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    • 2. 发明申请
    • METHOD FOR MANUFACTURING CIRCUIT MODULES AND CIRCUIT MODULE
    • 制造电路模块和电路模块的方法
    • US20080210462A1
    • 2008-09-04
    • US12107163
    • 2008-04-22
    • Makoto KawagishiTsutomu Ieki
    • Makoto KawagishiTsutomu Ieki
    • H05K9/00H05K3/30
    • H05K1/0218H01L21/561H01L23/3121H01L23/49822H01L23/49827H01L23/49833H01L23/552H01L24/97H01L25/0657H01L25/162H01L25/165H01L2225/06541H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01029H01L2924/01033H01L2924/01074H01L2924/01078H01L2924/014H01L2924/19041H01L2924/19043H01L2924/3025H05K3/0052H05K3/284H05K3/403H05K3/429Y10T29/49146
    • A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
    • 准备由集合基板限定的模块基板,并且将电路部件安装在模块基板上。 绝缘树脂层形成在模块基板的大致整个上表面上,使得电路部件设置在绝缘树脂层中,并且在绝缘树脂层的顶表面上形成顶表面屏蔽层。 在模块基板和绝缘树脂层中,在对应于小基板的边界部分的位置处形成第一通孔,以在模块基板和绝缘树脂层的厚度方向上延伸。 第一电极膜形成在第一通孔的内表面上,以连接到第一屏蔽层,并且第一通孔填充有填充材料。 接下来,在与小基板的边界线的剩余部分对应的位置处,在厚度方向上延伸形成第二通孔,并且在第二通孔的内表面上形成第二电极膜,以便连接 到顶表面屏蔽层和第一电极膜。 沿着小基板的边界线切割填充第一通孔的填充材料,从而将集合基板划分成小的基板以获得电路模块。
    • 3. 发明授权
    • Method for manufacturing circuit modules and circuit module
    • 电路模块和电路模块的制造方法
    • US07488903B2
    • 2009-02-10
    • US12107163
    • 2008-04-22
    • Makoto KawagishiTsutomu Ieki
    • Makoto KawagishiTsutomu Ieki
    • H05K9/00
    • H05K1/0218H01L21/561H01L23/3121H01L23/49822H01L23/49827H01L23/49833H01L23/552H01L24/97H01L25/0657H01L25/162H01L25/165H01L2225/06541H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01029H01L2924/01033H01L2924/01074H01L2924/01078H01L2924/014H01L2924/19041H01L2924/19043H01L2924/3025H05K3/0052H05K3/284H05K3/403H05K3/429Y10T29/49146
    • A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
    • 准备由集合基板限定的模块基板,并且将电路部件安装在模块基板上。 绝缘树脂层形成在模块基板的大致整个上表面上,使得电路部件设置在绝缘树脂层中,并且在绝缘树脂层的顶表面上形成顶表面屏蔽层。 在模块基板和绝缘树脂层中,在对应于小基板的边界部分的位置处形成第一通孔,以在模块基板和绝缘树脂层的厚度方向上延伸。 第一电极膜形成在第一通孔的内表面上,以连接到第一屏蔽层,并且第一通孔填充有填充材料。 接下来,在与小基板的边界线的剩余部分相对应的位置处,在厚度方向上延伸形成第二通孔,并且在第二通孔的内表面上形成第二电极膜,以便连接 到顶表面屏蔽层和第一电极膜。 沿着小基板的边界线切割填充第一通孔的填充材料,从而将集合基板划分成小的基板以获得电路模块。
    • 7. 发明授权
    • Transceiver and radio frequency identification tag reader
    • 收发器和射频识别标签读卡器
    • US09460320B2
    • 2016-10-04
    • US13437978
    • 2012-04-03
    • Tsutomu IekiKen SakaiNoboru KatoKoji Shiroki
    • Tsutomu IekiKen SakaiNoboru KatoKoji Shiroki
    • H04B1/38G06K7/00G06K7/10H01Q1/22H01Q25/00
    • G06K7/0008G06K7/10316H01Q1/2283H01Q25/001
    • In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.
    • 在收发器中,在矩形板状基板的顶表面上,设置有传输辐射元件和接收辐射元件。 透射辐射元件从基板的中心沿水平或横向方向延伸。 接收辐射元件从基板的中心在垂直或纵向方向上延伸。 包含在匹配馈送元件中的电感器单独地电磁耦合到作为接收辐射元件的内端部的发送辐射元件和接收侧馈电点的内端部的发送侧馈电点。 发送信号以水平方向或横向偏振的波发送,并且接收具有垂直或纵向偏振方向的信号。
    • 8. 发明授权
    • Oscillator module and communications device using the same
    • 振荡器模块和通信设备使用相同
    • US06232846B1
    • 2001-05-15
    • US09329825
    • 1999-06-10
    • Yasuhiko HiranoTsutomu IekiHiroaki Tanaka
    • Yasuhiko HiranoTsutomu IekiHiroaki Tanaka
    • H03B530
    • G01R31/2824G07C9/00182G07C2009/00793H03B5/326H03B5/362H03B5/364
    • An oscillator module in which external wires can be reduced, and characteristics of a resonator and oscillation margin can be measured. A circuit portion for oscillation and a two-port surface acoustic wave resonator are sealed in a package, one of the terminals of the two-port surface acoustic wave resonator is connected inside the package to an input terminal of the circuit portion for oscillation. The number of external terminals provided at the package is reduced, enabling the oscillator module to be made small-scale and at lower cost. Furthermore, it is possible to measure the insertion loss and resonant frequency of the two-port surface acoustic wave resonator, and the oscillation margin of the oscillator module, making it possible to improve the yield of the oscillator and reduce costs.
    • 可以减少外部电线的振荡器模块,并且可以测量谐振器的特性和振荡裕度。 用于振荡的电路部分和双端口声表面波谐振器被密封在封装中,两端口声表面波谐振器的端子之一连接在封装内部到用于振荡的电路部分的输入端。 减少了封装中提供的外部端子的数量,使得振荡器模块能够以较小的成本进行制造。 此外,可以测量双端口声表面波谐振器的插入损耗和谐振频率以及振荡器模块的振荡裕度,使得可以提高振荡器的产量并降低成本。