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1. 发明申请

US20080218735A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080218735A1
公开(公告)日：2008-09-11
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： G01N21/00 , G02B27/02
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤（S13和S14），然后相对于每个移动透镜和物体另外沿着主表面，同时在释放之后调整透镜和主表面之间的间隙，从而形成改质区域。

2. 发明授权

US08624153B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08624153B2
公开(公告)日：2014-01-07
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/14
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和S12），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

3. 发明授权

US09352414B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US09352414B2
公开(公告)日：2016-05-31
申请号：US10585660
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/00 , B23K26/03 , B23K26/04 , B23K26/40
CPC分类号： B23K26/53 , B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing method having a displacement acquiring step of acquiring a displacement between a point on the cutting line and one end of the cutting line in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position.
摘要翻译：一种激光加工方法，具有位移获取步骤，用于在由所述透镜会聚的第二激光束照射所述物体的同时获取所述切割线上的点与所述切割线中的切割线的一端之间的位移，以测量所述物体的位移物体的主表面; 以及位置设定步骤，根据获取的位移设定用于保持透镜相对于被摄体的主表面的初始位置，并将透镜保持在如此设定的初始位置。

4. 发明授权

US08993922B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08993922B2
公开(公告)日：2015-03-31
申请号：US10585451
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/14 , B23K26/00 , B23K26/04 , B23K26/40
CPC分类号： B23K26/53 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
摘要翻译：提供一种可以有效地执行激光加工同时最小化激光束的会聚点的偏差的激光加工方法。该激光加工方法包括：位移获取步骤（S07至S11），用用于测量物体的主表面的位移的测距激光束照射被处理物体，同时将激光束与透镜一起收敛，并获得沿着切割线的主表面，同时响应于照射检测由主表面反射的反射光; 并且沿着主表面相对于彼此移动处理物镜和物体，同时根据由位移获取步骤获取的位移调节处理物镜与表面之间的间隙，从而沿着线形成修改区域切。

5. 发明申请

US20080251506A1 Laser Processing Method and Device 有权
标题翻译：激光加工方法和装置
公开(公告)号：US20080251506A1
公开(公告)日：2008-10-16
申请号：US10585660
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/00
CPC分类号： B23K26/53 , B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a displacement acquiring step (S06 and S07) of acquiring a displacement between a point on the line to cut and one end of the line to cut in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step (S08 and S09) of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position. After a modified region is formed in one end part of the line to cut by irradiation with a first laser beam for processing while holding the lens at the initial position, the lens is released from being held, and then the modified region is formed while adjusting the position of the lens.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括位移获取步骤（S 06和S 07），用于在用第二激光束照射物体的同时获取被切割线上的点与要切割的物体线的一端之间的位移，收敛通过透镜测量物体的主表面的位移; 以及位置设定步骤（S 08和S 09），其根据获取的位移来设定用于保持透镜相对于被摄体的主表面的初始位置，并且将透镜保持在如此设定的初始位置。在将透镜保持在初始位置的状态下，在通过照射第一激光束进行处理而在被切割线的一个端部形成改质区域之后，透镜被解除保持，然后在调整时形成改质区域镜头的位置。

6. 发明申请

US20080037003A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080037003A1
公开(公告)日：2008-02-14
申请号：US10585451
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/04
CPC分类号： B23K26/53 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
摘要翻译：提供一种可以有效地执行激光加工同时最小化激光束的会聚点的偏差的激光加工方法。这种激光加工方法包括：用用于测量物体的主表面的位移的测距激光束照射被处理物体的位移获取步骤（S07至S11），同时用激光束与透镜同步并获取沿着切割线的主表面的位移，同时响应于照射检测由主表面反射的反射光; 并且沿着主表面相对于彼此移动处理物镜和物体，同时根据由位移获取步骤获取的位移调节处理物镜与表面之间的间隙，从而沿着线形成修改区域切。

