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1. 发明申请

US20080210462A1 METHOD FOR MANUFACTURING CIRCUIT MODULES AND CIRCUIT MODULE 有权
标题翻译：制造电路模块和电路模块的方法
公开(公告)号：US20080210462A1
公开(公告)日：2008-09-04
申请号：US12107163
申请日：2008-04-22
申请人： Makoto Kawagishi , Tsutomu Ieki
发明人： Makoto Kawagishi , Tsutomu Ieki
IPC分类号： H05K9/00 , H05K3/30
CPC分类号： H05K1/0218 , H01L21/561 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/552 , H01L24/97 , H01L25/0657 , H01L25/162 , H01L25/165 , H01L2225/06541 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H05K3/0052 , H05K3/284 , H05K3/403 , H05K3/429 , Y10T29/49146
摘要： A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
摘要翻译：准备由集合基板限定的模块基板，并且将电路部件安装在模块基板上。绝缘树脂层形成在模块基板的大致整个上表面上，使得电路部件设置在绝缘树脂层中，并且在绝缘树脂层的顶表面上形成顶表面屏蔽层。在模块基板和绝缘树脂层中，在对应于小基板的边界部分的位置处形成第一通孔，以在模块基板和绝缘树脂层的厚度方向上延伸。第一电极膜形成在第一通孔的内表面上，以连接到第一屏蔽层，并且第一通孔填充有填充材料。接下来，在与小基板的边界线的剩余部分对应的位置处，在厚度方向上延伸形成第二通孔，并且在第二通孔的内表面上形成第二电极膜，以便连接到顶表面屏蔽层和第一电极膜。沿着小基板的边界线切割填充第一通孔的填充材料，从而将集合基板划分成小的基板以获得电路模块。

2. 发明授权

US06798320B2 Microstrip line having a line electrode with integral edge electrodes 有权
标题翻译：微带线具有具有整体边缘电极的线电极
公开(公告)号：US06798320B2
公开(公告)日：2004-09-28
申请号：US10059623
申请日：2002-01-29
申请人： Yutaka Ida , Yoshikazu Yagi , Tsutomu Ieki , Hiroaki Tanaka , Osamu Chikagawa
发明人： Yutaka Ida , Yoshikazu Yagi , Tsutomu Ieki , Hiroaki Tanaka , Osamu Chikagawa
IPC分类号： H01P308
CPC分类号： H01P3/081 , H01P1/20363 , H01P1/20381 , H01P3/088 , H01P7/082 , H01P11/003 , H05K1/0237 , H05K1/0242 , H05K1/162 , H05K3/107 , H05K3/4092 , H05K2201/037 , H05K2201/09036 , H05K2201/098 , H05K2201/09981
摘要： A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.
摘要翻译：微带线包括带状导体，线电极和设置在线电极两侧边缘的边缘电极。微带线的结构大大降低了线电极的边缘效应，并降低了线电极的导体损耗。

3. 发明授权

US08072769B2 Component-embedded module and manufacturing method thereof 有权
标题翻译：组件嵌入式模块及其制造方法
公开(公告)号：US08072769B2
公开(公告)日：2011-12-06
申请号：US12579617
申请日：2009-10-15
申请人： Tsutomu Ieki , Kazuyuki Yuda
发明人： Tsutomu Ieki , Kazuyuki Yuda
IPC分类号： H05K1/18
CPC分类号： H05K1/141 , H01L23/552 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15192 , H01L2924/15313 , H01L2924/19105 , H05K1/0218 , H05K1/183 , H05K1/187 , H05K3/007 , H05K3/20 , H05K3/284 , H05K3/303 , H05K3/46 , H05K3/4694 , H05K3/4697 , H05K2201/0715 , H05K2201/0979 , H05K2201/09972 , H05K2203/016 , H05K2203/167 , Y10T29/4913 , H01L2224/0401
摘要： A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.
摘要翻译：组件嵌入式模块包括在其上表面上具有布线电极的模块基板，安装在布线电极上的第一电路部件，设置在不设有布线电极的区域上的子模块以及设置在其上的绝缘树脂层基本上整个模块基板的上表面，使得绝缘树脂层覆盖第一电路部件和子模块的至少一部分。包括集成电路元件的第二电路部件安装在子模块上或嵌入其中。通孔导体通过模块基板从其下表面提供，并且直接耦合到子模块的下表面上的端子电极。通过使用具有比模块基板的布线精度更高的布线的基板，获得了可靠的部件嵌入式模块。

