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1. 发明授权

US6001942A Silicon-containing polyimide resin and silicon-containing polyamic acid 有权
标题翻译：含硅聚酰亚胺树脂和含硅聚酰胺酸
公开(公告)号：US6001942A
公开(公告)日：1999-12-14
申请号：US217075
申请日：1998-12-21
申请人： Masaaki Amako , Haruhiko Furukawa , Yoshitsugu Morita , Hiroshi Ueki
发明人： Masaaki Amako , Haruhiko Furukawa , Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： C08G73/10 , C08G77/455 , C08G77/04
CPC分类号： C08G73/1042 , C08G73/106 , C08G77/455
摘要： The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.
摘要翻译：本发明涉及一种含硅聚酰亚胺树脂，其包含（I）0.1-100摩尔％的由下式表示的结构单元：其中Ar1是具有至少一个芳族环的四价有机基团，R独立地表示一价无烃基团的脂肪族不饱和键，X选自亚烷氧基亚烷基或碳原子数2以上的亚烷基，Y为氧原子，亚烷基氧化烯基或碳原子数2以上的亚烷基，l，m，n分别为整数值为1〜10，p为1〜80的整数，a为0或1; 和（II）99.9至0摩尔％的由下式表示的结构单元：其中Ar 2是具有至少一个芳环的四价有机基团，Ar 3是具有至少一个芳族基团的二价有机基团。

2. 发明授权

US07105614B2 Curable epoxy resin composition 有权
标题翻译：可固化环氧树脂组合物
公开(公告)号：US07105614B2
公开(公告)日：2006-09-12
申请号：US10482323
申请日：2002-06-28
申请人： Yoshitsugu Morita , Hiroshi Ueki , Koji Nakanishi , Haruhiko Furukawa
发明人： Yoshitsugu Morita , Hiroshi Ueki , Koji Nakanishi , Haruhiko Furukawa
IPC分类号： C08L63/00
CPC分类号： C08L61/06 , C08L61/04 , C08L63/00 , C08L83/04 , C08L83/06 , C08L2205/03 , C08L2666/22 , C08L2666/14 , C08L83/00
摘要： A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.
摘要翻译：一种可固化环氧树脂组合物，其至少包含：（A）结晶环氧树脂，（B）酚醛树脂，和（C）由含环氧基的有机基团和苯基构成的有机硅树脂，其定义该组分的平均单元式。对于100重量份的组分（A）和（B）的重量之和，组分（C）的用量为0.1至500重量份。本发明的组合物适用于转印和注射成型，可用作密封电子和电子器件部件的可固化环氧树脂组合物。

3. 发明申请

US20050080204A1 Silicone resin composition, curable resin composition, and curable resin 有权
标题翻译：硅树脂组合物，可固化树脂组合物和可固化树脂
公开(公告)号：US20050080204A1
公开(公告)日：2005-04-14
申请号：US10504338
申请日：2003-02-14
申请人： Haruhiko Furukawa , Koji Nakanishi , Yoshitsugu Morita , Hiroshi Ueki
发明人： Haruhiko Furukawa , Koji Nakanishi , Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： C08G77/14 , C08K5/00 , C08L61/06 , C08L63/00 , C08L83/04 , C08L83/06 , C08L101/00
CPC分类号： C08L61/06 , C08K5/0066 , C08L63/00 , C08L83/04 , C08L83/06 , C08L83/00 , C08L2666/22 , C08L2666/14 , C08L2666/02
摘要： The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.
摘要翻译：本发明涉及一种熔体粘度低，反应性和分散性优异的有机树脂组合物。本发明还涉及一种用于形成固化树脂的固化树脂组合物，其具有优异的成型性和优异的阻燃性能，同时由于不含氧化锑或卤化环氧树脂而对人体和环境几乎没有不利的影响。本发明还涉及对人体或环境几乎没有不利影响且具有优异的阻燃性能的固化树脂。

4. 发明授权

US06660807B2 Additive for organic resin and organic resin composition 有权
公开(公告)号：US06660807B2
公开(公告)日：2003-12-09
申请号：US09999117
申请日：2001-10-31
申请人： Yoshitsugu Morita , Haruhiko Furukawa , Koji Shiromoto , Hiroshi Ueki
发明人： Yoshitsugu Morita , Haruhiko Furukawa , Koji Shiromoto , Hiroshi Ueki
IPC分类号： C08L8305
CPC分类号： C08J3/226 , C08J2483/00 , C08K9/06
摘要： An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt % of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.

