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    • 1. 发明授权
    • Resin additive, curable resin composition, and cured resin
    • 树脂添加剂,可固化树脂组合物和固化树脂
    • US06239245B1
    • 2001-05-29
    • US09507867
    • 2000-02-22
    • Yoshitsugu MoritaKazuo KobayashiHiroshi UekiHaruhiko Furukawa
    • Yoshitsugu MoritaKazuo KobayashiHiroshi UekiHaruhiko Furukawa
    • C08G7708
    • C08J3/26C08J3/12C08J2383/04
    • There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.
    • 提供(i)即使在吸收了水分的树脂的情况下也能赋予优异的耐热冲击性的树脂添加剂,(ii)能够形成具有优异的耐热冲击性的固化树脂的固化性树脂组合物,即使在吸收水分后 ,和(iii)即使在吸收水分后也具有优异的耐热冲击性的固化树脂。 树脂添加剂由平均粒径为0.1〜100μm的硅橡胶的粉末构成。 在约121℃,两个大气压,相对湿度为100%的温度下处理20小时后,其吸湿率为0.20重量%以下。 固化性树脂组合物含有树脂添加剂,固化树脂通过使固化性树脂组合物固化而形成。