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    • 6. 发明授权
    • Inspection system and semiconductor device manufacturing method
    • 检测系统和半导体器件制造方法
    • US06775817B2
    • 2004-08-10
    • US10004168
    • 2001-10-30
    • Makoto OnoHisafumi IwataKeiko Kirino
    • Makoto OnoHisafumi IwataKeiko Kirino
    • G06F1750
    • H01L21/67271G01N21/9501G01N21/956H01L22/20
    • A method and system are provided for analyzing defects having the potential to become electrical failures, during the inspection of particles and/or pattern defects of a wafer used in the manufacture of electronic devices such as semiconductor integrated circuits. Defect map data is processed along with failure probability data. Next, defect-dependent failure probability calculations are made to obtain the failure probability of each defect in the defect map data. That data is then used to prepare failure-probability-added defect map data. Further, a selection process of defects to be reviewed is used to reorder and filter defects from the failure-probability-added defect map data, thus selecting one or more defects for review.
    • 提供了一种方法和系统,用于在用于制造诸如半导体集成电路的电子器件的晶片的颗粒和/或图案缺陷的检查期间分析具有变为电气故障的可能性的缺陷。 缺陷图数据与故障概率数据一起处理。 接下来,进行与缺陷相关的故障概率计算,以获得缺陷图数据中的每个缺陷的故障概率。 然后将该数据用于准备故障概率添加缺陷图数据。 此外,使用要检查的缺陷的选择处理用于从故障概率添加缺陷图数据重新排序和过滤缺陷,从而选择一个或多个缺陷以供审查。
    • 7. 发明授权
    • Inspection system, inspection apparatus, inspection program, and production method of semiconductor devices
    • 检测系统,检验仪器,检验程序和半导体器件的生产方法
    • US06687633B2
    • 2004-02-03
    • US10079518
    • 2002-02-22
    • Makoto OnoHisafumi Iwata
    • Makoto OnoHisafumi Iwata
    • G01N3700
    • H01L21/67288
    • In the wafer production process of a semiconductor integrated circuit, an inspection system and an inspection apparatus that convert and output a yield loss at high accuracy from the result of a defect inspection, such as a dark-field inspection and a bright-field inspection without waiting for the result of the final probing test. Defect map data read processing and kill ratio computation data read processing are performed. Subsequently, kill ratio computation processing every defect computes a kill ratio every defect using defect map data and kill ratio computation data. Subsequently, kill ratio computation processing every chip computes a kill ratio every LSI chip using the kill ratio every defect. Subsequently, yield loss computation processing computes a yield loss of the defect map data using the kill ratio every chip and yield loss output processing outputs the computation result.
    • 在半导体集成电路的晶片生产过程中,检查系统和检查装置从缺陷检查的结果(例如暗场检查和明场检查)转换并输出高精度的屈服损失而没有 等待最终探测测试的结果。 执行缺陷地图数据读取处理和杀死比计算数据读取处理。 随后,每个缺陷的杀伤比计算处理使用缺陷图数据和杀死比计算数据计算每个缺陷的杀伤比。 随后,每个芯片的杀死率计算处理使用每个缺陷的杀死率来计算每个LSI芯片的杀死率。 随后,屈服损失计算处理使用每个芯片的杀死率来计算缺陷图数据的屈服损失,并且屈服损失输出处理输出计算结果。
    • 9. 发明授权
    • Testing methods for magnetic heads and magnetic storage devices assembled with the magnetic heads
    • 用磁头组装的磁头和磁存储装置的测试方法
    • US08552716B2
    • 2013-10-08
    • US12963551
    • 2010-12-08
    • Fumiomi UedaMakoto Ono
    • Fumiomi UedaMakoto Ono
    • G01R33/12
    • G11B5/455
    • In one embodiment, a manufacturing method for magnetic heads includes classifying magnetic heads into one of: a first tested head class, and a non-test-candidate head class, determining characteristic values of the magnetic heads classified in the first tested head class, estimating characteristic values of the magnetic heads classified in the non-test-candidate head class, wherein the estimating is based on the characteristic values of the magnetic heads classified in the first tested head class, classifying each of the magnetic heads classified in the non-test-candidate head class into one of: a second tested head class, and a non-test head class based on the estimated characteristic values, determining characteristic values of the magnetic heads classified in the second tested head class, and screening magnetic heads in the second tested head class based on the determined characteristic values of the magnetic heads classified in the second tested head class.
    • 在一个实施例中,一种用于磁头的制造方法包括将磁头分类成以下之一:第一测试头类和非测试候选头类,确定分类在第一测试头类中的磁头的特征值,估计 分类在非测试候选头类中的磁头的特征值,其中估计基于分类在第一测试头类中的磁头的特征值,将分类在非测试中的每个磁头分类 根据估计的特征值,确定分类在第二测试头类别中的磁头的特征值,以及在第二测试头类别中筛选磁头,将头等级分为以下之一:第二测试头类和非测试头类 基于分类在第二测试头类中的磁头的确定的特征值来测试头等级。