7. 发明授权

US09012805B2 Laser working method 有权
标题翻译：激光加工方式
公开(公告)号：US09012805B2
公开(公告)日：2015-04-21
申请号：US12444119
申请日：2007-09-26
申请人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
IPC分类号： B23K26/00 , B23K26/04 , B23K26/40
CPC分类号： B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K2103/50
摘要： A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed 1 is irradiated with measuring laser light along a line to cut 5, astigmatism is added to a reflected light component of the measuring laser light reflected by a front face 3 of the object 1 irradiated with the measuring laser light, a displacement sensor signal corresponding to a converged light image of the reflected light component having the astigmatism added thereto is detected, and the displacement sensor signal is made to become a feedback reference value corresponding to the quantity of the reflected light component, so as to locate the converging point of the processing laser light at a predetermined position with respect to the front face 3. This allows tire converging point of the processing laser light to follow the front face 3 of the object 1 reliably and accurately even when an area exhibiting an extremely low reflectance to the measuring laser light exists in a part of the front face 3 and lowers the quantity of the reflected light component of the measuring laser light.
摘要翻译：使处理激光的会聚点精确地跟随被处理物体的激光照射面。将被处理物体1沿着被切割线5的测量用激光照射，对被照射测量用激光的被检体1的正面3反射的测定用激光的反射光成分加上像散，检测与加有像散的反射光分量的会聚光图像相对应的位移传感器信号，使位移传感器信号成为与反射光分量的量对应的反馈基准值，处理激光的会聚点相对于前面3在预定位置。即使当显示极低的区域时，处理激光的轮胎会聚点可靠地准确地跟随物体1的正面3 在前表面3的一部分中存在对测量激光的反射率，并且降低了反射光分量的量测量激光。

8. 发明申请

US20100032418A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：US20100032418A1
公开(公告)日：2010-02-11
申请号：US12444125
申请日：2007-09-27
申请人： Koji Kuno , Tatsuya Suzuki , Kazuhiro Atsumi
发明人： Koji Kuno , Tatsuya Suzuki , Kazuhiro Atsumi
IPC分类号： B23K26/38
CPC分类号： B23K26/048 , B23K26/046 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/02381 , H01L21/02675 , H01L21/67092 , H01L21/78
摘要： While a converging lens 108 is relatively moved along a line 50 including a line to cut 5, measuring laser light L2 is converged with the lens 108 when the lens 108 is positioned on a processing region 30 having an outer shape between an object to be processed 1 and a frame 22, and a reflected light component of the laser light L2 reflected by a front face 3 of the object 1 is detected. While keeping a substantially constant distance between the front face 3 and the lens 108 such that a converging point P of processing laser light L1 is positioned at a constant distance from the front face 3 according to the detection, the laser light L1 is converged by the lens 108, so as to form a molten processed region 13 within the object 1.
摘要翻译：当会聚透镜108沿着包括切割线5的线50相对移动时，当透镜108位于具有处于被处理物体之间的外形的处理区域30时，测量激光L2与透镜108会聚检测出由物体1的正面3反射的激光L2的反射光分量。在保持前表面3和透镜108之间保持基本上恒定的距离的同时，根据检测，处理激光L1的会聚点P位于距前表面3的恒定距离处，激光L1被透镜108，以便在物体1内形成熔融处理区域13。

9. 发明授权

US08933368B2 Laser processing method for cutting planar object 有权
标题翻译：用于切割平面物体的激光加工方法
公开(公告)号：US08933368B2
公开(公告)日：2015-01-13
申请号：US12443755
申请日：2007-09-25
申请人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
IPC分类号： B23K26/00 , H01L21/78 , B23K26/40 , C03B33/02 , C03B33/09 , B23K26/04 , H01L21/02
CPC分类号： H01L21/78 , B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/091 , H01L21/02381 , H01L21/02675
摘要： A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference γ has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference γ exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.
摘要翻译：改性区域相对于待处理物体的激光照射面在合适的位置精确地形成。当在跟踪记录期间平均差γ具有超过预定阈值的值时，定义包括平均差γ超过预定阈值的线段S的粒子段Z。这确定了在切割线5上存在粒子并随机地反射测量激光，由此将粒子的存在影响到要切割的线段中的控制信号的部分作为粒子段Z被检测。校正控制信号在颗粒区段Z中，由于在颗粒存在的影响下包含在信号值中的误差，会阻止会聚透镜的移动，因此处理激光的会聚点准确地跟随正面3 。

10. 发明申请

US20100012633A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：US20100012633A1
公开(公告)日：2010-01-21
申请号：US12443755
申请日：2007-09-25
申请人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
IPC分类号： B23K26/38
CPC分类号： H01L21/78 , B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/091 , H01L21/02381 , H01L21/02675
摘要： A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference γ has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference γ exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.
摘要翻译：改性区域相对于待处理物体的激光照射面在合适的位置精确地形成。当在跟踪记录期间平均差值γ具有超过预定阈值的值时，定义包括平均差值γ超过预定阈值的线段S的粒子段Z。这确定粒子存在于要切割的线5上并随机反射测量激光，由此将粒子的存在影响到要切割的线段中的控制信号的部分作为粒子段Z被检测。校正控制信号在颗粒区段Z中，由于在颗粒存在的影响下包含在信号值中的误差，会阻止会聚透镜的移动，因此处理激光的会聚点准确地跟随正面3 。

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