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    • 6. 发明申请
    • Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program
    • 微结构探针卡,微结构检测装置,方法和计算机程序
    • US20090128171A1
    • 2009-05-21
    • US11887476
    • 2006-03-30
    • Katsuya OkumuraMasami YakabeNaoki Ikeuchi
    • Katsuya OkumuraMasami YakabeNaoki Ikeuchi
    • G01R31/02
    • G01C19/56B81C99/005G01P15/123G01P15/18G01P21/00G01P2015/084G01P2015/0842
    • An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by supressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided.When inspection on a microstructure is performed, first a pair of probes (2) are caused to contact respective electrode pads (PD), and the pair of probes (2) and a fritting power source (50) are connected together through relays (30). Next a voltage is applied from the fritting power source (50) to one probe (2) in the pair of probes (2). As the voltage is gradually increased, an oxide film between the pair of probes (2) is destroyed and a current flows between the pair of probes (2) by fritting phenomenon, and the probes (2) and the electrode pad (PD) are electrically conducted each other. Subsequently, the pair of probes (2) are switched to a measuring unit (40) side from the fritting power source (50) through the relays (30), and electrically connected to the measuring unit (40).
    • 提供了一种用于具有可移动部分的微结构的检查方法,并且通过抑制将探针接触检查电极​​的针头压力的影响来执行高精度检查而不损坏探针或检查电极。 当对微结构进行检查时,首先使一对探针(2)与相应的电极焊盘(PD)接触,并且一对探针(2)和熔接电源(50)通过继电器(30)连接在一起 )。 接下来,从熔接电源(50)向一对探针(2)中的一个探针(2)施加电压。 随着电压逐渐增加,一对探针(2)之间的氧化膜被破坏,并且通过烧结现象在一对探针(2)之间流动电流,并且探针(2)和电极焊盘(PD)是 相互导电。 随后,一对探针(2)通过继电器(30)从熔接电源(50)切换到测量单元(40)侧,并且电连接到测量单元(40)。