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1. 发明授权

US5061144A Resist process apparatus 失效
标题翻译：抗蚀加工设备
公开(公告)号：US5061144A
公开(公告)日：1991-10-29
申请号：US442535
申请日：1989-11-28
申请人： Masami Akimoto , Yoshio Kimura , Osamu Hirakawa , Noriyuki Anai , Masanori Tateyama , Yasuhiro Sakamoto
发明人： Masami Akimoto , Yoshio Kimura , Osamu Hirakawa , Noriyuki Anai , Masanori Tateyama , Yasuhiro Sakamoto
IPC分类号： G03F7/26 , H01L21/677 , H01L21/687
CPC分类号： H01L21/68707 , G03F7/26 , H01L21/67778 , Y10S414/135 , Y10S414/137
摘要： A resist process apparatus of the invention serves to load/unload a semiconductor wafer in/from the respective process mechanisms. The apparatus includes a wafer holding member for holding a semiconductor wafer, and X, Y, Z and .theta. driving mechanisms for conveying the wafer holding member to a resist coating mechanism and the like. The wafer holding member includes a support frame which is larger than diameter of a semiconductor wafer, and a plurality of support members, arranged on the support frame, for supporting the semiconductor wafer in partial contact with the peripheral portion of the semiconductor wafer. Since the contact area between the support members and a semiconductor wafer is small, changes in temperature of the semiconductor, when it is held, are small.
摘要翻译：本发明的抗蚀剂处理装置用于在各个加工机构中加载/卸载半导体晶片。该装置包括用于保持半导体晶片的晶片保持构件和用于将晶片保持构件输送到抗蚀剂涂覆机构等的X，Y，Z和θ驱动机构。晶片保持构件包括比半导体晶片的直径大的支撑框架和布置在支撑框架上的多个支撑构件，用于支撑半导体晶片与半导体晶片的周边部分部分接触。由于支撑构件和半导体晶片之间的接触面积小，因此在保持时半导体的温度变化小。

2. 发明授权

US5028955A Exposure apparatus 失效
标题翻译：曝光装置
公开(公告)号：US5028955A
公开(公告)日：1991-07-02
申请号：US480005
申请日：1990-02-14
申请人： Yasushi Hayashida , Noriyuki Anai , Osamu Hirakawa , Masami Akimoto , Yasuhiro Sakamoto , Keisuke Shigaki , Masashi Moriyama
发明人： Yasushi Hayashida , Noriyuki Anai , Osamu Hirakawa , Masami Akimoto , Yasuhiro Sakamoto , Keisuke Shigaki , Masashi Moriyama
IPC分类号： G03F7/20
CPC分类号： G03F7/70725 , G03F7/2051
摘要： An exposure apparatus of this invention is used in an exposure process of semiconductor and LCD devices. The exposure apparatus includes a stage on which a semiconductor wafer is placed, a rotating mechanism for rotating the stage, a radiation unit arranged to oppose a support surface of the stage, a slider mechanism for reciprocating the radiation unit along a straight line passing through the center of the support surface of the stage, an exposure range input unit for inputting a desired exposure range of the wafer, an exposure range memory unit for storing the input exposure range, a CCD image sensor for detecting a reference position of the wafer, a relative position detector for detecting a relative position between the detected reference position and the radiation unit, a controller for controlling the sliding mechanism in correspondence with the relative position and the exposure range, and a light amount control mechanism for controlling an amount of light radiated from the irradiation mechanism to the wafer in correspondence with the relative position and the exposure range.
摘要翻译：本发明的曝光装置用于半导体和LCD装置的曝光处理。曝光装置包括其上放置有半导体晶片的台，用于旋转台的旋转机构，布置成与舞台的支撑表面相对的辐射单元，用于使辐射单元沿着穿过舞台的支撑表面的中心，用于输入晶片的期望曝光范围的曝光范围输入单元，用于存储输入曝光范围的曝光范围存储单元，用于检测晶片的参考位置的CCD图像传感器，相对位置检测器，用于检测检测到的基准位置和辐射单元之间的相对位置，控制器，用于根据相对位置和曝光范围来控制滑动机构;以及光量控制机构，用于控制从对应于相对位置和曝光范围的到晶片的照射机构。

