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1. 发明授权

US08624153B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08624153B2
公开(公告)日：2014-01-07
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/14
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和S12），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

2. 发明授权

US07626746B2 Shutter unit and laser processing device using same 有权
标题翻译：快门单元和激光加工设备使用相同
公开(公告)号：US07626746B2
公开(公告)日：2009-12-01
申请号：US10577550
申请日：2004-11-04
申请人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
发明人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
IPC分类号： G02B26/08
CPC分类号： G02B5/005
摘要： A shutter unit capable of preventing the scattering of the laser beam upon closing the optical path of the laser beam and capable of being miniaturized, and a laser processing device employing such a shutter unit. In a shutter unit 1, when the optical path of the laser beam L is opened, a rotating member 57 is rotated around an axis line γ, and an opening 61 is positioned on an optical axis α so as to pass the laser beam L therethrough. Meanwhile, when the optical path of the laser beam L is closed, the rotating member 57 is rotated and a reflective surface 62 is positioned on the optical axis α so as to reflect the laser beam L. Here, since the reflected laser beam L is absorbed by an optical absorption member 63, it is possible to prevent the scattering of the laser beam L when the optical path of the laser beam L is closed. In addition, since the opening 61 and reflective surface 62 are both formed on the rotating member 57 which rotates around the axis line γ that is substantially orthogonal to the optical axis α, it is possible to reduce the size of the shutter unit 1.
摘要翻译：一种快门单元，其能够防止在关闭激光束的光路并能够小型化时激光束的散射，以及采用这种快门单元的激光加工装置。在快门单元1中，当激光束L的光路打开时，旋转部件57围绕轴线γ转动，并且开口61位于光轴α上，以使激光束L穿过其中。同时，当激光束L的光路闭合时，旋转部件57旋转，反射面62位于光轴α上，以反射激光束L.这里，由于反射激光束L为通过光吸收构件63吸收，可以防止激光束L的光路闭合时的激光L的散射。此外，由于开口61和反射表面62都形成在围绕基本上与光轴α1正交的轴线gamma旋转的旋转部件57上，所以可以减小快门单元1的尺寸。

3. 发明申请

US20080218735A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080218735A1
公开(公告)日：2008-09-11
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： G01N21/00 , G02B27/02
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤（S13和S14），然后相对于每个移动透镜和物体另外沿着主表面，同时在释放之后调整透镜和主表面之间的间隙，从而形成改质区域。

4. 发明申请

US20070273950A1 Shutter Unit and Laser Processing Device Using Same 有权
标题翻译：快门单元和激光加工设备使用相同
公开(公告)号：US20070273950A1
公开(公告)日：2007-11-29
申请号：US10577550
申请日：2004-11-04
申请人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
发明人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
IPC分类号： G02B26/00 , H01S3/00
CPC分类号： G02B5/005
摘要： A shutter unit capable of preventing the scattering of the laser beam upon closing the optical path of the laser beam and capable of being miniaturized, and a laser processing device employing such a shutter unit. In a shutter unit 1, when the optical path of the laser beam L is opened, a rotating member 57 is rotated around an axis line γ, and an opening 61 is positioned on an optical axis α so as to pass the laser beam L therethrough. Meanwhile, when the optical path of the laser beam L is closed, the rotating member 57 is rotated and a reflective surface 62 is positioned on the optical axis α so as to reflect the laser beam L. Here, since the reflected laser beam L is absorbed by an optical absorption member 63, it is possible to prevent the scattering of the laser beam L when the optical path of the laser beam L is closed. In addition, since the opening 61 and reflective surface 62 are both formed on the rotating member 57 which rotates around the axis line γ that is substantially orthogonal to the optical axis α, it is possible to reduce the size of the shutter unit 1.
摘要翻译：一种快门单元，其能够防止在关闭激光束的光路并能够小型化时激光束的散射，以及采用这种快门单元的激光加工装置。在快门单元1中，当激光束L的光路打开时，旋转部件57围绕轴线γ转动，并且开口61位于光轴α上，以使激光束L穿过其中。同时，当激光束L的光路闭合时，旋转部件57旋转，反射面62位于光轴α上，以反射激光束L.这里，由于反射激光束L为通过光吸收构件63吸收，可以防止激光束L的光路闭合时的激光L的散射。此外，由于开口61和反射表面62都形成在围绕基本上与光轴α1正交的轴线gamma旋转的旋转部件57上，所以可以减小快门单元1的尺寸。

