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1. 发明授权

US06360938B1 Process and apparatus to remove closely spaced chips on a multi-chip module 有权
公开(公告)号：US06360938B1
公开(公告)日：2002-03-26
申请号：US09794597
申请日：2001-02-27
申请人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
发明人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
IPC分类号： B23K1018
摘要： A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bi-metallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

2. 发明授权

US06333563B1 Electrical interconnection package and method thereof 有权
标题翻译：电互连封装及其方法
公开(公告)号：US06333563B1
公开(公告)日：2001-12-25
申请号：US09587944
申请日：2000-06-06
申请人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
发明人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
IPC分类号： H01L2940
CPC分类号： H05K1/141 , H01L23/49833 , H01L2224/16 , H01L2924/01322 , H01L2924/09701 , H01L2924/12044 , H01L2924/15311 , H05K3/284 , H05K3/3436 , H05K3/368 , H05K2201/049 , H05K2201/10734 , H05K2201/10977
摘要： The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
摘要翻译：本发明一般涉及电互连封装及其方法。更具体地，本发明包括增加球栅阵列（BGA）电互连的疲劳寿命的发明。本发明使用高模量底部填充材料将至少一个模块结构地耦合到有机插入件。然后使用标准连接工艺将有机插入物连接到有机基板。随后可以通过使用标准返工技术移动有机插入件，随时从有机板上移除本发明的模块。

3. 发明授权

US06497357B2 Apparatus and method for removing interconnections 失效
标题翻译：用于去除互连的装置和方法
公开(公告)号：US06497357B2
公开(公告)日：2002-12-24
申请号：US09850350
申请日：2001-05-07
申请人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
发明人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
IPC分类号： B23K120
CPC分类号： B08B1/008 , B08B7/0071 , H01L21/4864 , H05K3/3436 , H05K3/3457
摘要： A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level. An apparatus for removing at least one molten or solid structure from a substrate for rework, the apparatus comprising: a fixture for sustaining and biasing the substrate against a wiper assembly; the wiper assembly configured and positioned to slidably engage at least a portion of the substrate; a bias for translating the wiper assembly along a surface of the substrate having the at least one molten or solid structure to be removed; and a guide block assembly capable of guiding and locking the wiper assembly.
摘要翻译：一种用于从表面去除至少一种熔融或固体结构的方法，包括：将具有至少一种熔融或固体结构的表面放置在固定装置中; 将所述擦拭器组件布置成靠近所述至少一个熔融或固体结构的偏压; 将所述刮水器组件保持在具有等于或高于所述至少一个熔融或固体结构的第二熔点水平的第一温度点水平的装置的第一位置; 并将夹具的温度提高到第一温度点水平; 其中当所述装置达到所述第一温度点水平时，所述至少一个熔融或固体结构从所述表面擦拭。一种用于从基板去除至少一个熔融或固体结构以进行返修的装置，所述装置包括：固定装置，用于将所述基板保持并偏置在刮水器组件上; 所述擦拭器组件被构造和定位成可滑动地接合所述衬底的至少一部分; 用于沿着具有要移除的至少一个熔融或固体结构的衬底的表面平移擦拭器组件的偏压; 以及能够引导和锁定刮水器组件的导块组件。

4. 发明授权

US06216937B1 Process and apparatus to remove closely spaced chips on a multi-chip module 失效
标题翻译：在多芯片模块上去除紧密间隔的芯片的工艺和装置
公开(公告)号：US06216937B1
公开(公告)日：2001-04-17
申请号：US09470455
申请日：1999-12-22
申请人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
发明人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
IPC分类号： B23K100
CPC分类号： H01L21/687 , B23K1/018 , H01L24/98
摘要： A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bimetallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.
摘要翻译：一种用于通过在将模块加热到足以导致的温度的温度下向一个或多个倒装芯片的背面施加张力而将一个或多个去除构件施加拉力而移除通过安装在多芯片模块上的C4接头的倒装芯片的方法和装置 C4接头变得熔化。张力可以是压缩弹簧，也可以是在室温下平坦并在加热到这样的温度时变得弯曲的双金属构件，或者原始形状是弯曲的并且在室温下弯曲平坦但回到其中的记忆合金原来弯曲的形状加热到这样的温度。使用粘合剂将去除构件粘合到要去除的芯片上，并且是固化后具有耐高温性的低温快速固化粘合剂。

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