5. 发明授权

US5726271A Hydroxyphenyl-containing polyorganosiloxanes 失效
标题翻译：含羟基苯基的聚有机硅氧烷
公开(公告)号：US5726271A
公开(公告)日：1998-03-10
申请号：US755921
申请日：1996-11-25
申请人： Haruhiko Furukawa , Yoshitsugu Morita , Tadashi Okawa , Hiroshi Ueki
发明人： Haruhiko Furukawa , Yoshitsugu Morita , Tadashi Okawa , Hiroshi Ueki
IPC分类号： C08G77/38 , C08G77/12 , C08G77/48 , C08G77/50 , C08G77/26
CPC分类号： C08G77/12 , C08G77/48 , C08G77/50
摘要： The present invention relates to a hydroxyphenyl-functional polyorganosiloxane compound having the formula ##STR1## wherein R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, A is a substituted or unsubstituted hydroxyphenyl group, B is selected from the group consisting of alkyleneoxyalkylene groups having at least two carbon atoms and alkylene groups having at least 2 carbon atoms, m is zero or 1, and n is an integer from 0 to 400. The hydroxyphenyl-functional polyorganosiloxanes of this invention are useful as surfactants or as additives for organic polymers.
摘要翻译：本发明涉及具有下式的羟基苯基官能的聚有机硅氧烷化合物，其中R独立地是不含脂肪族不饱和键的一价烃基，A是取代或未取代的羟基苯基，B选自由以下组成的组中的烷氧基亚烷基：至少两个碳原子和具有至少2个碳原子的亚烷基，m为0或1，n为0至400的整数。本发明的羟基苯基官能聚有机硅氧烷可用作表面活性剂或作为有机聚合物的添加剂。

6. 发明授权

US5654366A Thermoplastic resin composition 失效
标题翻译：热塑性树脂组合物
公开(公告)号：US5654366A
公开(公告)日：1997-08-05
申请号：US604138
申请日：1996-02-20
申请人： Haruhiko Furukawa , Yoshitsugu Morita , Akihiro Nakamura , Hiroshi Ueki
发明人： Haruhiko Furukawa , Yoshitsugu Morita , Akihiro Nakamura , Hiroshi Ueki
IPC分类号： C08L25/12 , C08L55/02 , C08L83/04 , C08L83/10
CPC分类号： C08L55/02 , C08L25/12 , C08L83/04 , C08L83/10 , C08G77/442 , C08G77/452 , C08G77/70
摘要： There is disclosed a thermoplastic resin composition wherein the dispersion of a polyorganosiloxane in a thermoplastic resin is improved by the inclusion of a copolymer of an organosiloxane compound and an ester of a vinylcarboxylic acid or a copolymer of an aromatic vinyl compound, an unsaturated aliphatic nitrile compound and an organosiloxane compound. As a consequence of the excellent dispersion, the composition has improved moldability compared with conventional thermoplastic resins containing only polyorganosiloxane and yields moldings that have a releasability, lubricity, water repellency and mechanical strength superior to moldings from the conventional thermoplastic resins containing only polyorganosiloxane.
摘要翻译：公开了一种热塑性树脂组合物，其中聚有机硅氧烷在热塑性树脂中的分散体通过包含有机硅氧烷化合物和乙烯基羧酸的酯的共聚物或芳族乙烯基化合物，不饱和脂族腈化合物和有机硅氧烷化合物。作为优异分散性的结果，与仅含有聚有机硅氧烷的常规热塑性树脂相比，组合物具有改进的成型性，并且得到具有优于仅含有聚有机硅氧烷的常规热塑性树脂的模制品的脱模性，润滑性，拒水性和机械强度的模制品。

