以提高激光L的利用效率。这样的激光L的利用效率的提高对于在板状物体1中形成作为切割起点的改质区域7的情况是特别重要的。

8. 发明授权

US09428413B2 Laser working method, laser working apparatus, and its manufacturing method 有权
标题翻译：激光加工方法，激光加工装置及其制造方法
公开(公告)号：US09428413B2
公开(公告)日：2016-08-30
申请号：US13362781
申请日：2012-01-31
申请人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
发明人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
IPC分类号： B23K26/402 , C03B33/02 , B23K26/00 , B23K26/04 , B23K26/08 , B23K26/12 , B28D1/22 , B28D5/00 , B23K26/40
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.
摘要翻译：用由反射型空间光调制器调制的激光照射物体，使得会聚在物体内的激光的像差成为预定像差或更小。因此，在激光的会聚点所在的位置处产生的激光的像差尽可能地小，以增强该位置处的激光的能量密度，这使得可以形成经修改的具有高功能的区域作为切割的起点。此外，由于使用反射型空间光调制器，与透射型空间光调制器相比，可以提高激光的利用效率。

9. 发明申请

US20110000897A1 LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD 有权
标题翻译：激光工作方法，激光工作装置及其制造方法
公开(公告)号：US20110000897A1
公开(公告)日：2011-01-06
申请号：US12671820
申请日：2008-07-28
申请人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
发明人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
IPC分类号： B23K26/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object to be processed 1 is irradiated with a laser light L modulated by a reflection type spatial light modulator 203 such that aberration of the laser light L converged inside the object 1 becomes a predetermined aberration or less. Therefore, aberration of the laser light L generated at a position on which a converging point P of the laser light L is located is made as small as possible, to enhance the energy density of the laser light L at that position, which makes it possible to form a modified region 7 with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator 203 is used, it is possible to improve the utilization efficiency of the laser light L as compared with a transmissive type spatial light modulator. Such improvement of the utilization efficiency of the laser light L is particularly important in the case in which the modified region 7 serving as a starting point for cutting is formed in the plate-shaped object 1.
摘要翻译：用由反射型空间光调制器203调制的激光L照射待处理物体1，使得会聚在物体1内的激光L的像差成为预定像差或更小。因此，在激光L的会聚点P所在的位置处产生的激光L的像差尽可能地小，以增强该位置处的激光L的能量密度，这使得它成为可能形成作为切割起点的高功能的改质区域7。此外，由于使用反射型空间光调制器203，与透射型空间光调制器相比，可以提高激光L的利用效率。这样的激光L的利用效率的提高对于在板状物体1中形成作为切割起点的改质区域7的情况是特别重要的。

10. 发明授权

US08287990B2 Radio wave transmission cover and method of manufacturing the same 有权
标题翻译：无线电波传输盖及其制造方法
公开(公告)号：US08287990B2
公开(公告)日：2012-10-16
申请号：US12076523
申请日：2008-03-19
申请人： Hideto Maeda , Daiichiro Kawashima , Kimihiro Iimura , Koji Kuno , Mamoru Kato , Takayasu Ido , Muneo Furutani , Tetsuya Fujii
发明人： Hideto Maeda , Daiichiro Kawashima , Kimihiro Iimura , Koji Kuno , Mamoru Kato , Takayasu Ido , Muneo Furutani , Tetsuya Fujii
IPC分类号： B32B3/00 , B05D5/12
CPC分类号： H01Q1/40 , B29C45/1671 , B29C2045/1673 , B29K2995/0025 , B29K2995/0026 , B60R19/483 , G01S7/03 , G01S2013/9371 , G01S2013/9375 , H01Q1/3233 , H01Q1/42 , H01Q1/422 , Y10T428/24802 , Y10T428/24851
摘要： The present invention provides a radio wave transmission cover, which is provided in front of a radar device for vehicles, and a method of manufacturing the radio wave transmission cover. In the radio wave transmission cover, cover-side wall surfaces (50) are formed in a second cover layer (35) at positions adjacent to each other. Furthermore, substrate-side wall surfaces (60), which have shapes complementary to the cover-side wall surfaces (50), are formed in a substrate layer (4), which is provided on the rear surface of the second cover layer (35). The cover-side wall surfaces (50) and the corresponding substrate-side wall surfaces (60) are engaged to each other.
摘要翻译：本发明提供一种无线电波传输盖，其设置在用于车辆的雷达装置的前方，以及制造无线电波传输盖的方法。在无线电波传输盖中，在彼此相邻的位置处，在第二覆盖层（35）中形成盖侧壁面（50）。此外，在设置在第二覆盖层（35）的后表面上的基板层（4）中形成具有与盖侧壁面（50）互补的形状的基板侧壁面（60））。盖侧壁面（50）和相应的基板侧壁面（60）彼此接合。

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