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1. 发明授权

US08339797B2 Package substrate 有权
标题翻译：封装衬底
公开(公告)号：US08339797B2
公开(公告)日：2012-12-25
申请号：US12722607
申请日：2010-03-12
申请人： Atsuyoshi Maeda , Shingo Ito , Satoru Noda
发明人： Atsuyoshi Maeda , Shingo Ito , Satoru Noda
IPC分类号： H05K1/18
CPC分类号： H05K7/026 , H01G4/232 , H01G4/40 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5389 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15159 , H01L2924/15311 , H01L2924/19106 , H01L2224/05599 , H01L2224/05099
摘要： A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.
摘要翻译：封装基板包括：主封装主体，包括安装有IC的第一主表面;以及与第一主表面相对的第二主表面，在其上设置用于安装的第一粘合材料。内部电路设置在主包装体内并连接到第一接合材料。子包装被布置在第二主表面上并且包括嵌入其中的电子部件。厚度方向尺寸是从第二主表面到最远离第二主表面的子组件的一部分的距离的厚度方向尺寸不大于从第二主表面到第一主表面的边缘的距离的厚度方向尺寸在第二主表面处接合材料。

2. 发明申请

US20110300950A1 GAMING MACHINE 有权
标题翻译：游戏机
公开(公告)号：US20110300950A1
公开(公告)日：2011-12-08
申请号：US13150695
申请日：2011-06-01
申请人： Satoru NODA
发明人： Satoru NODA
IPC分类号： A63F13/08
CPC分类号： G07F17/3211 , G07F17/3216 , G07F17/34
摘要： The present invention provides a gaming machine which is capable of remarkably improving an effect given to a player. The gaming machine according to the present invention is provided with: a cabinet having a display portion for making a display according to the contents of a game played; a plurality of speakers 112A to 112D which are provided at their appropriate positions which are different from each other in height; and a control means for positionally changing a sound image of a sound that is outputted from a respective one of the speakers 112A to 112D, whereby a plurality of speakers 112A to 112D are provided at a top and a bottom of the gaming machine. A variety of effects exerted by means of sound can be provided in such a manner as if a position of a sound source were changed by positionally changing the sound image of the sound that is outputted from a respective one of these speakers 112A to 112D.
摘要翻译：本发明提供一种能够显着提高给玩家的效果的游戏机。根据本发明的游戏机设置有：具有根据所播放的游戏的内容进行显示的显示部的机壳; 多个扬声器112A〜112D设置在高度不同的适当位置; 以及用于对从扬声器112A至112D中的相应扬声器112D输出的声音的位置改变的控制装置，由此在游戏机的顶部和底部设置多个扬声器112A至112D。能够以通过位置改变从这些扬声器112A〜112D的各自的声音输出的声音的声音图像来改变声源的位置的方式来提供通过声音施加的各种效果。

3. 发明授权

US07929316B2 Composite electronic component 有权
标题翻译：复合电子元件
公开(公告)号：US07929316B2
公开(公告)日：2011-04-19
申请号：US12697451
申请日：2010-02-01
申请人： Satoru Noda , Jun Harada
发明人： Satoru Noda , Jun Harada
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H01L23/49822 , H01L23/5385 , H01L23/552 , H01L25/16 , H01L2224/16225 , H01L2924/09701 , H01L2924/19105 , H05K1/141 , H05K1/142 , H05K1/186 , H05K1/187 , H05K3/284 , H05K3/4694 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49165
摘要： A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
摘要翻译：复合电子部件包括具有多个绝缘层和布线图案的多层布线块和具有多个绝缘载体和布线图案的芯片型电子部件内置多层块，并且包括第一芯片型电子零件。多层布线块和芯片型电子元件内置多层块电气互连并布置在基本相同的平面上。