4. 发明授权

US07488903B2 Method for manufacturing circuit modules and circuit module 有权
标题翻译：电路模块和电路模块的制造方法
公开(公告)号：US07488903B2
公开(公告)日：2009-02-10
申请号：US12107163
申请日：2008-04-22
申请人： Makoto Kawagishi , Tsutomu Ieki
发明人： Makoto Kawagishi , Tsutomu Ieki
IPC分类号： H05K9/00
CPC分类号： H05K1/0218 , H01L21/561 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/552 , H01L24/97 , H01L25/0657 , H01L25/162 , H01L25/165 , H01L2225/06541 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H05K3/0052 , H05K3/284 , H05K3/403 , H05K3/429 , Y10T29/49146
摘要： A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
摘要翻译：准备由集合基板限定的模块基板，并且将电路部件安装在模块基板上。绝缘树脂层形成在模块基板的大致整个上表面上，使得电路部件设置在绝缘树脂层中，并且在绝缘树脂层的顶表面上形成顶表面屏蔽层。在模块基板和绝缘树脂层中，在对应于小基板的边界部分的位置处形成第一通孔，以在模块基板和绝缘树脂层的厚度方向上延伸。第一电极膜形成在第一通孔的内表面上，以连接到第一屏蔽层，并且第一通孔填充有填充材料。接下来，在与小基板的边界线的剩余部分相对应的位置处，在厚度方向上延伸形成第二通孔，并且在第二通孔的内表面上形成第二电极膜，以便连接到顶表面屏蔽层和第一电极膜。沿着小基板的边界线切割填充第一通孔的填充材料，从而将集合基板划分成小的基板以获得电路模块。

5. 发明申请

US20070170582A1 COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：包含组件的模块及其制造方法
公开(公告)号：US20070170582A1
公开(公告)日：2007-07-26
申请号：US11696919
申请日：2007-04-05
申请人： Masato NOMURA , Tsutomu IEKI
发明人： Masato NOMURA , Tsutomu IEKI
IPC分类号： H01L23/34
CPC分类号： H05K1/141 , H01L23/552 , H01L2224/16225 , H01L2924/19105 , H05K1/0218 , H05K1/144 , H05K1/181 , H05K1/183 , H05K3/20 , H05K3/284 , H05K3/3442 , H05K2201/045 , Y02P70/611
摘要： A component-containing module includes a module substrate having first wiring lines provided on the top surface of the module substrate, a first circuit component mounted on the first wiring lines of the module substrate, a submodule substrate having an area smaller than the area of the module substrate and mounted on the first wiring lines of the module substrate at a position at which the first circuit component is not mounted, a second circuit component mounted on second wiring lines provided on the top surface of the submodule substrate, and an insulating resin layer provided on the entire top surface of the module substrate so as to encompass the first circuit component, the second circuit component, and the submodule substrate.
摘要翻译：含有元件的模块包括：模块基板，其具有设置在模块基板的上表面上的第一布线;安装在模块基板的第一布线上的第一电路部件;具有小于模块基板，并且在未安装第一电路部件的位置处安装在模块基板的第一布线上，安装在设置在子模块基板的顶表面上的第二布线上的第二电路部件和绝缘树脂层设置在模块基板的整个顶表面上，以便包围第一电路部件，第二电路部件和子模块基板。

6. 发明授权

US5532654A FSK modulator using saw resonator with switchable capacitors 失效
标题翻译： FSK调制器采用带可切换电容器的锯片谐振器
公开(公告)号：US5532654A
公开(公告)日：1996-07-02
申请号：US457284
申请日：1995-06-01
申请人： Tsutomu Ieki , Yasuhiko Hirano
发明人： Tsutomu Ieki , Yasuhiko Hirano
IPC分类号： H03B5/30 , H04L27/12
CPC分类号： H04L27/12
摘要： An FSK modulator including an amplifier for oscillation has a surface acoustic wave resonator connected in series with a switching circuit formed without a variable-capacity diode but including a semiconductor switch and one or more fixed-capacity capacitors. When an input signal is received, the switch causes a capacitor or combination of capacitors to become connected in series with the surface acoustic wave resonator, providing oscillations with two frequencies to effect FSK modulation.
摘要翻译：包括用于振荡的放大器的FSK调制器具有与不具有可变容量二极管形成但包括半导体开关和一个或多个固定容量电容器的开关电路串联连接的表面声波谐振器。当接收到输入信号时，开关使电容器或电容器的组合与声表面波谐振器串联，提供具有两个频率的振荡来实现FSK调制。

7. 发明申请

US20080149381A1 METHOD FOR MANUFACTURING COMPONENT INCORPORATING MODULE AND COMPONENT INCORPORATING MODULE 有权
标题翻译：制造组件组件和组件组合模块的方法
公开(公告)号：US20080149381A1
公开(公告)日：2008-06-26
申请号：US12041730
申请日：2008-03-04
申请人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
发明人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/187 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/16238 , H01L2224/24195 , H01L2924/15192 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4644 , H05K2201/0715 , H05K2201/096 , H01L2924/00012
摘要： In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the transfer plate, and is hardened. The circuit components and the lands for mounting components are embedded in the upper resin layer. Thereafter, the transfer plate is removed from the resin layer, and wiring patterns which are used to connect between lands or connect lands to other portions are formed on a back surface of the resin layer on which the lands for mounting components are exposed.
摘要翻译：在用于制造组件组合模块的方法中，用于安装部件的焊盘独立地形成在转印板上，并且电路部件连接到用于安装部件的焊盘。形成绝缘树脂层，以覆盖转印板上的电路元件，并被硬化。电路部件和用于安装部件的焊盘嵌入在上树脂层中。此后，从树脂层除去转印板，并且在用于安装部件的焊盘露出的树脂层的背面上形成用于将焊盘或连接焊盘连接到其它部分的布线图案。