7. 发明授权

US06590032B2 Thermoplastic resin composition and moldings therefrom 有权
标题翻译：热塑性树脂组合物及其成型品
公开(公告)号：US06590032B2
公开(公告)日：2003-07-08
申请号：US09829607
申请日：2001-04-10
申请人： Haruhiko Furukawa , Koji Shiromoto , Hiroshi Ueki , Yoshitsugu Morita
发明人： Haruhiko Furukawa , Koji Shiromoto , Hiroshi Ueki , Yoshitsugu Morita
IPC分类号： C08L8310
CPC分类号： C08L23/10 , C08L23/02 , C08L23/16 , C08L23/30 , C08L25/04 , C08L51/06 , C08L53/00 , C08L77/00 , C08L83/04 , C08L2205/035 , C08L83/00 , C08L2666/02 , C08L2666/24 , C08L2666/14
摘要： A thermoplastic resin composition comprising (A) 100 weight parts thermoplastic resin, (B) 0.1 to 100 weight parts of a mixture of (b-1) thermoplastic resin and (b-2) polyorganosiloxane that has a viscosity at 25° C. of at least 1,000,000 mPa·s, and (C) 0.1 to 100 weight parts polyorganosiloxane-bonded thermoplastic resin in which (c-1) thermoplastic resin and (c-2) polyorganosiloxane are chemically bonded to each other.
摘要翻译：一种热塑性树脂组合物，其包含（A）100重量份热塑性树脂，（B）0.1至100重量份（b-1）热塑性树脂和（b-2）聚有机硅氧烷的混合物，其在25℃下的粘度为（C-1）热塑性树脂和（c-2）聚有机硅氧烷的化学键合的聚有机硅氧烷结合的热塑性树脂为0.1〜100重量份。

8. 发明授权

US06239245B1 Resin additive, curable resin composition, and cured resin 失效
标题翻译：树脂添加剂，可固化树脂组合物和固化树脂
公开(公告)号：US06239245B1
公开(公告)日：2001-05-29
申请号：US09507867
申请日：2000-02-22
申请人： Yoshitsugu Morita , Kazuo Kobayashi , Hiroshi Ueki , Haruhiko Furukawa
发明人： Yoshitsugu Morita , Kazuo Kobayashi , Hiroshi Ueki , Haruhiko Furukawa
IPC分类号： C08G7708
CPC分类号： C08J3/26 , C08J3/12 , C08J2383/04
摘要： There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.
摘要翻译：提供（i）即使在吸收了水分的树脂的情况下也能赋予优异的耐热冲击性的树脂添加剂，（ii）能够形成具有优异的耐热冲击性的固化树脂的固化性树脂组合物，即使在吸收水分后，和（iii）即使在吸收水分后也具有优异的耐热冲击性的固化树脂。树脂添加剂由平均粒径为0.1〜100μm的硅橡胶的粉末构成。在约121℃，两个大气压，相对湿度为100％的温度下处理20小时后，其吸湿率为0.20重量％以下。固化性树脂组合物含有树脂添加剂，固化树脂通过使固化性树脂组合物固化而形成。

