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    • 1. 再颁专利
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • USRE37470E1
    • 2001-12-18
    • US09388589
    • 1999-09-02
    • Jun OhkuraNaruaki IidaHiroyuki KudouMasanori TateyamaYasuhiro Sakamoto
    • Jun OhkuraNaruaki IidaHiroyuki KudouMasanori TateyamaYasuhiro Sakamoto
    • G03D500
    • H01L21/6715H01L21/67781H01L21/68707
    • A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.
    • 晶片处理装置包括在Y轴方向上延伸的公共路径,其中一个晶片或多个晶片被输送,多个处理单元堆叠在公共路径的两侧以构成多级结构, 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片,臂部分布置成在Z轴方向上移动到主处理器中, 多个保持臂,布置在所述臂部中,以构成多个阶段结构,以分别保持晶片,每个保持臂从臂部在XY平面上前进和后退;光学传感器,布置在 臂部,用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器,用于控制主处理器的操作,臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果,其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂,并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。
    • 2. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US5664254A
    • 1997-09-02
    • US594937
    • 1996-01-31
    • Jun OhkuraNaruaki IidaHiroyuki KudouMasanori TateyamaYasuhiro Sakamoto
    • Jun OhkuraNaruaki IidaHiroyuki KudouMasanori TateyamaYasuhiro Sakamoto
    • B65G49/07H01L21/00H01L21/677H01L21/687G03D5/00G03D3/08
    • H01L21/6715H01L21/67781H01L21/68707
    • A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle .theta. to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.
    • 晶片处理装置包括在Y轴方向上延伸的公共路径,其中一个晶片或多个晶片被输送,多个处理单元堆叠在公共路径的两侧以构成多级结构, 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片,臂部分布置成在Z轴方向上移动到主处理器中, 多个保持臂,布置在所述臂部中,以构成多个阶段结构,以分别保持晶片,每个保持臂从臂部在XY平面上前进和后退;光学传感器,布置在 臂部,用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器,用于控制主处理器的操作,臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果,其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂,并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。
    • 4. 发明授权
    • Method for wet etching of thin film
    • 湿法蚀刻薄膜的方法
    • US06096233A
    • 2000-08-01
    • US935837
    • 1997-09-23
    • Hiroki TaniyamaMiyako YamasakaHiroyuki KudouAkira Yonemizu
    • Hiroki TaniyamaMiyako YamasakaHiroyuki KudouAkira Yonemizu
    • H01L21/00H01L21/66H01L21/302
    • H01L21/6708H01L22/26
    • The present invention provides a wet etching method applied to a thin, including the steps of (a) setting in advance an etching rate of said thin film in view of a kind of the thin film to be etched, components of said etchant solution, and temperature, (b) loading the substrate on a spin chuck such that the surface having the thin film formed thereon faces upward and, (c) detecting a thickness of the thin film in at least a peripheral portion and a central portion of the substrate. The method also includes the steps (d) calculating moving speeds of a nozzle at predetermined passing points of said nozzle on the basis of the etching rate set in step (a) and a film thickness detected in the step (c), (e) rotating the substrate by driving the spin chuck, and (f) controlling the moving speed of the nozzle, while allowing the nozzle to supply the etchant solution to the thin film formed on the surface of the substrate which is being rotated, to conform with the moving speeds calculated in step (d) at the predetermined passing points of the nozzle so as to move the nozzle in a radial direction of the substrate.
    • 本发明提供了一种应用于薄的湿式蚀刻方法,包括以下步骤:(a)考虑到要蚀刻的薄膜的种类,所述蚀刻剂溶液的成分和所述蚀刻剂溶液的成分,预先设定所述薄膜的蚀刻速率 温度,(b)将基板装载在旋转卡盘上,使得其上形成有薄膜的表面朝上,(c)在基板的至少周边部分和中心部分检测薄膜的厚度。 该方法还包括步骤(d)基于步骤(a)中设定的蚀刻速率和在步骤(c)中检测到的膜厚度计算喷嘴在预定通过点处的移动速度,(e) 通过驱动旋转卡盘旋转基板,和(f)控制喷嘴的移动速度,同时允许喷嘴将蚀刻剂溶液供应到正在旋转的基板的表面上形成的薄膜,以符合 在步骤(d)中计算出的在喷嘴的预定通过点处的移动速度,以沿着基板的径向方向移动喷嘴。