3. 发明授权

US06368776B1 Treatment apparatus and treatment method 有权
标题翻译：治疗仪器及治疗方法
公开(公告)号：US06368776B1
公开(公告)日：2002-04-09
申请号：US09270806
申请日：1999-03-17
申请人： Koji Harada , Junichi Nagata , Yasunori Kawakami , Masatoshi Kaneda , Norio Semba , Yoshio Kimura , Masami Akimoto , Yasuhiro Sakamoto , Nobuyuki Jinnai
发明人： Koji Harada , Junichi Nagata , Yasunori Kawakami , Masatoshi Kaneda , Norio Semba , Yoshio Kimura , Masami Akimoto , Yasuhiro Sakamoto , Nobuyuki Jinnai
IPC分类号： G03C500
CPC分类号： H01L21/67253 , H01L21/67109 , H01L21/6715 , H01L21/67248
摘要： A gas supplied from a gas source is exposed to an atmosphere above a liquid surface in a tank saving the liquid and thereafter is supplied around a wafer in a treatment chamber through a gas supply passage and a supply port. The gas supplied around the wafer uniformly flows from around the wafer toward above the center of the wafer and thereafter is discharged from an exhaust port which is formed at the top of the treatment chamber. Meanwhile, with respect to the wafer, heat treatment is performed by a heating mechanism and a predetermined PEB is carried out. The humidified gas is supplied into the treatment chamber, thereby preventing drying in the treatment chamber. Therefore, water in resist is not taken out, resulting in that a required resist pattern can be formed on the wafer.
摘要翻译：从气源供给的气体暴露在储存液体的槽内的液面以上的气氛中，然后通过气体供给通路和供给口在处理室内的晶片供给。在晶片周围供给的气体均匀地从晶片周围朝向晶片的中心方向流动，之后从形成在处理室顶部的排气口排出。同时，相对于晶片，通过加热机构进行热处理，进行规定的PEB。将加湿气体供给到处理室，防止处理室内的干燥。因此，抗蚀剂中的水不会被取出，导致可以在晶片上形成所需的抗蚀剂图案。

4. 再颁专利

USRE37470E1 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：USRE37470E1
公开(公告)日：2001-12-18
申请号：US09388589
申请日：1999-09-02
申请人： Jun Ohkura , Naruaki Iida , Hiroyuki Kudou , Masanori Tateyama , Yasuhiro Sakamoto
发明人： Jun Ohkura , Naruaki Iida , Hiroyuki Kudou , Masanori Tateyama , Yasuhiro Sakamoto
IPC分类号： G03D500
CPC分类号： H01L21/6715 , H01L21/67781 , H01L21/68707
摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.
摘要翻译：晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构，主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中，多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态在握持臂到达相应的一个处理单元之前。

5. 发明授权

US5664254A Substrate processing apparatus and substrate processing method 失效
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US5664254A
公开(公告)日：1997-09-02
申请号：US594937
申请日：1996-01-31
申请人： Jun Ohkura , Naruaki Iida , Hiroyuki Kudou , Masanori Tateyama , Yasuhiro Sakamoto
发明人： Jun Ohkura , Naruaki Iida , Hiroyuki Kudou , Masanori Tateyama , Yasuhiro Sakamoto
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677 , H01L21/687 , G03D5/00 , G03D3/08
CPC分类号： H01L21/6715 , H01L21/67781 , H01L21/68707
摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle .theta. to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.
摘要翻译：晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构，主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中，多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态在握持臂到达相应的一个处理单元之前。

6. 发明授权

US5620560A Method and apparatus for heat-treating substrate 失效
标题翻译：底物热处理方法及装置
公开(公告)号：US5620560A
公开(公告)日：1997-04-15
申请号：US538589
申请日：1995-10-03
申请人： Masami Akimoto , Yasuhiro Sakamoto , Kouji Harada
发明人： Masami Akimoto , Yasuhiro Sakamoto , Kouji Harada
IPC分类号： H01L21/00
CPC分类号： H01L21/67103
摘要： A heat-treating method of heating and cooling a substrate comprising the steps of carrying the wafer into a heat-treating section by a main arm and mounting the wafer on a heating stage, heating the wafer mounted on the heating stage, lifting the wafer thus heated from the heating stage, approaching a cooling holder to the wafer thus lifted to cool the wafer above the heating stage, and carrying the cooled wafer from above the heating stage.
摘要翻译：一种加热和冷却衬底的热处理方法，包括以下步骤：通过主臂将晶片运送到热处理部分中，并将晶片安装在加热台上，加热安装在加热台上的晶片，从而提升晶片从加热台加热，将冷却保持器接近由此提升的晶片，以将晶片冷却到加热台上方，并从加热台上方承载冷却的晶片。

7. 发明授权

US5626675A Resist processing apparatus, substrate processing apparatus and method of transferring a processed article 失效
标题翻译：抗蚀剂处理装置，基板处理装置以及转印加工品的方法
公开(公告)号：US5626675A
公开(公告)日：1997-05-06
申请号：US340758
申请日：1994-11-16
申请人： Yasuhiro Sakamoto , Masami Akimoto , Kiyohisa Tateyama , Shinzi Kitamura
发明人： Yasuhiro Sakamoto , Masami Akimoto , Kiyohisa Tateyama , Shinzi Kitamura
IPC分类号： H01L21/683 , H01L21/687 , B05C13/00
CPC分类号： H01L21/6715 , H01L21/6838 , H01L21/68707 , Y10S134/902 , Y10S414/135
摘要： A substrate processing apparatus has an article transferring unit for transferring articles, and an arm assembly is provided on the transferring unit. Each arm of the arm assembly is provided with pawls for contacting and supporting undersurface portions of the peripheral side wall of each of the articles, and one or more sucking portions are provided on the upper surface of the arm and are disposed above the corresponding pawl or pawls. The pawls, or the sucking portion or sucking portions are selected for every process, and supporting or holding of each of the articles and the required transfer of each of the articles are performed. The transfer can be performed by changing the operating range of each of the arms without replacing the arms. Taking each of the articles in and out of the processing units are carried out smoothly and a series of processes are achieve efficiently.
摘要翻译：基板处理设备具有用于传送物品的物品传送单元，并且在传送单元上设置有臂组件。臂组件的每个臂设置有用于接触和支撑每个制品的周边侧壁的下表面部分的棘爪，并且在臂的上表面上设置一个或多个抽吸部分，并且设置在相应的棘爪或爪子为每个处理选择爪或抽吸部或抽吸部，并且执行每个物品的支撑或保持以及每个物品的所需转移。可以通过改变每个臂的操作范围而不更换臂来执行转移。将每个物品进出处理单元顺利进行，并且有效地实现一系列处理。