9. 发明授权

US6136521A Polycarbonate, and molding and electrophotographic photoreceptor prepared therefrom 有权
标题翻译：聚碳酸酯，以及由其制备的成型和电子照相感光体
公开(公告)号：US6136521A
公开(公告)日：2000-10-24
申请号：US171484
申请日：1998-10-20
申请人： Takaaki Hikosaka , Yasuaki Horikawa , Shuji Sakamoto , Haruhiko Furukawa , Tadashi Okawa , Hiroshi Ueki , Yoshitsugu Morita , Ryuko Manzoji
发明人： Takaaki Hikosaka , Yasuaki Horikawa , Shuji Sakamoto , Haruhiko Furukawa , Tadashi Okawa , Hiroshi Ueki , Yoshitsugu Morita , Ryuko Manzoji
IPC分类号： C08G64/08 , C08G64/18 , C08G77/448 , G03G5/05 , G03G5/147 , G03L1/76 , C08G77/04 , G03G15/04
CPC分类号： G03G5/14786 , C08G64/085 , C08G64/186 , C08G77/448 , G03G5/0564 , G03G5/0578 , G03G5/0589 , G03G5/0592 , G03G5/0596 , G03G5/14756 , G03G5/14773 , G03G5/14791 , G03G5/14795 , Y10S430/106 , Y10S430/109
摘要： A polycarbonate containing repeating units (1) represented by the general formula (1), a polycarbonate molding produced by molding the polycarbonate, and an electrophotographic photoreceptor having a photosensitive layer which has a surface layer containing the polycarbonate: ##STR1## wherein R is an aliphatic unsaturation-free monovalent hydrocarbon group, R.sup.1 is a halogen atom, an alkyl group, an alkoxy group or an aryl group, X is an alkylene group or an alkyleneoxyalkylene group, X' is an alkylene group of 2 or more carbon atoms, an alkyleneoxyalkylene group or oxygen atom, a is an integer of 0 to 4, na is 0 or 1, nb is 1 or 2, nc is 1 or 2, provided na+nb+nc=3, n1, n2, n3 and n4 are 0 or an integer of 1 or more, provided n1+n2+n3+n4 is an integer of 0 to 450.
摘要翻译： PCT No.PCT / JP98 / 00702 Sec。 371日期：1998年10月20日 102（e）1998年10月20日日期PCT提交1998年2月20日PCT公布。第WO98 / 37120号公报日期1998年8月27日含有由通式（1）表示的重复单元（1）的聚碳酸酯，通过模塑聚碳酸酯制备的聚碳酸酯模制品和具有含有聚碳酸酯的表面层的感光层的电子照相感光体：其中R 是不饱和脂肪族的一价烃基，R 1为卤素原子，烷基，烷氧基或芳基，X为亚烷基或亚烷基氧基亚烷基，X'为碳原子数2以上的亚烷基，亚烷基氧基亚烷基或氧原子，a为0〜4的整数，na为0或1，nb为1或2，nc为1或2，条件是na + nb + nc = 3，n1，n2，n3和 n4为0或1以上的整数，只要n1 + n2 + n3 + n4为0〜450的整数即可。

10. 发明授权

US6130019A Binder carrier 有权
标题翻译：粘合剂载体
公开(公告)号：US6130019A
公开(公告)日：2000-10-10
申请号：US201771
申请日：1998-12-01
申请人： Tomoharu Nishikawa , Makoto Kobayashi , Koichi Takenaka , Hideaki Yasunaga , Hiroyuki Fukuda , Haruhiko Furukawa , Hiroshi Ueki , Yoshitsugu Morita
发明人： Tomoharu Nishikawa , Makoto Kobayashi , Koichi Takenaka , Hideaki Yasunaga , Hiroyuki Fukuda , Haruhiko Furukawa , Hiroshi Ueki , Yoshitsugu Morita
IPC分类号： G03G9/107 , G03G9/113 , G03G9/10
CPC分类号： G03G9/1136 , G03G9/107 , G03G9/1133
摘要： The present invention relates to a binder carrier comprising at least magnetic particles and a binder resin. The binder resin contains a thermoplastic silicone-modified acrylic resin which is a copolymer of a polydiorgano-siloxane macromer having an acrylic functional group and a radical-polymerizable organic monomer.The binder carrier of the present invention a long-life binder carrier which eliminates the possibility of carrier deterioration due to toner components, such as a charge-controlling agent and an after-treatment agent, and which is less liable to deteriorate in its chargeability.
摘要翻译：本发明涉及至少包含磁性颗粒和粘合剂树脂的粘合剂载体。粘合剂树脂含有作为具有丙烯酸官能团的聚二有机 - 硅氧烷大单体与可自由基聚合的有机单体的共聚物的热塑性硅氧烷改性丙烯酸树脂。本发明的粘合剂载体是长寿命粘合剂载体，其消除了诸如电荷控制剂和后处理剂之类的调色剂成分导致的载流子劣化的可能性，并且不易于劣化其带电性。

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