5. 发明申请

US20080037003A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080037003A1
公开(公告)日：2008-02-14
申请号：US10585451
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/04
CPC分类号： B23K26/53 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
摘要翻译：提供一种可以有效地执行激光加工同时最小化激光束的会聚点的偏差的激光加工方法。这种激光加工方法包括：用用于测量物体的主表面的位移的测距激光束照射被处理物体的位移获取步骤（S07至S11），同时用激光束与透镜同步并获取沿着切割线的主表面的位移，同时响应于照射检测由主表面反射的反射光; 并且沿着主表面相对于彼此移动处理物镜和物体，同时根据由位移获取步骤获取的位移调节处理物镜与表面之间的间隙，从而沿着线形成修改区域切。

6. 发明授权

US09352414B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US09352414B2
公开(公告)日：2016-05-31
申请号：US10585660
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/00 , B23K26/03 , B23K26/04 , B23K26/40
CPC分类号： B23K26/53 , B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing method having a displacement acquiring step of acquiring a displacement between a point on the cutting line and one end of the cutting line in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position.
摘要翻译：一种激光加工方法，具有位移获取步骤，用于在由所述透镜会聚的第二激光束照射所述物体的同时获取所述切割线上的点与所述切割线中的切割线的一端之间的位移，以测量所述物体的位移物体的主表面; 以及位置设定步骤，根据获取的位移设定用于保持透镜相对于被摄体的主表面的初始位置，并将透镜保持在如此设定的初始位置。

7. 发明授权

US08993922B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08993922B2
公开(公告)日：2015-03-31
申请号：US10585451
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/14 , B23K26/00 , B23K26/04 , B23K26/40
CPC分类号： B23K26/53 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
摘要翻译：提供一种可以有效地执行激光加工同时最小化激光束的会聚点的偏差的激光加工方法。该激光加工方法包括：位移获取步骤（S07至S11），用用于测量物体的主表面的位移的测距激光束照射被处理物体，同时将激光束与透镜一起收敛，并获得沿着切割线的主表面，同时响应于照射检测由主表面反射的反射光; 并且沿着主表面相对于彼此移动处理物镜和物体，同时根据由位移获取步骤获取的位移调节处理物镜与表面之间的间隙，从而沿着线形成修改区域切。

8. 发明申请

US20080251506A1 Laser Processing Method and Device 有权
标题翻译：激光加工方法和装置
公开(公告)号：US20080251506A1
公开(公告)日：2008-10-16
申请号：US10585660
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/00
CPC分类号： B23K26/53 , B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a displacement acquiring step (S06 and S07) of acquiring a displacement between a point on the line to cut and one end of the line to cut in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step (S08 and S09) of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position. After a modified region is formed in one end part of the line to cut by irradiation with a first laser beam for processing while holding the lens at the initial position, the lens is released from being held, and then the modified region is formed while adjusting the position of the lens.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括位移获取步骤（S 06和S 07），用于在用第二激光束照射物体的同时获取被切割线上的点与要切割的物体线的一端之间的位移，收敛通过透镜测量物体的主表面的位移; 以及位置设定步骤（S 08和S 09），其根据获取的位移来设定用于保持透镜相对于被摄体的主表面的初始位置，并且将透镜保持在如此设定的初始位置。在将透镜保持在初始位置的状态下，在通过照射第一激光束进行处理而在被切割线的一个端部形成改质区域之后，透镜被解除保持，然后在调整时形成改质区域镜头的位置。

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