8. 发明授权

US09460320B2 Transceiver and radio frequency identification tag reader 有权
标题翻译：收发器和射频识别标签读卡器
公开(公告)号：US09460320B2
公开(公告)日：2016-10-04
申请号：US13437978
申请日：2012-04-03
申请人： Tsutomu Ieki , Ken Sakai , Noboru Kato , Koji Shiroki
发明人： Tsutomu Ieki , Ken Sakai , Noboru Kato , Koji Shiroki
IPC分类号： H04B1/38 , G06K7/00 , G06K7/10 , H01Q1/22 , H01Q25/00
CPC分类号： G06K7/0008 , G06K7/10316 , H01Q1/2283 , H01Q25/001
摘要： In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.
摘要翻译：在收发器中，在矩形板状基板的顶表面上，设置有传输辐射元件和接收辐射元件。透射辐射元件从基板的中心沿水平或横向方向延伸。接收辐射元件从基板的中心在垂直或纵向方向上延伸。包含在匹配馈送元件中的电感器单独地电磁耦合到作为接收辐射元件的内端部的发送辐射元件和接收侧馈电点的内端部的发送侧馈电点。发送信号以水平方向或横向偏振的波发送，并且接收具有垂直或纵向偏振方向的信号。

9. 发明申请

US20120190310A1 TRANSCEIVER AND RADIO FREQUENCY IDENTIFICATION TAG READER 有权
标题翻译：收发器和无线电频率识别标签读取器
公开(公告)号：US20120190310A1
公开(公告)日：2012-07-26
申请号：US13437978
申请日：2012-04-03
申请人： Tsutomu IEKI , Ken SAKAI , Noboru KATO , Koji SHIROKI
发明人： Tsutomu IEKI , Ken SAKAI , Noboru KATO , Koji SHIROKI
IPC分类号： H04B1/38
CPC分类号： G06K7/0008 , G06K7/10316 , H01Q1/2283 , H01Q25/001
摘要： In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.
摘要翻译：在收发器中，在矩形板状基板的顶表面上，设置有传输辐射元件和接收辐射元件。透射辐射元件从基板的中心沿水平或横向方向延伸。接收辐射元件从基板的中心在垂直或纵向方向上延伸。包含在匹配馈送元件中的电感器单独地电磁耦合到作为接收辐射元件的内端部的发送辐射元件和接收侧馈电点的内端部的发送侧馈电点。发送信号以水平方向或横向偏振的波发送，并且接收具有垂直或纵向偏振方向的信号。

10. 发明授权

US06232846B1 Oscillator module and communications device using the same 失效
标题翻译：振荡器模块和通信设备使用相同
公开(公告)号：US06232846B1
公开(公告)日：2001-05-15
申请号：US09329825
申请日：1999-06-10
申请人： Yasuhiko Hirano , Tsutomu Ieki , Hiroaki Tanaka
发明人： Yasuhiko Hirano , Tsutomu Ieki , Hiroaki Tanaka
IPC分类号： H03B530
CPC分类号： G01R31/2824 , G07C9/00182 , G07C2009/00793 , H03B5/326 , H03B5/362 , H03B5/364
摘要： An oscillator module in which external wires can be reduced, and characteristics of a resonator and oscillation margin can be measured. A circuit portion for oscillation and a two-port surface acoustic wave resonator are sealed in a package, one of the terminals of the two-port surface acoustic wave resonator is connected inside the package to an input terminal of the circuit portion for oscillation. The number of external terminals provided at the package is reduced, enabling the oscillator module to be made small-scale and at lower cost. Furthermore, it is possible to measure the insertion loss and resonant frequency of the two-port surface acoustic wave resonator, and the oscillation margin of the oscillator module, making it possible to improve the yield of the oscillator and reduce costs.
摘要翻译：可以减少外部电线的振荡器模块，并且可以测量谐振器的特性和振荡裕度。用于振荡的电路部分和双端口声表面波谐振器被密封在封装中，两端口声表面波谐振器的端子之一连接在封装内部到用于振荡的电路部分的输入端。减少了封装中提供的外部端子的数量，使得振荡器模块能够以较小的成本进行制造。此外，可以测量双端口声表面波谐振器的插入损耗和谐振频率以及振荡器模块的振荡裕度，使得可以提高振荡器的产量并降低成本。

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