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    • 2. 发明授权
    • Silicon-containing composition for formation of resist underlayer film, which contains organic group containing protected aliphatic alcohol
    • 用于形成抗蚀剂下层膜的含硅组合物,其含有含有保护的脂族醇的有机基团
    • US09196484B2
    • 2015-11-24
    • US13825158
    • 2011-09-14
    • Satoshi TakedaMakoto NakajimaYuta Kanno
    • Satoshi TakedaMakoto NakajimaYuta Kanno
    • H01L21/311H01L21/033G03F7/075G03F7/09C09D183/04C08G77/14C08G77/16
    • H01L21/0332C08G77/14C08G77/16C09D183/04G03F7/0752G03F7/091G03F7/094
    • Described herein are compositions for forming an underlayer film for a solvent-developable resist. These compositions can include a hydrolyzable organosilane having a silicon atom bonded to an organic group containing a protected aliphatic alcohol group, a hydrolysate of the hydrolyzable organosilane, a hydrolysis-condensation product of the hydrolyzable organosilane, or a combination thereof and a solvent. The composition can form a resist underlayer film including, a hydrolyzable organosilane, a hydrolysate of the hydrolyzable organosilane, a hydrolysis-condensation product of the hydrolyzable organosilane, or a combination thereof, the silicon atom in the silane compound having a silicon atom bonded to an organic group containing a protected aliphatic alcohol group in a ratio of 0.1 to 40% by mol based on the total amount of silicon atoms. Also described is a method for applying the composition onto a semiconductor substrate and baking the composition to form a resist underlayer film.
    • 本文描述了用于形成用于溶剂可显影抗蚀剂的下层膜的组合物。 这些组合物可以包括具有与含有保护的脂族醇基的有机基团键合的硅原子的水解性有机硅烷,可水解的有机硅烷的水解产物,可水解的有机硅烷的水解缩合产物,或其组合和溶剂。 该组合物可以形成抗蚀剂下层膜,该抗蚀剂下层膜包括可水解的有机硅烷,可水解的有机硅烷的水解产物,可水解的有机硅烷的水解缩合产物或其组合,硅烷化合物中硅原子与硅原子键合的硅原子 相对于硅原子总量,含有保护的脂族醇基的有机基团的比例为0.1〜40摩尔%。 还描述了将组合物施加到半导体衬底上并烘烤该组合物以形成抗蚀剂下层膜的方法。