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    • 3. 发明申请
    • SILICON-CONTAINING COMPOSITION FOR FORMATION OF RESIST UNDERLAYER FILM, WHICH CONTAINS ORGANIC GROUP CONTAINING PROTECTED ALIPHATIC ALCOHOL
    • 用于形成耐下层膜的含硅组合物,其中含有保护的脂肪醇的有机基团
    • US20130183830A1
    • 2013-07-18
    • US13825158
    • 2011-09-14
    • Satoshi TakedaMakoto NakajimaYuta Kanno
    • Satoshi TakedaMakoto NakajimaYuta Kanno
    • H01L21/033
    • H01L21/0332C08G77/14C08G77/16C09D183/04G03F7/0752G03F7/091G03F7/094
    • Described herein are compositions for forming an underlayer film for a solvent-developable resist. These compositions can include a hydrolyzable organosilane having a silicon atom bonded to an organic group containing a protected aliphatic alcohol group, a hydrolysate of the hydrolyzable organosilane, a hydrolysis-condensation product of the hydrolyzable organosilane, or a combination thereof and a solvent. The composition can form a resist underlayer film including, a hydrolyzable organosilane, a hydrolysate of the hydrolyzable organosilane, a hydrolysis-condensation product of the hydrolyzable organosilane, or a combination thereof, the silicon atom in the silane compound having a silicon atom bonded to an organic group containing a protected aliphatic alcohol group in a ratio of 0.1 to 40% by mol based on the total amount of silicon atoms. Also described is a method for applying the composition onto a semiconductor substrate and baking the composition to form a resist underlayer film.
    • 本文描述了用于形成用于溶剂可显影抗蚀剂的下层膜的组合物。 这些组合物可以包括具有与含有保护的脂族醇基的有机基团键合的硅原子的水解性有机硅烷,可水解的有机硅烷的水解产物,可水解的有机硅烷的水解缩合产物,或其组合和溶剂。 该组合物可以形成抗蚀剂下层膜,该抗蚀剂下层膜包括可水解的有机硅烷,可水解的有机硅烷的水解产物,可水解的有机硅烷的水解缩合产物或其组合,硅烷化合物中硅原子与硅原子键合的硅原子 相对于硅原子总量,含有保护的脂族醇基的有机基团的比例为0.1〜40摩尔%。 还描述了将组合物施加到半导体衬底上并烘烤该组合物以形成抗蚀剂下层膜的方法。
    • 8. 发明授权
    • Resist underlayer film forming composition containing silicone having onium group
    • 含有具有鎓基的硅氧烷的抗蚀剂下层膜成膜组合物
    • US08864894B2
    • 2014-10-21
    • US13058109
    • 2009-08-13
    • Wataru ShibayamaMakoto NakajimaYuta Kanno
    • Wataru ShibayamaMakoto NakajimaYuta Kanno
    • C09D183/08C09D5/00G03F7/075G03F7/004G03F7/095C08G77/26
    • G03F7/0755C08G77/26C09D5/006C09D183/08G03F7/0045G03F7/0757G03F7/095Y10T428/31663
    • There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hard mask or a bottom anti-reflective coating, or a resist underlayer film causing no intermixing with a resist and having a dry etching rate higher than that of the resist. A film forming composition comprising a silane compound having an onium group, wherein the silane compound having an onium group is a hydrolyzable organosilane having, in a molecule thereof, an onium group, a hydrolysis product thereof, or a hydrolysis-condensation product thereof. The composition uses as a resist underlayer film forming composition for lithography. A composition comprising a silane compound having an onium group, and a silane compound having no onium group, wherein the silane compound having an onium group exists in the whole silane compound at a ratio of less than 1% by mol, for example 0.01 to 0.95% by mol. The hydrolyzable organosilane may be a compound of Formula: R1aR2bSi(R3)4−(a+b). A resist underlayer film obtained by applying the composition as claimed in any one of claims 1 to 14 onto a semiconductor substrate and by baking the composition.
    • 提供了用于形成抗蚀剂下层膜的光刻用抗蚀剂下层膜形成用组合物,能够用作硬掩模或底部抗反射涂层,或者不与抗蚀剂混合并具有干蚀刻速率的抗蚀剂下层膜 高于抗蚀剂。 一种包含具有鎓基的硅烷化合物的成膜组合物,其中具有鎓基的硅烷化合物是其分子中具有鎓基,其水解产物或其水解缩合产物的可水解的有机硅烷。 该组合物用作光刻的抗蚀剂下层膜形成组合物。 包含具有鎓基的硅烷化合物和不具有鎓基的硅烷化合物的组合物,其中具有鎓基的硅烷化合物以小于1摩尔%的比例存在于全部硅烷化合物中,例如0.01至0.95 %摩尔。 可水解的有机硅烷可以是式:R1aR2bSi(R3)4-(a + b)的化合物。 14.一种抗蚀剂下层膜,其通过将权利要求1〜14中任一项所述的组合物涂布在半导体基板上,并烘烤该组合物而得到。
    • 9. 发明申请
    • THIN FILM FORMING COMPOSITION FOR LITHOGRAPHY CONTAINING TITANIUM AND SILICON
    • 含有钛和硅的薄膜的薄膜成膜组合物
    • US20140120730A1
    • 2014-05-01
    • US14131945
    • 2012-07-20
    • Makoto NakajimaYuta KannoSatoshi TakedaYasushi SakaidaShuhei Shigaki
    • Makoto NakajimaYuta KannoSatoshi TakedaYasushi SakaidaShuhei Shigaki
    • H01L21/033H01L21/311
    • H01L21/0332G03F7/0752G03F7/091G03F7/094G03F7/40H01L21/31111H01L21/31138
    • A thin film forming composition for forming resist underlayer film useable in the production of a semiconductor device, and a resist upper layer film absorbs undesirable UV light with a thin film as an upper layer of the EUV resist before undesirable UV light reaches the EUV resist layer in EUV lithography, an underlayer film (hardmask) for an EUV resist, a reverse material, and an underlayer film for a resist for solvent development. The thin film forming composition useable together with a resist in a lithography process, comprising a mixture of titanium compound (A) selected from: R0aTi(R1)(4−a)  Formula (1) a titanium chelate compound, and a hydrolyzable titanium dimer, and a silicon compound (B): R2a′R3bSi(R4)4−(a′+b)  Formula (2) a hydrolysis product, or a hydrolysis-condensation product of the mixture, wherein the number of moles of Ti atom is 50% to 90% relative to the total moles in terms of Ti atom and Si atoms in the composition.
    • 用于形成用于制造半导体器件的抗蚀剂下层膜的薄膜形成组合物,并且抗蚀剂上层膜在不期望的UV光到达EUV抗蚀剂层之前吸收作为EUV抗蚀剂的上层的薄膜的不期望的UV光 在EUV光刻中,用于EUV抗蚀剂的底层膜(硬掩模),反向材料以及用于溶剂显影用抗蚀剂的下层膜。 该薄膜形成组合物与平版印刷工艺中的抗蚀剂一起使用,包括钛化合物(A)的混合物,其选自:R a Ti(R 1)(4-a)式(1)钛螯合化合物和可水解的钛二聚体 ,和硅化合物(B):R2a'R3bSi(R4)4-(a'+ b)式(2)水解产物或混合物的水解缩合产物,其中Ti原子的摩尔数为 相对于组合物中Ti原子和Si原子的总摩尔数为50〜90%。