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    • 5. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US07841788B2
    • 2010-11-30
    • US11689077
    • 2007-03-21
    • Ayumi HiguchiKenichiro Arai
    • Ayumi HiguchiKenichiro Arai
    • G03D5/00
    • G03D5/00H01L21/67057
    • In a substrate processing apparatus of the present invention, a buffer bath is provided at any point in a supplying passage of a processing solution supplying part, and a micro bubble generator is provided in the buffer bath. When a substrate is processed, large quantities of micro bubbles can be generated and stored in the buffer bath, and the micro bubbles can be supplied from the buffer bath to a processing bath. This enables the large quantities of micro bubbles to be supplied to the surrounding of the substrate, while the use of the small micro bubble generator avoids an increase in the size of the substrate processing apparatus.
    • 在本发明的基板处理装置中,在处理液供给部的供给通路中的任意点设有缓冲槽,在缓冲槽内设置微气泡生成装置。 当处理基板时,可以产生大量的微气泡并将其储存在缓冲槽中,并且微气泡可以从缓冲液供应到处理槽。 这使得能够将大量的微气泡供应到基板的周围,而使用小的微气泡发生器避免了基板处理装置的尺寸的增加。