4. 发明授权

US08663006B2 Gaming machine having speakers outputting different sound at different positions and display generating display effect 有权
标题翻译：具有扬声器的扬声器在不同位置输出不同声音并显示产生显示效果
公开(公告)号：US08663006B2
公开(公告)日：2014-03-04
申请号：US13150695
申请日：2011-06-01
申请人： Satoru Noda
发明人： Satoru Noda
IPC分类号： A63F13/00
CPC分类号： G07F17/3211 , G07F17/3216 , G07F17/34
摘要： The present invention provides a gaming machine which is capable of remarkably improving an effect given to a player. The gaming machine according to the present invention is provided with: a cabinet having a display portion for making a display according to the contents of a game played; a plurality of speakers 112A to 112D which are provided at their appropriate positions which are different from each other in height; and a control means for positionally changing a sound image of a sound that is outputted from a respective one of the speakers 112A to 112D, whereby a plurality of speakers 112A to 112D are provided at a top and a bottom of the gaming machine. A variety of effects exerted by means of sound can be provided in such a manner as if a position of a sound source were changed by positionally changing the sound image of the sound that is outputted from a respective one of these speakers 112A to 112D.
摘要翻译：本发明提供一种能够显着提高给玩家的效果的游戏机。根据本发明的游戏机设置有：具有根据所播放的游戏的内容进行显示的显示部的机壳; 多个扬声器112A〜112D设置在高度不同的适当位置; 以及用于对从扬声器112A至112D中的相应扬声器112D输出的声音的位置改变的控制装置，由此在游戏机的顶部和底部设置多个扬声器112A至112D。能够以通过位置改变从这些扬声器112A〜112D的各自的声音输出的声音的声音图像来改变声源的位置的方式来提供通过声音施加的各种效果。

5. 发明授权

US07594316B2 Method of manufacturing composite electronic component 有权
标题翻译：复合电子元器件制造方法
公开(公告)号：US07594316B2
公开(公告)日：2009-09-29
申请号：US11691666
申请日：2007-03-27
申请人： Satoru Noda , Jun Harada
发明人： Satoru Noda , Jun Harada
IPC分类号： H05K3/36
CPC分类号： H01L23/49822 , H01L23/5385 , H01L23/552 , H01L25/16 , H01L2224/16225 , H01L2924/09701 , H01L2924/19105 , H05K1/141 , H05K1/142 , H05K1/186 , H05K1/187 , H05K3/284 , H05K3/4694 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49165
摘要： A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
摘要翻译：复合电子部件包括具有多个绝缘层和布线图案的多层布线块和具有多个绝缘载体和布线图案的芯片型电子部件内置多层块，并且包括第一芯片型电子零件。多层布线块和芯片型电子元件内置多层块电气互连并布置在基本相同的平面上。

6. 发明申请

US20080149381A1 METHOD FOR MANUFACTURING COMPONENT INCORPORATING MODULE AND COMPONENT INCORPORATING MODULE 有权
标题翻译：制造组件组件和组件组合模块的方法
公开(公告)号：US20080149381A1
公开(公告)日：2008-06-26
申请号：US12041730
申请日：2008-03-04
申请人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
发明人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/187 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/16238 , H01L2224/24195 , H01L2924/15192 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4644 , H05K2201/0715 , H05K2201/096 , H01L2924/00012
摘要： In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the transfer plate, and is hardened. The circuit components and the lands for mounting components are embedded in the upper resin layer. Thereafter, the transfer plate is removed from the resin layer, and wiring patterns which are used to connect between lands or connect lands to other portions are formed on a back surface of the resin layer on which the lands for mounting components are exposed.
摘要翻译：在用于制造组件组合模块的方法中，用于安装部件的焊盘独立地形成在转印板上，并且电路部件连接到用于安装部件的焊盘。形成绝缘树脂层，以覆盖转印板上的电路元件，并被硬化。电路部件和用于安装部件的焊盘嵌入在上树脂层中。此后，从树脂层除去转印板，并且在用于安装部件的焊盘露出的树脂层的背面上形成用于将焊盘或连接焊盘连接到其它部分的布线图案。