8. 发明申请

US20090040269A1 Droplet Applicator 审中-公开
标题翻译：滴液器
公开(公告)号：US20090040269A1
公开(公告)日：2009-02-12
申请号：US12087162
申请日：2005-12-28
申请人： Yoshinori Nakajima , Kaoru Higuchi , Yasuhiro Sakamoto , Sigemi Asai
发明人： Yoshinori Nakajima , Kaoru Higuchi , Yasuhiro Sakamoto , Sigemi Asai
IPC分类号： B41J23/00
CPC分类号： B41J3/28 , B41J2/155 , B41J2/16588 , B41J3/543 , B41J19/20 , B41J2202/20
摘要： A droplet applicator (1) includes a conveying stage (11) and beams (12). The conveying stage (11) holds a substrate (50) and can reciprocate in second directions, in which the substrate is conveyed. The beams (12) are substantially parallel to first directions perpendicular to the second directions. Each beam (12) is fitted with droplet discharge units (2), which face the substrate (50). Each droplet discharge unit (2) can be moved independently in the first directions within a range of movability by a slider (20).
摘要翻译：液滴施加器（1）包括输送台（11）和梁（12）。输送台（11）保持基板（50）并且能够在其中输送基板的第二方向上往复运动。梁（12）基本上平行于垂直于第二方向的第一方向。每个梁（12）装配有面向衬底（50）的液滴喷射单元（2）。每个液滴喷射单元（2）可以通过滑块（20）在可移动的范围内在第一方向上独立地移动。

9. 发明申请

US20060071972A1 Inkjet head, inkjet head module and method of producing the inkjet head 失效
标题翻译：喷墨头，喷墨头组件和喷墨头的制造方法
公开(公告)号：US20060071972A1
公开(公告)日：2006-04-06
申请号：US10520856
申请日：2004-03-10
申请人： Yasuhiro Sakamoto , Tomoyuki Sagara , Shigeaki Kakiwaki , Hirotsugu Matoba
发明人： Yasuhiro Sakamoto , Tomoyuki Sagara , Shigeaki Kakiwaki , Hirotsugu Matoba
IPC分类号： B41J2/04
CPC分类号： B41J2/1632 , B41J2/1609 , B41J2002/14491 , B41J2202/11
摘要： There are provided driving electrodes (25) on walls (24) separating both sides of individual ink chambers (22) formed in the form of an array of multiple grooves. External circuit connecting electrodes (11) for connecting these driving electrodes (25) to an external circuit are formed on exposed surface regions of electrically conductive material (10) filled in the individual ink chambers (22) at a rear end portion of a head. Each of the aforesaid exposed surface regions has an area larger than the cross-sectional area of each ink chamber as measured along a direction perpendicular to the ink chamber array.
摘要翻译：在壁（24）上设置有驱动电极（25），该驱动电极分隔成多个凹槽阵列形式的各个墨水室（22）的两侧。用于将这些驱动电极（25）连接到外部电路的外部电路连接电极（11）形成在头部的后端处填充在各个墨水室（22）中的导电材料（10）的暴露表面区域上。上述暴露表面区域中的每一个具有比沿着垂直于墨室阵列的方向测量的每个墨室的横截面面积的面积。

10. 发明授权

US06565928B2 Film forming method and film forming apparatus 失效
标题翻译：成膜方法和成膜装置
公开(公告)号：US06565928B2
公开(公告)日：2003-05-20
申请号：US09905134
申请日：2001-07-16
申请人： Yasuhiro Sakamoto , Hidetami Yaegashi
发明人： Yasuhiro Sakamoto , Hidetami Yaegashi
IPC分类号： C08F248
CPC分类号： H01L21/6715 , B05D1/005 , B05D3/06
摘要： A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.
摘要翻译：将聚酰亚胺溶液供应到晶片，并通过旋转卡盘旋转晶片，从而在晶片上形成聚酰亚胺膜。提供了用于将激光束照射到晶片W的周边部分的照射器。在形成聚酰亚胺膜并进行侧面冲洗之后，激光束照射到周边部分，以使周边部分处的膜固化。凝固的聚酰亚胺膜形成堰，防止未干燥的聚酰亚胺溶液向周缘部流出。

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