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    • 8. 发明授权
    • Thin-film micromechanical resonator, thin-film micromechanical resonator gyro, and navigation system and automobile using the resonator gyro
    • 薄膜微机械谐振器,薄膜微机械谐振陀螺,以及使用谐振陀螺的导航系统和汽车
    • US07002284B2
    • 2006-02-21
    • US10470669
    • 2002-11-26
    • Satoshi OuchiToshiyuki NozoeKoji NomuraHirofumi Tajika
    • Satoshi OuchiToshiyuki NozoeKoji NomuraHirofumi Tajika
    • H03H9/21
    • G01C19/5607H03H9/21H03H9/2484H03H2003/0492
    • A thin film micromechanical resonator (resonator) having improved drive efficiency, a resonator gyro having improved sensitivity in detecting an angular velocity, and a navigation system and an automobile using the resonator gyro. The resonator includes a tuning fork structure made of a non-piezoelectric material, and a first electrode and a second electrode disposed respectively at the inner side and the outer side of the tuning fork arm. On the first and second electrodes, a first piezo film and a second piezo film are provided respectively, and a third electrode and a fourth are respectively provided electrode thereon. When an alternating voltage is applied to the third and fourth electrodes at the opposite phases each other, the tuning fork resonates in the direction perpendicular to the center line. The resonator gyro detects, at the sensing section which is formed of another electrodes and another piezo film, the Coriolis force generated in proportion to angular velocity given to the resonator.
    • 具有改进的驱动效率的薄膜微机械谐振器(谐振器),在检测角速度方面具有改进的灵敏度的谐振器陀螺仪以及使用谐振器陀螺仪的导航系统和汽车。 谐振器包括由非压电材料制成的音叉结构,以及分别设置在音叉臂的内侧和外侧的第一电极和第二电极。 在第一和第二电极上分别设置第一压电膜和第二压电膜,第三电极和第四电极分别设置有电极。 当交替电压以相反的相位施加到第三和第四电极时,音叉在垂直于中心线的方向上共振。 谐振器陀螺仪在由另一个电极和另一个压电膜形成的感测部分检测到与给予谐振器的角速度成比例地产生的科里奥利力。
    • 10. 发明授权
    • Electronic circuit device and manufacturing method thereof
    • 电子电路装置及其制造方法
    • US5346402A
    • 1994-09-13
    • US19671
    • 1993-02-19
    • Takeo YasuhoHirofumi TajikaKatsumi Kohzu
    • Takeo YasuhoHirofumi TajikaKatsumi Kohzu
    • H01L25/10H05K1/14H05K7/02H01R23/72
    • H05K1/144H01L25/105H05K7/023H01L2225/1023H01L2225/107H01L2225/1094H01L2924/0002Y10T29/4922
    • It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.
    • 本发明的目的是提供一种电子电路装置,其中将半导体元件,电阻器,电容器等封装在诸如陶瓷基板等的绝缘基板上,其中实现了高密度封装。 电路模块包括端子部分,其具有环形绝缘框架体和设置在框架主体的相应部分上以从其向外延伸的多个端子,以及具有各自适于与端子部分的各个端子连接的布线图案的电路基板 并且将电路基板表面的包装部件的一个表面封装,电路基板连接到端子,表面封装部件指向端子部分的内部。 一个电路模块堆叠在另一个电路模块上,以通过端子与后者连接。 因此,可以容易地实现高密度包装。