7. 发明授权

US07067173B2 Method for manufacturing laminated electronic component 失效
标题翻译：叠层电子元件的制造方法
公开(公告)号：US07067173B2
公开(公告)日：2006-06-27
申请号：US10848365
申请日：2004-05-19
申请人： Takeshi Miki , Satoru Noda
发明人： Takeshi Miki , Satoru Noda
IPC分类号： B05D5/12 , H01G7/00
CPC分类号： H01G4/2325 , C03C8/18 , H01B1/16 , Y10T29/43 , Y10T29/435
摘要： Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used as the internal conductor of a laminated ceramic electronic component. The conductive paste includes at least one of an Ag powder and an Ag alloy powder, a nickel boride powder, an inorganic binder and an organic vehicle, wherein the quantity of the nickel boride powder is within the range of about 5% by weight or more, but less than about 60% by weight of the total paste.
摘要翻译：本发明提供一种用于端子电极的Ag系导电膏，其抑制内部导体的Ni表面的氧化，因此即使在使用Ni作为内部导体的情况下，在大气中进行烧结时也能够实现优异的Ni接合的层压陶瓷电子部件。导电糊包括Ag粉末和Ag合金粉末，硼化镍粉末，无机粘合剂和有机载体中的至少一种，其中硼化镍粉末的量在约5重量％以上的范围内，但小于总糊料的约60重量％。

8. 发明授权

US07885081B2 Component incorporating module 有权
标题翻译：组件结合模块
公开(公告)号：US07885081B2
公开(公告)日：2011-02-08
申请号：US12041730
申请日：2008-03-04
申请人： Makoto Kawagishi , Tsutomu Ieki , Tadashi Kani , Satoru Noda
发明人： Makoto Kawagishi , Tsutomu Ieki , Tadashi Kani , Satoru Noda
IPC分类号： H05K1/18
CPC分类号： H05K1/187 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/16238 , H01L2224/24195 , H01L2924/15192 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4644 , H05K2201/0715 , H05K2201/096 , H01L2924/00012
摘要： A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.
摘要翻译：一种组件结合模块包括绝缘树脂层，多个焊盘，其布置成安装成与沿着树脂层的第一主表面布置的多个焊盘连接的部件和布线图案，以及连接到焊盘的电路部件，以安装组件。电路元件嵌入在树脂层中。多个焊盘的厚度大于与相应焊盘相邻的布线图案的厚度。

9. 发明申请

US20100232126A1 PACKAGE SUBSTRATE 有权
标题翻译：包装基板
公开(公告)号：US20100232126A1
公开(公告)日：2010-09-16
申请号：US12722607
申请日：2010-03-12
申请人： Atsuyoshi MAEDA , Shingo ITO , Satoru NODA
发明人： Atsuyoshi MAEDA , Shingo ITO , Satoru NODA
IPC分类号： H05K7/02
CPC分类号： H05K7/026 , H01G4/232 , H01G4/40 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5389 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15159 , H01L2924/15311 , H01L2924/19106 , H01L2224/05599 , H01L2224/05099
摘要： A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.
摘要翻译：封装基板包括：主封装主体，包括安装有IC的第一主表面;以及与第一主表面相对的第二主表面，在其上设置用于安装的第一粘合材料。内部电路设置在主包装体内并连接到第一接合材料。子包装被布置在第二主表面上并且包括嵌入其中的电子部件。厚度方向尺寸是从第二主表面到最远离第二主表面的子组件的一部分的距离的厚度方向尺寸不大于从第二主表面到第一主表面的边缘的距离的厚度方向尺寸在第二主表面处接合材料。

10. 发明申请

US20100134990A1 COMPOSITE ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：复合电子元件及其制造方法
公开(公告)号：US20100134990A1
公开(公告)日：2010-06-03
申请号：US12697451
申请日：2010-02-01
申请人： Satoru NODA , Jun HARADA
发明人： Satoru NODA , Jun HARADA
IPC分类号： H05K1/18
CPC分类号： H01L23/49822 , H01L23/5385 , H01L23/552 , H01L25/16 , H01L2224/16225 , H01L2924/09701 , H01L2924/19105 , H05K1/141 , H05K1/142 , H05K1/186 , H05K1/187 , H05K3/284 , H05K3/4694 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49165
摘要： A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
摘要翻译：复合电子部件包括具有多个绝缘层和布线图案的多层布线块和具有多个绝缘载体和布线图案的芯片型电子部件内置多层块，并且包括第一芯片型电子零件。多层布线块和芯片型电子元件内置多层块电气互连并布置在基本相同的平面上。

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